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    CLOTHES CARE APPARATUS AND CONTROL METHOD THEREFOR
    61.
    发明公开
    CLOTHES CARE APPARATUS AND CONTROL METHOD THEREFOR 审中-公开

    公开(公告)号：US20240068147A1

    公开(公告)日：2024-02-29

    申请号：US18226980

    申请日：2023-07-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joongwon NA ,  Minsoo KIM ,  Kookjeong SEO

    IPC: D06F34/26 ,  D06F58/10 ,  D06F58/20 ,  D06F58/24 ,  D06F58/26

    CPC classification number: D06F34/26 ,  D06F58/10 ,  D06F58/206 ,  D06F58/24 ,  D06F58/26 ,  D06F2105/62

    Abstract: A clothes care apparatus including an accommodating chamber to accommodate a target; a heat pump apparatus to dehumidify and heat air circulating through the accommodating chamber, the heat pump apparatus including a refrigerant pipe through which a refrigerant circulates and at least one of a compressor, a condenser, an expansion apparatus, or an evaporator; and a condensed water collecting apparatus configured to collect condensed water generated from the heat pump apparatus, and having a storage space in which the collected condensed water is stored, wherein a portion of the refrigerant pipe passes through the storage space so that, in an operating course for taking care of the target, the refrigerant circulating through the refrigerant pipe passes through the portion of the refrigerant pipe while in a high temperature state, to evaporate the condensed water stored in the storage space.

    SEMICONDUCTOR PACKAGE
    63.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20230121888A1

    公开(公告)日：2023-04-20

    申请号：US17884695

    申请日：2022-08-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Minsoo KIM ,  Jiho KIM ,  Unbyoung KANG ,  Sangsick PARK ,  Teakhoon LEE

    IPC: H01L25/065 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00

    Abstract: A semiconductor package includes a first semiconductor chip including upper signal pads and upper dummy pads. A second semiconductor chip is on the first semiconductor chip, and includes lower signal pads and lower dummy pads. First conductive bumps are between the upper signal pads and the lower signal pads. Second conductive bumps are between the upper dummy pads and the lower dummy pads. The upper dummy pads include merged pads covering a plurality of adjacent lower dummy pads. A plurality of metal plating layers are disposed on each of the merged pads in areas respectively corresponding to the plurality of adjacent lower dummy pads. The second conductive bumps include a plurality of conductive bumps respectively disposed between the plurality of first metal plating layers and the plurality of adjacent lower dummy pads.

    ELECTRONIC DEVICE INCLUDING FLEXIBLE DISPLAY
    68.
    发明申请
    ELECTRONIC DEVICE INCLUDING FLEXIBLE DISPLAY 有权

    公开(公告)号：US20220334615A1

    公开(公告)日：2022-10-20

    申请号：US17527443

    申请日：2021-11-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minsoo KIM ,  Myunghoon KWAK ,  Yeonggyu YOON ,  Yangwook KIM ,  Hyunju HONG

    IPC: G06F1/16

    Abstract: An electronic device is provided. The electronic device includes a first housing, a second housing coupled to an edge of the first housing and configured to rotate about a folding axis extending in a first direction, a third housing coupled to the first housing and disposed to be slidable toward or away from the folding axis, and a flexible display including a first area disposed on the third housing and a second area extending from the first area and disposed through the first housing to the second housing. As the third housing slides, the second area may slide on the first housing or the second housing, and a portion of the second area may be selectively received in the second housing.

    ELECTRONIC DEVICE INCLUDING A PLURALITY OF DISPLAYS AND METHOD FOR OPERATING SAME
    69.
    发明申请
    ELECTRONIC DEVICE INCLUDING A PLURALITY OF DISPLAYS AND METHOD FOR OPERATING SAME 有权

    公开(公告)号：US20220311846A1

    公开(公告)日：2022-09-29

    申请号：US17311223

    申请日：2021-06-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Myunghoon KWAK ,  Minsoo KIM ,  Joungmin CHO ,  Sanghyuk PARK ,  Kibeom KIM ,  Teayoung KIM ,  Hyunggwang KANG ,  Yangwook KIM ,  Hyunju HONG

    IPC: H04M1/02 ,  H04M1/72469

    Abstract: According to various embodiments, the electronic device includes a housing; a first display configured to be slidable through the housing, wherein a portion of the first display is exposed to an outside through the housing, and wherein a region of the first display, exposed to the outside, is capable of being changed based on sliding of the first display through the housing; a second display spaced a certain distance apart from the exposed portion of the first display and disposed to form a flat surface with the exposed portion of the first display; and an optical member positioned on a portion of the second housing associated with the exposed at least part of the first display; at least one processor disposed in the housing, wherein the at least one processor is configured to: output a light through a first portion of the first display associated with the optical member, wherein the light is diffused through the optical member. Various other embodiments are possible.

    PEN INPUT DEVICE WITH BATTERY AND OPERATING METHOD THEREOF
    70.
    发明申请
    PEN INPUT DEVICE WITH BATTERY AND OPERATING METHOD THEREOF 有权

    公开(公告)号：US20220197410A1

    公开(公告)日：2022-06-23

    申请号：US16978915

    申请日：2020-08-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongwoo KIM ,  Minsoo KIM ,  Siho KIM ,  Jiwoo LEE

    IPC: G06F3/0354 ,  G06F3/038 ,  H05K5/00 ,  H05K1/18 ,  H02J7/00

    Abstract: A pen input device is provided, including a housing including a front opening and a rear opening; a pen input generator including a pen tip disposed in the front opening, the pen input generator generating a position signal and a pen pressure signal of the pen input device; a battery; a PCB; a support on which at least a part of the pen input generator, the battery, and the PCB are disposed; a conductive member electrically connecting the PCB and the battery; a buffer disposed in the rear opening; and a polymer that fills in an inner space of the housing. The support includes a support plate extended in a direction toward the rear opening from the front opening of the housing, and a first partition, a second partition, and a third partition, which protrude from the support plate and are sequentially spaced.

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