公开(公告)号：US20200210015A1

公开(公告)日：2020-07-02

申请号：US16237754

申请日：2019-01-02

Applicant: NOVATEK Microelectronics Corp.

Inventor： Huan-Teng Cheng ,  Huang-Chin Tang

IPC: G06F3/041 ,  G09G5/12

Abstract: A method of controlling timing for a touch and display driver system includes the steps of: receiving an external signal; generating a plurality of time units each having a display period and a touch period; generating an internal signal for controlling a display operation in the display period; and synchronizing the internal signal with the external signal for a time unit among the plurality of time units at a time point different from at least one of the start of the time unit and the end of the time unit.

公开(公告)号：US10699635B2

公开(公告)日：2020-06-30

申请号：US16045757

申请日：2018-07-26

Applicant: Novatek Microelectronics Corp.

Inventor： Ko-Fang Chen ,  Huang-Chin Tang

IPC: G09G3/3233

Abstract: A power management device including a power management circuit is provided. The power management circuit is configured to output a first power signal and a second power signal to a pixel circuit of a display panel. The pixel circuit includes an organic light-emitting diode. The organic light-emitting diode includes an anode terminal and a cathode terminal. The anode terminal is coupled to the first power signal. The cathode terminal is coupled to the second power signal. The second power signal is an alternating-current voltage. In addition, a pixel circuit of a display panel, and a power management method for the pixel circuit of the display panel are also provided.

公开(公告)号：US09960151B2

公开(公告)日：2018-05-01

申请号：US15226905

申请日：2016-08-02

Applicant: Novatek Microelectronics Corp.

Inventor： Chieh-Hsiang Chang ,  Wen-Ching Huang ,  Kuo-Yuan Lu ,  Huang-Chin Tang

IPC: G02F1/1345 ,  H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L23/552 ,  H01L23/373

CPC classification number: H01L25/167 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/373 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/552 ,  H01L23/562 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/1403 ,  H01L2224/16165

Abstract: A semiconductor device includes a chip, a plurality of first bumps, and a plurality of second bumps. The chip includes an active surface. The first bumps are disposed on the active surface along a first direction. The second bumps are disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, and a first width of one of the first bumps is larger than a second width of one of the second bumps.

公开(公告)号：US20180040596A1

公开(公告)日：2018-02-08

申请号：US15226905

申请日：2016-08-02

Applicant: Novatek Microelectronics Corp.

Inventor： Chieh-Hsiang Chang ,  Wen-Ching Huang ,  Kuo-Yuan Lu ,  Huang-Chin Tang

IPC: H01L25/16 ,  H01L23/373 ,  H01L23/552 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/167 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/373 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/552 ,  H01L23/562 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/1403 ,  H01L2224/16165

Abstract: A semiconductor device includes a chip, a plurality of first bumps, and a plurality of second bumps. The chip includes an active surface. The first bumps are disposed on the active surface along a first direction. The second bumps are disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, and a first width of one of the first bumps is larger than a second width of one of the second bumps.