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公开(公告)号:US20080130228A1
公开(公告)日:2008-06-05
申请号:US11566025
申请日:2006-12-01
申请人: Shi-Wen Zhou , Guo Chen , Peng Liu , Chun-Chi Chen
发明人: Shi-Wen Zhou , Guo Chen , Peng Liu , Chun-Chi Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/467 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.
摘要翻译: 散热装置包括用于接触发热部件的散热器(10)和安装在散热器上的风扇(20)。 风扇包括框架(22)和接收在框架中的电动机(24)。 风扇有摄入量。 框架具有顶层和底层。 风扇产生气流并流过散热器。 防回流板(30)安装在风扇的顶部和底部水平面之间。 防回流板向外延伸超过散热器的末端,以防止流过散热器的气流进入风扇的入口。
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公开(公告)号:US20080128111A1
公开(公告)日:2008-06-05
申请号:US11566003
申请日:2006-12-01
申请人: Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
发明人: Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
摘要翻译: 一种散热装置,包括底座(10),多个翅片(20),第一和第二热管(30),(40),风扇架(50)和固定到风扇架的风扇(60)。 第一热管包括受热部(32)和两个散热部(34)。 第二热管包括蒸发部分(42)和两个冷凝部分(44)。 第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。 一个放热部分在翅片中延伸并且设置在冷凝部分之间,从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。
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公开(公告)号:US07365978B2
公开(公告)日:2008-04-29
申请号:US11135593
申请日:2005-05-23
申请人: Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人: Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
摘要翻译: 散热装置包括散热器(60),散热器(70)和传热管(80)。 散热器包括底盘(62),与底盘分离的板(64)和在底盘和板之间延伸的多个翅片(66)。 散热器包括平行于翅片的基座(72)。 每个传热管包括热定位到底盘的热吸收部分(82),热定位于板的散热部分(84)和设置在吸热部分和 散热部。 热传递部分被热接收在散热器的基座中。
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公开(公告)号:US20080084670A1
公开(公告)日:2008-04-10
申请号:US11309839
申请日:2006-10-10
申请人: Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人: Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/4093 , H01L2224/16 , Y10T24/44427 , Y10T24/4447
摘要: A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.
摘要翻译: 夹具包括具有相对的第一和第二腿部的主体,可移动紧固件,致动构件和滑动轴。 可移动紧固件具有限定在其中的保持孔,用于与保持模块和保持孔上方的细长狭槽接合。 致动构件包括弯曲槽,并且经由枢轴枢转地联接到可动紧固件。 滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起,并且滑动轴具有插入致动构件的弯曲槽中的一个部分。 当致动构件围绕枢轴旋转时,可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。
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公开(公告)号:US07345879B2
公开(公告)日:2008-03-18
申请号:US11308847
申请日:2006-05-15
申请人: Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
发明人: Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
IPC分类号: H05K7/20
CPC分类号: H01L23/467 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.
摘要翻译: 散热装置包括与中央处理单元接触的主散热器(10)和附接在与中央处理单元相邻的发热电子元件上的二次散热器(20)。 主散热器包括设置在基座中间的基座(12)和散热部分(14)。 二次散热器包括基板(22)和布置在基板上的多个翅片组件(24)。 底座被放置在基板上,翅片组件布置在散热部分周围。 主散热器部分地叠置在具有紧凑结构的二次散热器上。 散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。
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公开(公告)号:US07342795B2
公开(公告)日:2008-03-11
申请号:US11244916
申请日:2005-10-05
申请人: Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人: Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
CPC分类号: H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要: A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
摘要翻译: 散热器组件包括散热器(10),从扩展器延伸的多个散热片(12),紧固件(20)和固定到紧固件的固定套管(30)。 紧固件包括具有螺纹底端(208)的头部(200)和轴(204)。 套筒包括圆柱形壁(302),上开口端(304)和下开口端(306)。 套筒还具有与壁垂直连接并在下开口端延伸的环形基座(308)。 头部被接收在墙壁上并接触基座。 轴延伸穿过吊具。 压头弹簧(22)在头部和吊具之间提供,用于向下推动吊具以与发热电子装置接合。
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公开(公告)号:US20080010788A1
公开(公告)日:2008-01-17
申请号:US11309220
申请日:2006-07-13
申请人: CHUN-CHI CHEN , Shi-Wen Zhou , Zhan Wu
发明人: CHUN-CHI CHEN , Shi-Wen Zhou , Zhan Wu
CPC分类号: H01L23/4093 , H01L2924/0002 , Y10T24/44 , Y10T24/44017 , H01L2924/00
摘要: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.
摘要翻译: 夹具包括具有第一端和第二端的本体。 连接构件延伸穿过主体的第一端。 钩板附接到连接构件的底部,并且致动构件枢转地联接到连接构件的上端。 致动构件可相对于钩板在第一方向上枢转,使得致动构件相对于钩板可在锁定位置和解锁位置之间转动。 此外,致动构件可在不同于第一方向的第二方向上围绕连接构件的轴线转动。
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公开(公告)号:US20070217162A1
公开(公告)日:2007-09-20
申请号:US11309758
申请日:2006-09-22
申请人: Shi-Wen Zhou , Chun-Chi Chen , Zhan Wu
发明人: Shi-Wen Zhou , Chun-Chi Chen , Zhan Wu
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a heat sink and a back plate assembly thermally independent from the sink. The back plate assembly includes a body facing a bottom surface of the heat sink and a heat-dissipating member thermal connecting to the body. The heat sink is used for absorbing heat generated by a heat-generating electronic component from a top side thereof. The back plate assembly is used for absorbing the heat generated by the heat-generating electronic component from a bottom side thereof. The heat sink and the back plate assembly are connected together by fixing members extending from the heat sink through a printed circuit board on which the electronic component is mounted to threadedly engage with the back plate assembly.
摘要翻译: 散热装置包括散热器和与散热器热独立的背板组件。 背板组件包括面向散热器的底表面的主体和连接到主体的散热构件。 散热器用于从其顶侧吸收由发热电子部件产生的热量。 背板组件用于从其底侧吸收由发热电子部件产生的热量。 散热器和背板组件通过从散热器延伸的固定部件通过印刷电路板连接在一起,电路板安装在印刷电路板上,以与背板组件螺纹接合。
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公开(公告)号:US20070215321A1
公开(公告)日:2007-09-20
申请号:US11309344
申请日:2006-07-28
申请人: Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人: Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , F28D15/0275 , F28F2210/10 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.
摘要翻译: 散热装置包括具有平坦顶面的第一基板,多个平坦化的热管,位于热管上方的散热片组件和形成在热管和散热片组件之间的导热层。 导热层具有与热管接触的平坦表面。 热管被支撑在第一基板的顶表面上。 第一底板具有用于与电子包装件接合的平坦底面。 每个热管包括蒸发部分和从蒸发部分弯曲的冷凝部分,并且热管的蒸发部分彼此并排地邻接。
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公开(公告)号:US20070145572A1
公开(公告)日:2007-06-28
申请号:US11306412
申请日:2005-12-27
申请人: Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人: Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号: H01L23/34
CPC分类号: F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要: A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.
摘要翻译: 散热装置(1)包括散热器(10),风扇(20)和冷却构件(30)。 散热器包括基座,从基座延伸的多个翅片和至少一个热连接底座和翅片的热管。 冷却件在其上设置有翅片组件,并且包括附接到翅片的一侧的冷表面和至少一个热管的冷凝部分,以使翅片的一侧和冷凝部分具有较低的温度。
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