Semiconductor package including dam structure surrounding semiconductor chip and method of manufacturing the same

    公开(公告)号:US11289454B2

    公开(公告)日:2022-03-29

    申请号:US16886141

    申请日:2020-05-28

    发明人: Minsoo Kim

    摘要: A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a dam structure on the base substrate and surrounding the first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a non-conductive film, and a molding member. The non-conductive film may be between the base substrate, the first semiconductor chip, and the second semiconductor chip. The molding member may cover the base substrate, the first semiconductor chip, and the second semiconductor chip. A level of an upper surface of the first semiconductor chip and a level of an upper surface of the dam structure may be at a same level.

    Foldable electronic device
    63.
    发明授权

    公开(公告)号:US11132020B2

    公开(公告)日:2021-09-28

    申请号:US16850240

    申请日:2020-04-16

    IPC分类号: G06F1/16

    摘要: Disclosed is a foldable electronic device including a flexible display, a sensor panel, a sensor circuitry, a first housing, a second housing, and a folding structure configured to rotate the first housing or the second housing. The sensor panel includes a plurality of loop coils. The sensor circuitry transmits or receives a first resonance signal to recognize an operation of an electronic pen through the plurality of loop coils, outputs a second resonance signal through a first loop coil included in one panel part of the first panel part or the second panel part, receives the second resonance signal through a second loop coil included in a remaining one panel part of the first panel part or the second panel part, and determines an angle between the first housing and the second housing, based on the received second resonance signal.

    Ice maker
    64.
    发明授权

    公开(公告)号:US10969152B2

    公开(公告)日:2021-04-06

    申请号:US16245891

    申请日:2019-01-11

    摘要: Disclosed are an ice maker, which can make ice with high transparency. The ice maker includes an ice making container configured to be filled with ice-making water; a heating ice-separator comprising a heating rod extended from above a water surface of the ice-making water into the ice making container so as to be immersed in the ice-making water and configured to transfer heat to the ice-making water, and a rotary shaft connecting with the heating rod, extended to traverse an upper portion of the ice making container, and configured to rotate the heating rod to be separated from the ice making container; and a heater configured to supply heat to the heating rod. By using the heater, the ice maker can not only make the ice with the high transparency, but also make ice-separation structure be simplified.

    Electronic apparatus including FPCB structure

    公开(公告)号:US12041195B2

    公开(公告)日:2024-07-16

    申请号:US17665271

    申请日:2022-02-04

    发明人: Minsoo Kim Jiwoo Lee

    摘要: An electronic apparatus includes a housing; a first structure disposed inside the housing and includes a first surface; a second structure including a second surface facing the one surface of the housing; and a flexible printed circuit board (FPCB) structure disposed inside the housing. The FPCB structure includes: an FPCB including at least one coil; a thermally conductive first layer, including a first portion partially overlapping the FPCB and disposed between the FPCB and the second surface, and a second portion extending from the first portion and partially overlapping the first surface; a second layer having a higher elasticity and tensile strength than the first layer and includes a third portion at least partially overlapping the second portion, and a fourth portion extending from the third portion and at least partially overlapping the first portion; and a third layer disposed between the third portion and the first surface.

    Electronic device including haptic actuator

    公开(公告)号:US11907024B2

    公开(公告)日:2024-02-20

    申请号:US17973014

    申请日:2022-10-25

    IPC分类号: G06F1/16 G06F3/01

    摘要: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.