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公开(公告)号：US5490728A
公开(公告)日：1996-02-13
申请号：US180641
申请日：1994-01-12
CPC分类号： G01B11/06 , G01B11/0658 , G01J5/0003 , G01J5/0007 , G01J5/08 , G01J5/0815 , G01J5/0818 , G01J5/0821 , G01J5/0846 , G01J5/0878 , G01J5/089 , G01J5/602 , G01N21/474 , G01N21/8422 , G01J2005/068 , G01J5/026 , G01N2021/4742
摘要： Thermal, optical, physical and chemical characteristics of a substrate (11) surface are determined with non-contact optical techniques that include illuminating (23) the surface with radiation having a ripple intensity characteristic (51), and then measuring the combined intensities (53) of that radiation after modification by the substrate surface and radiation emitted from the surface. Precise determinations of emissivity, reflectivity, temperature, changing surface composition, the existence of any layer formed on the surface and its thickness are all possible from this measurement. They may be made in situ and substantially in real time, thus allowing the measurement to control (39, 41) various processes of treating a substrate surface. This has significant applicability to semiconductor wafer processing and metal processing.
摘要翻译： 使用非接触光学技术确定衬底（11）表面的热，光学，物理和化学特性，其包括用具有纹波强度特性（51）的辐射照射（23）表面，然后测量组合强度（53 ）由基板表面改性后的辐射和从表面发射的辐射。 从该测量可以准确确定发射率，反射率，温度，表面组成，表面上形成的任何层的存在及其厚度。 它们可以在原位和实质上实时制备，从而允许测量控制（39,41）处理基底表面的各种过程。 这对于半导体晶片加工和金属加工具有显着的适用性。
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公开(公告)号：US5310260A
公开(公告)日：1994-05-10
申请号：US999278
申请日：1992-12-28
CPC分类号： G01B11/06 , G01B11/0658 , G01J5/0003 , G01J5/0007 , G01J5/08 , G01J5/0815 , G01J5/0818 , G01J5/0821 , G01J5/0846 , G01J5/0878 , G01J5/089 , G01J5/602 , G01N21/474 , G01N21/8422 , G01J2005/068 , G01J5/026 , G01N2021/4742
摘要： Thermal, optical, physical and chemical characteristics of a substrate (11) surface are determined with non-contact optical techniques that include illuminating (23) the surface with radiation having a ripple intensity characteristic (51), and then measuring the combined intensities (53) of that radiation after modification by the substrate surface and radiation emitted from the surface. Precise determinations of emissivity, reflectivity, temperature, changing surface composition, the existence of any layer formed on the surface and its thickness are all possible from this measurement. They may be made in situ and substantially in real time, thus allowing the measurement to control (39, 41) various processes of treating a substrate surface. This has significant applicability to semiconductor wafer processing and metal processing.
摘要翻译： 使用非接触光学技术确定衬底（11）表面的热，光学，物理和化学特性，其包括用具有纹波强度特性（51）的辐射照射（23）表面，然后测量组合强度（53 ）由基板表面改性后的辐射和从表面发射的辐射。 从该测量可以准确确定发射率，反射率，温度，表面组成，表面上形成的任何层的存在及其厚度。 它们可以在原位和实质上实时制备，从而允许测量控制（39,41）处理基底表面的各种过程。 这对于半导体晶片加工和金属加工具有显着的适用性。
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73.发明授权Temperature measurement with combined photo-luminescent and black body sensing techniques 失效使用组合光发光和黑体感测技术的温度测量
公开(公告)号：US5183338A
公开(公告)日：1993-02-02
申请号：US808012
申请日：1991-12-13
CPC分类号： G01J5/08 , G01J1/58 , G01J5/041 , G01J5/0821 , G01J5/0846 , G01J5/0887 , G01J5/28 , G01K11/3213 , G01J5/046 , G01J5/048
摘要： High temperature range black body techniques are combined with lower temperature range photoluminescent techniques to provide an optical method and apparatus for measuring temperature over a very wide range. Among the various optical probe configurations disclosed which combine the black body and photoluminescent technologies is an optical temperature measuring probe including an elongated transparent light pipe with a black body cavity and a photoluminescent material adjacent one end of the light pipe. Signal detection and processing can be combined, and temperature measurements made by the photoluminescent technique within an overlap of the two temperature ranges can be used to calibrate measurements made in the higher range by the black body technique.
摘要翻译： 高温范围黑体技术与较低温度范围的光致发光技术结合，以提供用于在非常宽的范围内测量温度的光学方法和装置。 在结合黑体和光致发光技术的各种光学探针结构中，包括具有黑体腔的细长透明光管和邻近光管一端的光致发光材料的光学温度测量探针。 可以组合信号检测和处理，并且通过在两个温度范围内重叠的光致发光技术进行的温度测量可用于通过黑体技术校准在较高范围内进行的测量。
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