-
61.发明授权公开(公告)号：US08189019B2
公开(公告)日：2012-05-29
申请号：US12613887
申请日：2009-11-06
IPC分类号： B41J2/335
CPC分类号： B41J2/33525 , B41J2/33585
摘要： To improve printing quality and reduce manufacturing cost, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity portion (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The adhesive layer (12) includes a first adhesive layer (12a) laminated on the surface of the supporting substrate (11) and a second adhesive layer (12b) laminated on a surface of the heat storage layer (13). The elastic material constituting the second adhesive layer (12b) is arranged so that the elastic material is in a bonded state with respect to at least a part of the surface of the heat storage layer (13) opposed to the cavity portion (19).
摘要翻译： 为了提高打印质量并降低制造成本，多个加热电阻器（14）通过经由粘合剂层（12）层叠在支撑基板（11）的表面上的储热层（13）上布置有空隙， 弹性材料。 在支撑基板（11）和蓄热层（13）之间的区域形成有空腔部分（19），该区域与多个加热电阻器（14）中的每一个的发热部分相对。 粘合剂层（12）包括层叠在支撑基板（11）的表面上的第一粘合层（12a）和层叠在蓄热层（13）的表面上的第二粘接层（12b）。 构成第二粘合层（12b）的弹性材料被布置成使得弹性材料相对于与空腔部分（19）相对的储热层（13）的表面的至少一部分处于接合状态。
-
公开(公告)号：US08169452B2
公开(公告)日：2012-05-01
申请号：US12586990
申请日：2009-09-30
IPC分类号： B41J2/335
CPC分类号： B41J2/33535 , B41J2/3355 , B41J2/33585 , B41J25/312
摘要： A thermal head has a heat storage layer bonded onto a surface of the substrate, a heating resistor provided on the heat storage layer, and a pair of electrode portions connected to the heating resistor. The heating resistor has a heating portion which does not overlap the pair of electrode portions. A hollow portion is provided in a region of at least one of the surface of the substrate and a surface of the heat storage layer, the region being opposed to the heating resistor. A center line of the hollow portion is shifted with respect to a center line of a heating portion of the heating resistor.
摘要翻译： 热敏头具有结合到基板的表面上的储热层，设置在储热层上的加热电阻器和连接到加热电阻器的一对电极部分。 加热电阻器具有不与一对电极部分重叠的加热部分。 在基板的表面和蓄热层的表面中的至少一个的区域中设置有中空部，该区域与加热电阻体相对。 中空部分的中心线相对于加热电阻器的加热部分的中心线移动。
-
公开(公告)号：US20110074907A1
公开(公告)日：2011-03-31
申请号：US12586989
申请日：2009-09-30
CPC分类号： B41J2/3355 , B41J2/33585 , Y10T29/49083
摘要： To achieve improvements in heating efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3) having a surface in which a concave portion (2) is formed; a heat storage layer (5) bonded onto the surface of the supporting substrate (3); a heating resistor provided in a region, which is opposed to the concave portion (2) of the supporting substrate (3), on the heat storage layer (5); and a protruding portion (2A), which is provided inside a hollow portion formed between the supporting substrate (3) and the heat storage layer (5) by the concave portion (2), and comes into contact with the heat storage layer (5) and limits deflection of the heat storage layer (5) when the heating resistor is pressurized by predetermined load or more.
摘要翻译： 为了实现对外部负载的加热效率和强度的提高，提供了一种热敏头（1），包括：支撑基板（3），其具有形成有凹部（2）的表面; 结合到所述支撑基板（3）的表面上的储热层（5）; 设置在与所述支撑基板（3）的凹部（2）相对的区域中的加热电阻器，位于所述储热层（5）上。 以及设置在由所述凹部（2）形成在所述支撑基板（3）和所述蓄热层（5）之间的中空部内的与所述蓄热层（5）接触的突出部（2A） ），并且当加热电阻器被加压预定负载或更多时限制储热层（5）的偏转。
-
公开(公告)号：US20100122979A1
公开(公告)日：2010-05-20
申请号：US12589594
申请日：2009-10-26
IPC分类号： H05B3/02
CPC分类号： B41J2/3359 , B41J2/33575 , Y10T29/49083
摘要： To improve heating efficiency and printing quality, a heating resistor element component (4) includes a plurality of heating resistors (14) arranged with intervals on a heat storage layer (13) laminated on a supporting substrate (11) through an intermediation of an adhesive layer (12), in which: the adhesive layer (12) includes an adhesive (12a) for bonding one surface of the supporting substrate (11) and another surface of the heat storage layer (13), and a plurality of gap members (12b) kneaded in the adhesive (12a), for keeping a distance between the one surface of the supporting substrate (11) and the another surface of the heat storage layer (13) constant; and a cavity portion (19) is formed in a region of the adhesive layer (12), the region being opposed to a heating portion of the heating resistor (14).
