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    Microstructure array and a microlens array
    2.
    发明申请
    Microstructure array and a microlens array 失效
    微结构阵列和微透镜阵列

    公开(公告)号：US20050029111A1

    公开(公告)日：2005-02-10

    申请号：US10930959

    申请日：2004-09-01

    申请人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    发明人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    IPC分类号： B29C33/38 ,  B29L11/00 ,  G02B3/00 ,  C25D5/02

    CPC分类号： G02B3/0025 ,  G02B3/0012 ,  G02B3/0031 ,  G02B3/0056 ,  Y10S428/901 ,  Y10T428/24917

    摘要： In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

    摘要翻译： 在制造微结构阵列的方法中，提供具有导电部分的衬底，在衬底的导电部分上形成绝缘掩模层，在绝缘掩模层中形成多个开口以露出 导电部分和第一电镀或电沉积层通过电镀或电沉积沉积在开口中和绝缘掩模层上。 在第一镀层或电沉积层上和通过无电镀处理导电部分上进一步形成第二镀层，以减小阵列上微结构的尺寸分布。

    Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array
    3.
    发明授权
    Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array 有权
    微结构阵列，用于形成微结构阵列的装置和方法，以及用于制造微结构阵列的模具

    公开(公告)号：US06436265B1

    公开(公告)日：2002-08-20

    申请号：US09534341

    申请日：2000-03-24

    申请人： Yasuhiro Shimada ,  Takayuki Yagi ,  Takayuki Teshima ,  Takashi Ushijima

    发明人： Yasuhiro Shimada ,  Takayuki Yagi ,  Takayuki Teshima ,  Takashi Ushijima

    IPC分类号： C25D502

    CPC分类号： G02B3/0056 ,  G02B3/0012 ,  G02B3/0043

    摘要： A fabrication method of fabricating an array of microstructures is provided. The method includes the step of preparing a substrate with a surface including a usable region and a dummy region continuously set around the usable region, at least the usable region and the dummy region of the substrate are electrically conductive and have a conductive portion. The method also includes the steps of forming a first insulating layer on the conductive portion, and forming a plurality of openings in the first insulating layer, the openings being arranged in a predetermined array pattern. Additionally, the method includes the step of performing one of electroplating and electrodeposition using the conductive portion as an electrode to form a first plated or electrodeposited layer in the openings and on the first insulating layer in both the usable region and the dummy region.

    摘要翻译： 提供了一种制造微结构阵列的制造方法。 该方法包括制备具有包括可用区域和连续设置在可用区域周围的虚拟区域的表面的衬底的步骤，至少衬底的可用区域和虚拟区域是导电的并且具有导电部分。 该方法还包括以下步骤：在导电部分上形成第一绝缘层，并在第一绝缘层中形成多个开口，开口以预定阵列图案布置。 此外，该方法包括使用导电部分作为电极进行电镀和电沉积之一的步骤，以在可用区域和虚拟区域中的开口中和第一绝缘层上形成第一电镀或电沉积层。

    Microstructure array and a microlens array
    5.
    发明授权
    Microstructure array and a microlens array 失效
    微结构阵列和微透镜阵列

    公开(公告)号：US07294389B2

    公开(公告)日：2007-11-13

    申请号：US10930959

    申请日：2004-09-01

    申请人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    发明人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    IPC分类号： B32B3/00 ,  H01L23/48

    CPC分类号： G02B3/0025 ,  G02B3/0012 ,  G02B3/0031 ,  G02B3/0056 ,  Y10S428/901 ,  Y10T428/24917

    摘要： In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

    摘要翻译： 在制造微结构阵列的方法中，提供具有导电部分的衬底，在衬底的导电部分上形成绝缘掩模层，在绝缘掩模层中形成多个开口以露出 导电部分和第一电镀或电沉积层通过电镀或电沉积沉积在开口中和绝缘掩模层上。 在第一镀层或电沉积层上和通过无电镀处理导电部分上进一步形成第二镀层，以减小阵列上微结构的尺寸分布。

