公开(公告)号：US20220334000A1

公开(公告)日：2022-10-20

申请号：US17230277

申请日：2021-04-14

Applicant: Allegro MicroSystems, LLC

Inventor： Joseph James Judkins, III ,  Bryan Cadugan

IPC: G01K7/01 ,  G01S7/484 ,  G01S17/89

Abstract: Methods and apparatus for extracting temperature information for an array from a signal through first and second contacts based on temperature dependent properties of the a PN junction. An example method includes connecting first and second PN junctions to a bias source to reverse bias the first and second PN junctions, connecting a first contact to the first PN junction, connecting a second contact to N type material forming a junction with P type material of the first PN junction, and extracting temperature information for the first PN junction from a signal through the first and second contacts based on temperature dependent properties of the first PN junction.

公开(公告)号：US20220291358A1

公开(公告)日：2022-09-15

申请号：US17197314

申请日：2021-03-10

Applicant: Allegro MicroSystems, LLC

Inventor： William P. Taylor ,  Bryan Cadugan

IPC: G01S7/497 ,  G01S7/484 ,  G01S17/10

Abstract: Methods and apparatus for a controlling a stimulus source to direct photons to a pixel in a pixel array contained in a detector system, analyzing a response of the pixel in the pixel array; and generating an alert based on the response of the pixel in the pixel array. Example stimulus sources include a conductive trace, a PN junction, and a current source.

公开(公告)号：US11217718B2

公开(公告)日：2022-01-04

申请号：US16740816

申请日：2020-01-13

Applicant: Allegro MicroSystems, LLC

Inventor： Bryan Cadugan ,  Harianto Wong ,  William P. Taylor

IPC: H01L31/102 ,  H01L31/18 ,  H01L31/0224

Abstract: According to an embodiment of the present disclosure, a photodetector device can include a substrate layer; a bottom contacting layer disposed over a surface of the substrate layer and having a first contacting region and a second contacting region, the bottom contacting layer providing a low resistance path between the first and second contacting regions; an insulating layer disposed over a surface of the bottom contacting layer; an intrinsic region disposed within the insulating layer, the intrinsic region in electrical contact with the first contacting region of the bottom contacting layer, the intrinsic region comprising a low band-gap material; a metal contact disposed within the insulating layer and in electrical contact with the second contacting region of the bottom contacting layer; an anode in electrical contact with the intrinsic region; and a cathode in electrical contact with the metal contact.

公开(公告)号：US11085952B2

公开(公告)日：2021-08-10

申请号：US16578767

申请日：2019-09-23

Applicant: Allegro MicroSystems, LLC

Inventor： Bryan Cadugan ,  Rémy Lassalle-Balier ,  Alexander Latham ,  Paolo Campiglio ,  Noémie Belin

IPC: G01R15/20 ,  G01R33/09 ,  G01R17/00 ,  G01R19/00

Abstract: A current sensor can indirectly measure a sensed current by directly measuring static perturbing AC magnetic fields with magnetoresistance elements, the perturbing magnetic fields generated by perturbing coils. The sensed current can be indirectly measured by modulating or changing sensitivities of the magnetoresistance elements in a way that is directly related to the sensed current.

公开(公告)号：US10921391B2

公开(公告)日：2021-02-16

申请号：US16527319

申请日：2019-07-31

Applicant: Allegro MicroSystems, LLC

Inventor： Bryan Cadugan ,  William P. Taylor

IPC: G01R33/02 ,  G01R33/07 ,  H01L43/02 ,  G01R33/09

Abstract: Methods and apparatus for a magnetic field sensor integrated circuit including a lead frame having a first surface, a second opposing surface, and a plurality of leads. A substrate has a first surface supporting a magnetic field sensing element and a second surface attached to the first surface of the lead frame. A magnet has a first surface and a second, opposing surface, and is configured to generate a magnetic field. A spacer is positioned between the first surface of the magnet and the second surface of the lead frame with a thickness selected to establish a predetermined distance between the first surface of the magnet and the magnetic field sensing element, the predetermined distance selected to provide the magnetic field signal as a sinusoidal signal.

公开(公告)号：US20200266337A1

公开(公告)日：2020-08-20

申请号：US16280199

申请日：2019-02-20

Applicant: Allegro MicroSystems, LLC

Inventor： Yen Ting Liu ,  Maxim Klebanov ,  Bryan Cadugan ,  Sundar Chetlur ,  Harianto Wong

IPC: H01L43/12

Abstract: A manufacturing method results in a magnetoresistance element having conductive contacts disposed between the magnetoresistance element and a semiconductor substrate.

公开(公告)号：US20200041583A1

公开(公告)日：2020-02-06

申请号：US16527319

申请日：2019-07-31

Applicant: Allegro MicroSystems, LLC

Inventor： Bryan Cadugan ,  William P. Taylor

IPC: G01R33/07 ,  G01R33/09 ,  H01L43/02

Abstract: Methods and apparatus for a magnetic field sensor integrated circuit including a lead frame having a first surface, a second opposing surface, and a plurality of leads. A substrate has a first surface supporting a magnetic field sensing element and a second surface attached to the first surface of the lead frame. A magnet has a first surface and a second, opposing surface, and is configured to generate a magnetic field. A spacer is positioned between the first surface of the magnet and the second surface of the lead frame with a thickness selected to establish a predetermined distance between the first surface of the magnet and the magnetic field sensing element, the predetermined distance selected to provide the magnetic field signal as a sinusoidal signal.

公开(公告)号：US20190219643A1

公开(公告)日：2019-07-18

申请号：US15895418

申请日：2018-02-13

Applicant: Allegro MicroSystems, LLC

Inventor： Bryan Cadugan ,  Rémy Lassalle-Balier ,  Alexander Latham ,  Paolo Campiglio ,  Noémie Belin

IPC: G01R33/09 ,  G01R33/00 ,  G01R15/20

Abstract: A magnetic field sensor can include a substrate, a first magnetoresistance element disposed over the substrate and including a first maximum response axis and a first bias layer structure configured to generate a first bias magnetic field with a first magnetic direction between ninety degrees and sixty degrees relative to the first maximum response axis. The magnetic field sensor can also include a second magnetoresistance element disposed over the substrate and including a second maximum response axis parallel to the first maximum response axis and a second bias layer structure configured to generate a second bias magnetic field with a second magnetic direction parallel to the first magnetic direction and opposed to the first magnetic direction. The first and second magnetoresistance elements can each have a pair of electrical contacts for coupling to circuits.

公开(公告)号：US10352969B2

公开(公告)日：2019-07-16

申请号：US15363285

申请日：2016-11-29

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R19/00 ,  G01R15/20

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US09804222B2

公开(公告)日：2017-10-31

申请号：US14541582

申请日：2014-11-14

Applicant: Allegro MicroSystems, LLC

Inventor： Craig S. Petrie ,  Bryan Cadugan

IPC: H02M1/00 ,  G01R31/28 ,  G01R33/00 ,  G01R33/07 ,  G01R33/09 ,  G01D5/14 ,  G01D5/244

CPC classification number: G01R31/2884 ,  G01D5/145 ,  G01D5/2448 ,  G01D5/2449 ,  G01R33/0035 ,  G01R33/07 ,  G01R33/09

Abstract: Methods and apparatus for processing a signal comprise at least one circuit configured to generate a measured signal during a measured time period and a reference signal during a reference time period. Also included is at least one dual- or multi-path analog-to-digital converter comprising at least a first processing circuit configured to process the measured signal, at least a second processing circuit configured to process the reference signal, and a third processing circuit configured to process both the measured signal and the reference signal.