摘要翻译： 为了提高加热效率和印刷质量，加热电阻元件部件（4）包括多个加热电阻器（14），其间隔层叠在支撑基板（11）上的热存储层（13）上，通过粘合剂 层（12），其中：粘合层（12）包括用于将支撑基板（11）的一个表面和储热层（13）的另一表面接合的粘合剂（12a）和多个间隙构件 12b），用于保持支撑基板（11）的一个表面和储热层（13）的另一个表面之间的距离恒定; 并且在所述粘合剂层（12）的区域中形成空腔部分（19），所述区域与所述加热电阻器（14）的加热部分相对。
-
公开(公告)号：US20090262176A1
公开(公告)日：2009-10-22
申请号：US12286873
申请日：2008-10-02
IPC分类号： B41J2/335
CPC分类号： B41J2/3351 , B41J2/33515 , B41J2/3353 , B41J2/3355 , B41J2/33585
摘要： Provided is a heating resistance element component, including: a supporting substrate; an insulating film laminated on the supporting substrate; a plurality of heating resistors formed on the insulating film, the plurality of heating resistors being arranged in a zigzag shape along a main scanning direction and having a substantially square shape; a common wire connected to one end of each of the plurality of heating resistors; individual wires each connected to another end of the each of the plurality of heating resistors; and concave portions formed in regions which are opposed to the plurality of heating resistors and are located on a surface of the supporting substrate, in which an arrangement pitch of the plurality of heating resistors in a sub-scanning direction is larger than an arrangement pitch of the plurality of heating resistors in a main scanning direction.
摘要翻译： 提供一种耐热元件部件，包括：支撑基板; 层叠在所述支撑基板上的绝缘膜; 形成在所述绝缘膜上的多个加热电阻体，所述多个加热电阻体沿着主扫描方向以锯齿形状排列并具有大致正方形的形状; 连接到所述多个加热电阻器中的每一个的一端的公共线; 各个电线各自连接到多个加热电阻器中的每一个的另一端; 以及凹部，形成在与所述多个加热电阻体相对的并且位于所述支撑基板的表面上的区域中，所述多个加热电阻器在副扫描方向上的排列间距大于所述支撑基板的排列间距 多个加热电阻器在主扫描方向上。
-
66.发明授权公开(公告)号：US08477166B2
公开(公告)日：2013-07-02
申请号：US13136005
申请日：2011-07-20
IPC分类号： B41J2/335
CPC分类号： B41J2/33585 , B41J2/3351 , B41J2/3354 , Y10T29/49002
摘要： A thermal head comprises a first substrate having a concave portion, a second substrate mounted on the first substrate and covering the concave portion to form with the first substrate a cavity portion, a heating resistor provided on a surface of the second substrate, and a pair of electrodes connected to the heating resistor for supplying power to the heating resistor. At least one of the pair of electrodes has a low thermal conductivity portion in a region opposed to the cavity portion. The low thermal conductivity portion is made of a material having a thermal conductivity lower than a thermal conductivity in other regions of the pair of electrodes and having an electrical resistance lower than an electrical resistance of the heating resistor.
摘要翻译： 热敏头包括具有凹部的第一基板，安装在第一基板上并覆盖凹部以与第一基板形成空腔部分的第二基板，设置在第二基板的表面上的加热电阻器和一对 的电极连接到加热电阻器，用于向加热电阻器供电。 所述一对电极中的至少一个在与空腔部分相对的区域中具有低热传导率部分。 低导热部分由在一对电极的其它区域中的导热率低于导热率的材料制成，并且具有低于加热电阻器的电阻的电阻。
-
公开(公告)号：US08372296B2
公开(公告)日：2013-02-12
申请号：US12804954
申请日：2010-08-03
IPC分类号： H01L21/302 , B41J2/345
CPC分类号： B41J2/3359 , Y10T29/49083
摘要： Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)). Thus, a high-efficiency thermal head capable of accurately outputting a target heating amount obtained by estimating an amount of heat wasted without being used is easily manufactured without using a special apparatus.