    Microstructure array, and a microlens array
    6.
    发明授权
    Microstructure array, and a microlens array 失效
    微结构阵列和微透镜阵列

    公开(公告)号：US06835443B2

    公开(公告)日：2004-12-28

    申请号：US10449103

    申请日：2003-06-02

    申请人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    发明人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    IPC分类号： B32B300

    CPC分类号： G02B3/0025 ,  G02B3/0012 ,  G02B3/0031 ,  G02B3/0056 ,  Y10S428/901 ,  Y10T428/24917

    摘要： In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

    摘要翻译： 在制造微结构阵列的方法中，提供具有导电部分的衬底，在衬底的导电部分上形成绝缘掩模层，在绝缘掩模层中形成多个开口以露出 导电部分和第一电镀或电沉积层通过电镀或电沉积沉积在开口中和绝缘掩模层上。 在第一镀层或电沉积层上和通过无电镀处理导电部分上进一步形成第二镀层，以减小阵列上微结构的尺寸分布。

    Mold for forming a microlens and method of fabricating the same
    7.
    发明授权
    Mold for forming a microlens and method of fabricating the same 失效
    用于形成微透镜的模具及其制造方法

    公开(公告)号：US06656393B2

    公开(公告)日：2003-12-02

    申请号：US09360455

    申请日：1999-07-26

    申请人： Takayuki Yagi ,  Yasuhiro Shimada ,  Takayuki Teshima ,  Takashi Ushijima

    发明人： Takayuki Yagi ,  Yasuhiro Shimada ,  Takayuki Teshima ,  Takashi Ushijima

    IPC分类号： B29D1100

    CPC分类号： B29C33/42 ,  B29C33/3842 ,  B29D11/00365 ,  Y10S425/808

    摘要： A mold for a microlens includes a substrate at least a portion of which is electrically conductive, such as an electrically-conductive substrate or a substrate with an electrode layer, an insulating mask layer formed on the substrate and including an opening or plural openings, and a plated layer electroplated in the opening and on the mask layer. A first condition that a diameter or width (&phgr;) of the opening has a relation of &phgr;≦0.35R, wherein (R) is a radius of curvature of the plated layer right above the opening, or a second condition that the diameter or width (&phgr;) of the opening is &phgr;≦10 &mgr;m, is met.

    摘要翻译： 用于微透镜的模具包括其导电性的至少一部分的基板，例如导电基板或具有电极层的基板，形成在基板上的绝缘掩模层，并且包括开口或多个开口，以及 电镀在开口和掩模层上的镀层。 第一条件是开口的直径或宽度（phi）具有phi <= 0.35R的关系，其中（R）是开口正上方的镀层的曲率半径，或第二条件，即直径或 开口的宽度（phi）为phi <= 10um。

    Methods of fabricating a microstructure array
    8.
    发明授权
    Methods of fabricating a microstructure array 失效
    制造微结构阵列的方法

    公开(公告)号：US06632342B1

    公开(公告)日：2003-10-14

    申请号：US09534070

    申请日：2000-03-24

    申请人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    发明人： Takayuki Teshima ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Takashi Ushijima

    IPC分类号： C25D502

    CPC分类号： G02B3/0025 ,  G02B3/0012 ,  G02B3/0031 ,  G02B3/0056 ,  Y10S428/901 ,  Y10T428/24917

    摘要： In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

    摘要翻译： 在制造微结构阵列的方法中，提供具有导电部分的衬底，在衬底的导电部分上形成绝缘掩模层，在绝缘掩模层中形成多个开口以露出 导电部分和第一电镀或电沉积层通过电镀或电沉积沉积在开口中和绝缘掩模层上。 在第一镀层或电沉积层上和导电部分上进一步形成第二镀层，通过化学镀以减小阵列上微结构的尺寸分布。