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公开(公告)号：US09263179B2
公开(公告)日：2016-02-16
申请号：US13831315
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Won Chul Sim , Young Seuck Yoo , Sung Kwon Wi
CPC classification number: H01F27/292 , H01F17/0013 , H01F2017/0066 , H01F2017/0093 , Y10T29/4902
Abstract: Disclosed herein are a common mode filter capable of implementing high inductance without deterioration of a moisture resistance load, and a method of manufacturing the same. The common mode filter includes: a magnetic substrate; an insulating layer disposed on the magnetic substrate; and a coil electrode layer disposed in the insulating layer, wherein the magnetic substrate has a groove part formed at an edge of an upper surface thereof, and a material of the insulating layer is filled into the groove part.
Abstract translation: 这里公开了能够实现高电感而不降低耐湿负荷的共模滤波器及其制造方法。 共模滤波器包括：磁性基板; 设置在所述磁性基板上的绝缘层; 以及设置在所述绝缘层中的线圈电极层，其中所述磁性基板具有形成在其上表面的边缘处的凹槽部分，并且所述绝缘层的材料填充到所述凹槽部分中。
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公开(公告)号：US09160297B2
公开(公告)日：2015-10-13
申请号：US14255376
申请日：2014-04-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Won Chul Sim , Chan Yoon , Young Seuck Yoo , Sung Kwon Wi
IPC: H03H7/42
CPC classification number: H03H7/427
Abstract: Disclosed herein is a common mode filter having improved insertion loss characteristics. The common mode filter includes: first and second coil electrode patterns formed at an upper layer and alternately disposed; and first and second coil electrode patterns formed at a lower layer and alternately disposed, wherein the outermost pattern of the upper layer and the outermost pattern of the lower layer are coil electrode patterns having the same order.
Abstract translation: 这里公开了具有改进的插入损耗特性的共模滤波器。 共模滤波器包括：形成在上层并交替布置的第一和第二线圈电极图案; 以及第一和第二线圈电极图案，其形成在下层并交替布置，其中上层的最外图案和下层的最外图案是具有相同次序的线圈电极图案。
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公开(公告)号：US12136523B2
公开(公告)日：2024-11-05
申请号：US17973727
申请日：2022-10-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hwi Dae Kim , Ji Hong Jo , Woo Chul Shin , Chan Yoon , Sang Soo Park
Abstract: A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016≤A/B
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公开(公告)号：US12112879B2
公开(公告)日：2024-10-08
申请号：US17116094
申请日：2020-12-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Dong Jin Lee , Sang Soo Park
CPC classification number: H01F27/2804 , H01F27/29 , H01F41/041 , H01F2027/2809
Abstract: A coil component includes a body, a coil portion disposed in the body, and first and second external electrodes disposed on the body to be spaced apart from each other, wherein A/C≥2.4 and B/C≥1.6 are satisfied, where a length, a width, and a thickness of the coil component are defined as ‘A’, ‘B’, and ‘C’, respectively, and a ratio of a thickness to a width of at least one turn of the coil portion is 1 or less, based on a cross-section of the coil component.
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公开(公告)号：US11756724B2
公开(公告)日：2023-09-12
申请号：US16586537
申请日：2019-09-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Dong Jin Lee , Young Ghyu Ahn
CPC classification number: H01F27/327 , H01F27/2804 , H01F27/292 , H01F41/10 , H01F2027/2809
Abstract: A coil electronic component includes a support substrate; first and second coil patterns disposed on an upper surface and a lower surface of the support substrate, respectively; an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant, wherein at least one portion of a lower surface of the first coil pattern is exposed from the encapsulant, at least one portion of a lower surface of the second coil pattern is exposed from the encapsulant, and the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern.
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Patent Agency Ranking
公开(公告)号：US11728089B2
公开(公告)日：2023-08-15
申请号：US16984586
申请日：2020-08-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin Lee , Dong Hwan Lee , Chan Yoon , Sang Soo Park , Hye Mi Yoo , Hwi Dae Kim
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/324 , H01F2017/048
Abstract: A coil component includes a body; a wound coil disposed in the body, and having a plurality of turns and first and second lead-out portions exposed to the surfaces of the body; a noise removing portion spaced apart from the wound coil, and including a pattern portion having a first end portion and a second end portion spaced apart from each other and forming an open loop, and a third lead-out portion connected to the pattern portion and exposed to one surface of the body; an insulating layer disposed between the wound coil and the noise removing portion; and first to third external electrodes disposed on the surfaces of the body, spaced apart from one another, and connected to the first to third lead-out portions, respectively, wherein one of the plurality of turns of the wound coil has a line width greater than a thickness thereof.
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公开(公告)号：US20230061474A1
公开(公告)日：2023-03-02
申请号：US17973727
申请日：2022-10-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hwi Dae Kim , Ji Hong Jo , Woo Chul Shin , Chan Yoon , Sang Soo Park
Abstract: A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016≤A/B
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公开(公告)号：US11373794B2
公开(公告)日：2022-06-28
申请号：US16285742
申请日：2019-02-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Dong Jin Lee , Young Ghyu Ahn
Abstract: A coil electronic component includes first and second coil portions magnetically coupled to each other, an intermediate layer disposed between the first and second coil portions and including first magnetic particles, and an encapsulant encapsulating the first and second coil portions and including second magnetic particles. The intermediate layer and the encapsulant have permeabilities different from each other.
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公开(公告)号：US11295890B2
公开(公告)日：2022-04-05
申请号：US16533058
申请日：2019-08-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin Lee , Dong Hwan Lee , Young Ghyu Ahn , Chan Yoon , Won Chul Sim
Abstract: A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.
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公开(公告)号：US20210398740A1
公开(公告)日：2021-12-23
申请号：US17229930
申请日：2021-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Hwan Lee , Dong Jin Lee , Chan Yoon , Young Ghyu Ahn
Abstract: A coil component includes a body having end surfaces opposing each other and side surfaces connecting the end surfaces and opposing each other, a support substrate disposed within the body and having a first surface and a second surface opposing each other, first and second coil units disposed on the first surface and the second surface of the support substrate, respectively, and each including a plurality of turns, and lead portions connected to the first and second coil units and exposed to a first end surface and a second end surface of the body, respectively. A shortest distance from an outermost turn of the first coil unit to the second end surface of the body is greater than a shortest distance from the outermost turn of the first coil unit to a first side surface of the body.
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