Vehicle antenna assembly
    3.
    发明授权

    公开(公告)号:US11658399B2

    公开(公告)日:2023-05-23

    申请号:US17366358

    申请日:2021-07-02

    Inventor: Alan W. Miller

    CPC classification number: H01Q1/3275 B62D35/007 H01Q1/38 H01Q9/27

    Abstract: An antenna assembly for installation on a spoiler of a vehicle includes a substrate having an inner surface and an outer surface coupled to an interior surface of the spoiler of the vehicle. The substrate includes an upper substrate portion, a lower substrate portion and a rear substrate portion between the upper substrate portion and the lower substrate portion. The upper and lower substrate portions are oriented generally horizontally. The rear substrate portion is oriented generally vertically. The antenna assembly includes an antenna element coupled to the substrate having antenna members in a serpentine antenna pattern including cross members extending across the substrate and lateral members extending between the cross members. The antenna element includes an upper antenna portion, a lower antenna portion and a rear antenna portion between the upper antenna portion and the lower antenna portion.

    Ultra-low profile monopole antenna for 2.4GHz band

    公开(公告)号:US09761945B2

    公开(公告)日:2017-09-12

    申请号:US14607758

    申请日:2015-01-28

    Inventor: Eleazar Zuniga

    Abstract: The disclosure concerns an ultra-small and ultra-low profile monopole antenna for configured for use in ISM bands. The antenna generally includes a flexible substrate having a printed conductor pattern thereon. The printed conductor pattern includes: a first conductor portion having a first solder pad and at least two concentric loops, and preferably three concentric loops extending therefrom, with a rectangular trace pad disposed within the concentric loops; and a second conductor portion defined by a conductor sheet being disposed adjacent to the first conductor portion, the conductor sheet having a second solder pad thereon. The antenna is configured to attach with a coaxial cable having a feed wire coupled to the first solder pad and further having a ground wire coupled to the second solder pad.

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