公开(公告)号：US11240585B2

公开(公告)日：2022-02-01

申请号：US17023237

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jeffrey J. Terlizzi ,  Kathleen A. Bergeron ,  Ali N. Ergun ,  Dustin A. Hatfield ,  Ethan L. Huwe ,  Todd P. Marco ,  Jason Joseph LeBlanc ,  Robert D. Zupke ,  Michael B. Minerbi ,  Prathamesh R. Bhagwat ,  Daniel R. Bloom

IPC: H04R25/00 ,  H04R1/10

Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.

公开(公告)号：US11102563B2

公开(公告)日：2021-08-24

申请号：US16584905

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Sean T. McIntosh ,  Ethan L. Huwe ,  Brian R. Twehues ,  Mohammad Soroush Ghahri Sarabi

IPC: H04R1/10 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00

Abstract: Embodiments describe an attachment mechanism including a wire bent in various directions forming a spring compressible in lateral directions. The wire includes a first wireform feature and a second wireform feature extending from the first wireform feature, where the first wireform feature and the second wireform feature each include: an intermediate segment; a u-shaped segment extending from the intermediate segment; and an end segment extending from the u-shaped segment.

公开(公告)号：US20210243514A1

公开(公告)日：2021-08-05

申请号：US17234441

申请日：2021-04-19

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US11012770B2

公开(公告)日：2021-05-18

申请号：US16584940

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US10986433B2

公开(公告)日：2021-04-20

申请号：US16584894

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20210099791A1

公开(公告)日：2021-04-01

申请号：US16583795

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Scott C. Grinker ,  Claudio Notarangelo ,  Cole A. McCaughan ,  Ethan L. Huwe ,  Brian R. Twehues

IPC: H04R1/28 ,  H04R1/10

Abstract: A driver assembly including a driver module having a driver frame and a diaphragm coupled to the driver frame, the driver frame defining a front volume chamber coupled to a first side of the diaphragm and a back volume chamber; an internal control leak formed through the driver frame to couple the front volume chamber to the back volume chamber; and a first driver vent and a second driver vent formed through the driver frame to couple a second side of the diaphragm to the back volume chamber, wherein a centroid of the first driver vent is aligned with a centroid of the second driver vent.

公开(公告)号：US20200162806A1

公开(公告)日：2020-05-21

申请号：US16748464

申请日：2020-01-21

Applicant: Apple Inc.

Inventor： Glenn K. Trainer ,  Scott C. Grinker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/10 ,  G10K11/178

Abstract: A low-profile earbud is disclosed that sits securely within an ear of a user. The earbud includes a protruding portion that passes through a channel defined by the tragus and anti-tragus of the ear. In some embodiments, the protruding portion can take the form of a cable configured to supply power and transfer data to the earbud. In some embodiments, the protruding portion can provide additional space for electrical components and sensors supporting the earbud.

公开(公告)号：US20200154184A1

公开(公告)日：2020-05-14

申请号：US16733841

申请日：2020-01-03

Applicant: Apple Inc.

Inventor： Meiting Wu ,  Simon K. Porter ,  Glenn K. Trainer ,  Jacob A. Pfitsch ,  Rex P. Price ,  Samuel G. Parker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/02 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R1/26

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US10524044B2

公开(公告)日：2019-12-31

申请号：US15613063

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： John H. Sheerin ,  Samuel G. Parker ,  Ethan L. Huwe ,  Meiting Wu ,  Craig M. Stanley

IPC: H04R1/28 ,  H04R1/02 ,  G06F3/01 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H01H13/02 ,  H05K1/14

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US10257608B2

公开(公告)日：2019-04-09

申请号：US15613003

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Jason C. Della Rosa ,  Ethan L. Huwe ,  Glenn K. Trainer ,  Simon K. Porter

IPC: F21V3/00 ,  F21V5/00 ,  G06F3/01 ,  G06F3/02 ,  G06F3/16 ,  H04R1/02 ,  H04R1/26 ,  H04R1/28 ,  H04R1/30 ,  H04R1/40 ,  H04R3/00 ,  H04R3/12 ,  H04R5/02 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H05K1/02 ,  H05K1/14 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H04R31/00 ,  G06F3/041 ,  H01H13/02 ,  G06F3/0354 ,  H03K17/96

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.