摘要:
An electronic delay circuit (10) for use in a detonator (100) has a switching circuit (20) and a timer circuit (22). Switching circuit (20) controls the flow of a stored charge of electrical energy from a storage capacitor (12) to a bridge initiation element such as a semiconductor bridge (18) or a tungsten bridge. The timing of the release of this energy is controlled by timer circuit (22). Switching circuit (20) is an integrated, dielectrically isolated, bipolar CMOS (DI BiCMOS) circuit, whereas timer circuit (22) is a conventional CMOS circuit. The use of a DI BiCMOS switching circuit allows for greater efficiency of energy transfer from the storage capacitor (12) to the semiconductor bridge (18) than has previously been attained.
摘要:
An electro-explosive device has two serpentine resistors fabricated on a thermally conductive substrate with the resistors being interconnected by a central bridge element. The resistance of the bridge element is much lower than that of the serpentine resistors and the serpentine resistors have a much larger surface area to volume ratio. A layer of zirconium is placed on the bridge element and explodes into a plasma along with the bridge element in order to ignite a pyrotechnic compound. The resistance of the bridge element increases with temperature whereby the bridge element receives more of the energy from the applied signal as the temperature increases. The EED is insensitive to coupled RF energy and to an electrostatic discharge since most of the energy from these stray signals is directed to the serpentine resistors and not to the bridge element. In another embodiment, two of the resistors are metal-oxide phase variable resistances and a third resistor is formed from a bowtie-shaped layer of zirconium. The resistances through the metal-oxide phase layers decrease with signal intensity whereby the zirconium can receive most of the energy from a high intensity firing signal. A shunting element, which may be placed across an EED, has a bowtie-shaped conductive layer formed on a substrate. The conductive layer explodes in a plasma above a certain signal intensity. The shunting element may comprise another type of device, such as a diode, capacitor, etc.
摘要:
A detonator (10) contains an SCB initiator assembly (35) in initiation relation to an ignition charge (18). The SCB initiator assembly (35) contains an initiator element (36) having a bridge (60) of semiconductor material between two conductive lands (62a, 62b). The bridge (60) provides a resistance of at least about 50 ohms and has a volume between 48,600 cubic microns and 600,000 cubic microns with a typical thickness of two microns. A firing current of more than 200 milliamp provided to the initiator assembly (35) via input leads (26a, 26b) causes the bridge (60) to initiate the ignition charge (18).
摘要:
A monolithic semiconductor igniter for igniting a charge of explosive material. The igniter includes a semiconductor substrate, and one or more fuse which is diffused in the semiconductor substrate such that the fuse ignites the charge when an electrical current is passed through it. Also provided is a process for manufacturing a monolithic semiconductor igniter. The process includes providing a semiconductor substrate, and diffusing one or more fuses in the semiconductor substrate. An additional embodiment provides an igniter with multiple sawtooth bridge elements. The resistance of this igniter may be adjusted by cutting individual bridge elements.
摘要:
An integrated circuit bridge comprises a substrate of non-electrically conductive material and a semiconductor layer on the substrate. First and second metal lands form contacts of the semiconductor bridge. An explosive charge bridges a gap between the metal lands. The lands, gap, semiconductor bridge, and charge are dimensioned and arranged so that in response to a current equal to or in excess of a predetermined level having a duration equal to or in excess of a predetermined value being applied across the gap, a plasma having sufficient energy to energize the explosive is formed in the gap. The predetermined current has a predetermined minimum firing voltage associated with it. The bridge is one of a lot having a firing voltage standard deviation of about 0.05 volts. Premature energization of the explosive by electrostatic discharge and voltages greater than the firing voltage and by AC induced voltages is prevented by connecting a zener diode across the first and second lands. The zener diode is chosen to conduct in the backward direction in response to a positive voltage of about 1.1 times the predetermined minimum firing voltage being applied across it. The bridge comprises a tungsten layer that extends across the gap on the semiconductor layer. The lands have a resistivity much smaller than that of the tungsten layer.
摘要:
A semiconductor bridge comprises a substrate of non-electrically conductive material, a doped semiconductor layer on the substrate, as well as first and second metal lands forming ohmic contacts on the doped semiconductor layer. An explosive charge bridges a gap between the metal lands across the doped semiconductor layer. The lands, gap, semiconductor layer, and charge are dimensioned and arranged so that in response to a current equal to or in excess of a predetermined level having a duration equal to or in excess of a predetermined value being applied across the gap, a plasma having sufficient energy to energize the explosive is formed in the gap. The predetermined current has a predetermined minimum firing voltage associated with it. The semiconductor bridge is one of a lot having a firing voltage standard deviation of about 0.05 volts. Premature energization of the explosive by electrostatic discharge and voltages greater than the firing voltage and by AC induced voltages is prevented by connecting a zener diode across the first and second lands. The zener diode is chosen to conduct in the backward direction in response to a positive voltage of about 1.1 times the predetermined minimum firing voltage being applied across it.
摘要:
A new shape charge includes an integrated circuit semiconductor bridge detonating device responsive to ordinary current for triggering a switch in the detonating device and igniting a pyrotechnic composition on a small integrated circuit semiconductor bridge in the detonation device in response to the current, thereby igniting an explosive material in the shape charge and firing the shape charge. Since the integrated circuit detonating device is utilized, responsive to ordinary current for detonation, prior art detonating cords are not needed. A plurality of shape charges in a perforating gun are fired substantially simultaneously using the new shape charge of the present invention.
摘要:
The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primer housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.
摘要:
A detonator device for a primary or secondary explosive comprising an integrated circuit consisting of a silicon wafer substrate on which an epitaxial layer of a desired thickness is first grown, followed by a covering insulating oxide layer. Metal contacts are deposited on the oxide layer in a photolithographic masking process to form a regular pattern of contact pairs. These contact pairs are joined together by a bridge element which may be made from the same metal as the contacts, a higher density metal, from heavily doped polysilicon. The substrate is back-etched beneath the bridge members up to the epitaxial layer to form a barrel through which the flyer may travel. After the wafer is diced, the individual dies have a counter mass face-plate bonded atop the bridge and contacts.
摘要:
A switch device for one-time use in conducting very high currents comprising a silicon substrate on which is deposited a amorphous silicon or polysilicon strip extending as a bridge between first and second spaced-apart metal contacts deposited on the silicon substrate. Also deposited on the same substrate on opposite sides of the bridge and spaced from it are a set of high voltage contacts. When a high voltage is applied across the contacts, no current flows until a trigger current is made to flow through the bridge, the trigger current being sufficiently large to vaporize the bridge creating a plasma cloud. The plasma, being highly conductive, allows a very large current to flow between the high voltage contacts. The device of the present invention finds special application as part of a detonation system for high explosive ammunitions. This specification discloses various modifications to the above structure to achieve desired performance characteristics.