摘要翻译： 本发明提供一种热敏头的制造方法，其特征在于，包括：将层叠状态的平坦的上部基板接合在具有向其一个表面开口的绝热凹部的平坦的支撑基板上，使得所述绝热凹部闭合（接合 步骤（SA2））; 通过接合步骤（SA2）（板薄化步骤（SA3））使结合到支撑衬底上的上衬底变薄; 测量通过板薄化步骤（SA3）变薄的上基板的厚度（测量步骤（SA4））; 基于通过测量步骤（SA4）测量的上基板的厚度（判定步骤（SA5）），确定加热电阻器的目标电阻值; 在由所述薄板稀化工序（SA3）变薄的所述上基板的表面的位置处，形成由所述判定工序（SA5）决定的所述目标电阻值的所述加热电阻体，与所述绝热凹部 （电阻形成工序（SA6））。 因此，在不使用特殊装置的情况下，容易制造能够精确地输出通过估计不使用而浪费的热量而获得的目标加热量的高效热头。
-
公开(公告)号：US08289354B2
公开(公告)日：2012-10-16
申请号：US12807854
申请日：2010-09-15
IPC分类号： B41J2/335
CPC分类号： B41J2/3355 , B41J2/33585
摘要： Provided are a thermal head that has a cavity portion at a position corresponding to heating resistors and is capable of improving thermal efficiency while ensuring strength of the cavity portion, and a printer including the thermal head. The thermal head (1) includes: a supporting substrate (3) including a concave portion (2) in a surface thereof; an upper substrate (5) bonded in a stacked state to the surface of the supporting substrate (3); and a heating resistor (7) provided at a position, which corresponds to the concave portion (2), of a surface of the upper substrate (5), in which a centerline average roughness of at least a region of a back surface of the upper substrate (5) is set to be less than 5 nm, the region being opposed to the concave portion (2).
摘要翻译： 提供一种热敏头，其在对应于加热电阻器的位置处具有空腔部分，并且能够在确保空腔部分的强度的同时提高热效率，以及包括热敏头的打印机。 热敏头（1）包括：在其表面包括凹部（2）的支撑基板（3） 将上层基板（5）以堆叠状态接合到所述支撑基板（3）的表面; 以及设置在上基板（5）的表面的与凹部（2）对应的位置处的加热电阻器（7），其中，所述上基板（5）的背面的至少一个区域的中心线平均粗糙度 上基板（5）被设定为小于5nm，该区域与凹部（2）相对。
-
公开(公告)号：US20120073123A1
公开(公告)日：2012-03-29
申请号：US13200251
申请日：2011-09-21
IPC分类号： H01C17/00
CPC分类号： H01C17/065 , B41J2/335 , B41J2/33585 , B41J2/3359 , Y10T29/49082
摘要： A method of manufacturing a thermal head, comprising: forming a concave portion opened in one surface of a support substrate and an upper substrate to be disposed on the support substrate in a stacked state, the support substrate and the upper substrate each being of a plate shape; a step of measuring a width dimension of the concave portion formed in the concave portion forming step; bonding the support substrate and the upper substrate to each other in the stacked state so as to close an opening of the concave portion; thinning the upper substrate bonded onto the support substrate in the bonding, to a thickness set based on the width dimension of the concave portion measured in the measuring; and forming a heating resistor on a surface of the thinned upper substrate in a region opposed to the concave portion.
摘要翻译： 一种热敏头的制造方法，其特征在于，包括：在层叠状态下形成在支撑基板的一个面上开口的凹部和设置在所述支撑基板上的上基板，所述支撑基板和所述上基板各自为板 形状; 测量形成在凹部形成步骤中的凹部的宽度尺寸的步骤; 将支撑基板和上基板以堆叠状态彼此接合，以封闭凹部的开口; 在接合时将粘合到支撑基板上的上基板细化为基于在测量中测量的凹部的宽度尺寸设定的厚度; 以及在与所述凹部相对的区域中在所述变薄的上基板的表面上形成发热电阻体。
-
公开(公告)号：US20120073122A1
公开(公告)日：2012-03-29
申请号：US13200250
申请日：2011-09-21
IPC分类号： H01C17/00
CPC分类号： H01C17/065 , B41J2/335 , B41J2/33585 , B41J2/3359
摘要： A method of manufacturing a thermal head, comprising: forming a concave portion opened in one surface of at least one of a support substrate and an upper substrate to be disposed on the support substrate in a stacked state, the support substrate and the upper substrate each being of a plate shape; measuring a width dimension of the concave portion; bonding the support substrate and the upper substrate to each other in the stacked state so as to close an opening of the concave portion; forming a heating resistor on a surface of the upper substrate bonded onto the support substrate, in a region opposed to the concave portion; and forming a protective film for covering and protecting the heating resistor on the upper substrate, at a thickness which is set based on the width dimension of the concave portion and a thickness dimension of the upper substrate.
摘要翻译： 一种热敏头的制造方法，其特征在于，包括：在层叠状态下形成在支撑基板上设置在支撑基板和上基板中的至少一个的一个面的开口部的凹部，所述支撑基板和所述上基板各自 是板状; 测量凹部的宽度尺寸; 将支撑基板和上基板以堆叠状态彼此接合，以封闭凹部的开口; 在与所述凹部对置的区域中，在所述上基板的与所述支撑基板接合的表面上形成发热电阻体; 并且形成用于覆盖和保护上基板上的加热电阻器的保护膜，其厚度基于凹部的宽度尺寸和上基板的厚度尺寸设定。
-
-
-
-
-
-
-
-
-
搜索结果
103 条记录 (耗时 0.029 秒)
