Abstract:
A manufacturing system for assembling wireless electronic devices is provided. The manufacturing system may include test stations for testing the radio-frequency performance of components that are to be assembled within the electronic devices. A reference test station may be calibrated using calibration coupons having known radio-frequency characteristics. The calibration coupons may include transmission line structures. The reference test station may measure verification standards to establish baseline measurement data. The verification standards may include circuitry having electrical components with given impedance values. Many verification coupons may be measured to enable testing for a wide range of impedance values. Test stations in the manufacturing system may subsequently measure the verification standards to generate test measurement data. The test measurement data may be compared to the baseline measurement data to characterize the performance of the test stations to ensure consistent test measurements across the test stations.
Abstract:
Test systems for characterizing devices under test (DUTs) are provided. A test system for testing a DUT in a shunt configuration may include a signal generator and a matching network that is coupled between the signal generator and the DUT and that is optimized to apply desired voltage/current stress to the DUT with reduced source power. The matching network may be configured to provide matching and desired stress levels at two or more frequency bands. In another suitable embodiment, a test system for testing a DUT in a series configuration may include a signal generator, an input matching network coupled between the DUT and a first terminal of the DUT, and an output matching network coupled between the DUT and a second terminal of the DUT. The input and output matching network may be optimized to apply desired voltage/current stress to the DUT with reduced source power.
Abstract:
Electronic devices may be provided that include radio-frequency transceiver circuitry and antennas. An antenna may be formed from an antenna resonating element and an antenna ground. The antenna resonating element may have a shorter portion that resonates at higher communications band frequencies and a longer portion that resonates at lower communications band frequencies. An extended portion of the antenna ground may form an inverted-F antenna resonating element portion of the antenna resonating element. The antenna resonating element may be formed from a peripheral conductive electronic device housing structure that is separated from the antenna ground by an opening. A first antenna feed may be coupled between the peripheral conductive electronic device housing structures and the antenna ground across the opening. A second antenna feed may be coupled to the inverted-F antenna resonating element portion of the antenna resonating element.