公开(公告)号：USD950499S1

公开(公告)日：2022-05-03

申请号：US29652014

申请日：2018-12-17

Applicant: Samtec, Inc.

Designer： Randall E. Musser ,  Jonathan E. Buck

公开(公告)号：USD949798S1

公开(公告)日：2022-04-26

申请号：US29716202

申请日：2019-12-06

Applicant: Samtec, Inc.

Designer： Randall E. Musser ,  Jonathan E. Buck

公开(公告)号：USD926144S1

公开(公告)日：2021-07-27

申请号：US29773722

申请日：2021-03-11

Applicant: Samtec, Inc.

Designer： Randall E. Musser ,  Jonathan E. Buck

公开(公告)号：US20200373696A1

公开(公告)日：2020-11-26

申请号：US16988923

申请日：2020-08-10

Applicant: Samtec, Inc.

Inventor： Jonathan E. Buck

IPC: H01R12/73 ,  H01R12/71 ,  H01R12/72 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6585

Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.

公开(公告)号：US10784608B2

公开(公告)日：2020-09-22

申请号：US16614048

申请日：2018-05-15

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck

IPC: H01R12/73 ,  H01R12/71 ,  H01R12/72 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6585 ,  H05K1/02 ,  H05K1/11

Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.