公开(公告)号：US06803843B2

公开(公告)日：2004-10-12

申请号：US10073311

申请日：2002-02-13

申请人： Takahisa Kato ,  Hidemasa Mizutani ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Susumu Yasuda ,  Takayuki Teshima ,  Futoshi Hirose

发明人： Takahisa Kato ,  Hidemasa Mizutani ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Susumu Yasuda ,  Takayuki Teshima ,  Futoshi Hirose

IPC分类号： H01H5122

CPC分类号： G02B26/101 ,  G02B7/1821 ,  G02B7/1828 ,  G02B26/105 ,  G11B7/08564

摘要： The movable-body apparatus includes a support member, a movable body, an elastic supporting unit having a twisting longitudinal axis, and a driving unit for tilting the movable body in a tilting direction about the twisting longitudinal axis. The elastic supporting unit supports the movable body flexibly and rotatably about the twisting longitudinal axis relative to the support member. The driving unit includes a stationary portion provided apart from the movable body, and a moving core formed of a magnetic material, provided on a portion of the movable body, and has a face opposed to the stationary portion.

摘要翻译： 可移动体装置包括支撑构件，可移动体，具有扭转纵向轴线的弹性支撑单元和用于围绕扭转纵向轴线在倾斜方向上倾斜可动体的驱动单元。 弹性支撑单元相对于支撑构件围绕扭转纵向轴线灵活地和可旋转地支撑可移动体。 驱动单元包括设置在可移动体上的固定部分和由可移动体的一部分上设置的磁性材料形成的移动芯体，并且具有与固定部分相对的面。

公开(公告)号：US06436265B1

公开(公告)日：2002-08-20

申请号：US09534341

申请日：2000-03-24

申请人： Yasuhiro Shimada ,  Takayuki Yagi ,  Takayuki Teshima ,  Takashi Ushijima

发明人： Yasuhiro Shimada ,  Takayuki Yagi ,  Takayuki Teshima ,  Takashi Ushijima

IPC分类号： C25D502

CPC分类号： G02B3/0056 ,  G02B3/0012 ,  G02B3/0043

摘要： A fabrication method of fabricating an array of microstructures is provided. The method includes the step of preparing a substrate with a surface including a usable region and a dummy region continuously set around the usable region, at least the usable region and the dummy region of the substrate are electrically conductive and have a conductive portion. The method also includes the steps of forming a first insulating layer on the conductive portion, and forming a plurality of openings in the first insulating layer, the openings being arranged in a predetermined array pattern. Additionally, the method includes the step of performing one of electroplating and electrodeposition using the conductive portion as an electrode to form a first plated or electrodeposited layer in the openings and on the first insulating layer in both the usable region and the dummy region.

摘要翻译： 提供了一种制造微结构阵列的制造方法。 该方法包括制备具有包括可用区域和连续设置在可用区域周围的虚拟区域的表面的衬底的步骤，至少衬底的可用区域和虚拟区域是导电的并且具有导电部分。 该方法还包括以下步骤：在导电部分上形成第一绝缘层，并在第一绝缘层中形成多个开口，开口以预定阵列图案布置。 此外，该方法包括使用导电部分作为电极进行电镀和电沉积之一的步骤，以在可用区域和虚拟区域中的开口中和第一绝缘层上形成第一电镀或电沉积层。