公开(公告)号：US10884192B1

公开(公告)日：2021-01-05

申请号：US16715954

申请日：2019-12-16

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Sean Hooten ,  Thomas Van Vaerenbergh ,  Peng Sun ,  Raymond G. Beausoleil

IPC: G02B6/34

Abstract: Examples herein relate to single-etch layer grating couplers. In particular, implementations herein relate to single-etch layer grating couplers comprising a planar waveguide wherein a first grating section and a second grating section are etched into. The first grating section is configured to scatter light at a given wavelength at a first angle relative to vertical and the second grating section is configured to scatter light at the given wavelength at a second angle relative to vertical. The stagger-tuning of the first grating section and the second grating section results in the light at the given wavelength being scattered at a desired angle the same or near an angle at which an optical fiber is offset from vertical.

公开(公告)号：US10797468B2

公开(公告)日：2020-10-06

申请号：US16671303

申请日：2019-11-01

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Geza Kurczveil ,  Di Liang ,  Raymond G. Beausoleil

IPC: H01S5/00 ,  H01S5/10 ,  H01S5/34 ,  H01S5/065 ,  H01S5/06 ,  H01S5/22 ,  H01S5/02 ,  H01S5/068 ,  H01S5/50

Abstract: Examples disclosed herein relate to multi-wavelength semiconductor lasers. In some examples disclosed herein, a multi-wavelength semiconductor laser may include a silicon-on-insulator (SOI) substrate and a quantum dot (QD) layer above the SOI substrate. The QD layer may include and active gain region and may have at least one angled junction at one end of the QD layer. The SOI substrate may include a waveguide in an upper silicon layer and a mode converter to facilitate optical coupling of a lasing mode to the waveguide.

公开(公告)号：US10795104B2

公开(公告)日：2020-10-06

申请号：US16587873

申请日：2019-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mir Ashkan Seyedi ,  Marco Fiorentino ,  Geza Kurczveil ,  Raymond G. Beausoleil

IPC: G02B6/43 ,  H01S3/13 ,  G02B6/42 ,  H01S3/23 ,  H04B10/50 ,  H01S3/131

Abstract: A photonic integrated circuit package includes two arrays or sets of integrated comb laser modules that are bonded to a silicon interposer. Each comb laser of an array has a common or overlapping spectral range, with each laser in the array being optically coupled to a local optical bus. The effective spectral range of the lasers in each array are different, or distinct, as to each array. An optical coupler is disposed within the silicon interposer and is optically coupled to each of the local optical buses. An ASIC (application specific integrated circuit) is bonded to the silicon interposer and provides control and operation of the comb laser modules.

公开(公告)号：US20200274327A1

公开(公告)日：2020-08-27

申请号：US15930955

申请日：2020-05-13

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Geza Kurczveil ,  Di Liang ,  Raymond G. Beausoleil

IPC: H01S5/10 ,  H01S5/065 ,  H01S5/068 ,  H01S5/14

Abstract: Examples disclosed herein relate to multi-wavelength semiconductor comb lasers. In some examples disclosed herein, a multi-wavelength semiconductor comb laser may include a waveguide included in an upper silicon layer of a silicon-on-insulator (SOI) substrate. The comb laser may include a quantum dot (QD) active gain region above the SOI substrate defining an active section in a laser cavity of the comb laser and a dispersion tuning section included in the laser cavity to tune total cavity dispersion of the comb laser.

公开(公告)号：US10367590B2

公开(公告)日：2019-07-30

申请号：US15272616

申请日：2016-09-22

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David Kielpinski ,  Jason Pelc ,  Thomas Van Vaerenbergh ,  Nikolas Tezak ,  Gabriel Joe Mendoza ,  Raymond G. Beausoleil

IPC: H04B10/80 ,  G06E3/00

Abstract: Examples described herein relate to concurrently performing operations on optical signals. In an example, a method includes providing, to an optical circuit, a first plurality of signals having a first optical property and encoding a first vector. A second plurality of signals is provided to the circuit that encodes a second vector and has a second optical property that is different from the first optical property. A first attribute-dependent operation is performed on the first plurality of signals via the circuit to perform a first matrix multiplication operation on the first vector, and concurrently, a second attribute-dependent operation is performed on the second plurality of signals to perform a second matrix multiplication operation on the second vector. The first matrix multiplication operation and the second matrix multiplication operation are different based on the first optical property being different from the second optical property.

公开(公告)号：US10256902B2

公开(公告)日：2019-04-09

申请号：US15775497

申请日：2015-11-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Nikolas Anton Tezak ,  David Kielpinski ,  Jason Pelc ,  Thomas Van Vaerenbergh ,  Ranojoy Bose ,  Raymond G. Beausoleil

IPC: H04L1/20 ,  G02B6/293 ,  H04B10/67 ,  H04B10/079 ,  H04L1/00

Abstract: In example implementations, an apparatus includes a bus waveguide, a plurality of optical gates coupled to the bus waveguide and an injection coupler. The bus waveguide receives a plurality of constraint signals. Each optical gate outputs an internal state via a local phase shift when at least one of the plurality of constraint signals has a wavelength that matches a respective resonant wavelength. The injection coupler combines the at least one of the plurality of constraint signals with additional constraint signals that are injected. An error is detected in a bit of a message when an overall phase shift has occurred to the at least one of the plurality of constraint signals causing a power level to exceed a power level threshold of an optical gate when the at least one of the plurality of constraint signals constructively interferes with the additional constraint signals that are injected.

公开(公告)号：US20190094466A1

公开(公告)日：2019-03-28

申请号：US15718306

申请日：2017-09-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Raymond G. Beausoleil ,  Di Liang ,  Marco Fiorentino ,  Geza Kurczveil ,  Mir Ashkan Seyedi ,  Zhihong Huang

IPC: G02B6/293 ,  G02B6/12 ,  H04B10/50 ,  H04J14/02 ,  H04Q11/00

Abstract: An example system for multi-wavelength optical signal splitting is disclosed. The example disclosed herein comprises a first splitter, a second splitter, and a modulator. The system receives a multi-wavelength optical signal and an electrical signal, wherein the multi-wavelength optical signal comprises a plurality of optical wavelengths and has a power level. The first splitter is to split the plurality of optical wavelengths into a plurality of optical wavelength groups. The second splitter is to split the multi-wavelength optical signal or the plurality of optical wavelength groups into a plurality of lower power signal groups. The modulator is to encode the electrical signal into the plurality of optical wavelength groups, the plurality of lower power signal groups, or a combination thereof.

公开(公告)号：US10181898B2

公开(公告)日：2019-01-15

申请号：US15139971

申请日：2016-04-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Nikolas A. Tezak ,  David Kielpinski ,  Jason Pelc ,  Thomas Van Vaerenbergh ,  Ranojoy Bose ,  Raymond G. Beausoleil

IPC: H04B10/079 ,  H04B10/80 ,  G11C13/04 ,  G02B6/293

Abstract: In example implementations, an optical gate is provided. The optical gate receives at least one optical signal via a waveguide of an optical memory gate. The optical gate compares a wavelength of the at least one optical signal to a resonant wavelength associated with a resonator. When the wavelength of the at least one optical signal matches the resonant wavelength, a value that is stored in the resonator is read out via the at least one optical signal. Then, the at least one optical signal with the value that is read out is transmitted out of the optical gate.

公开(公告)号：US10109983B2

公开(公告)日：2018-10-23

申请号：US15140588

申请日：2016-04-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Di Liang ,  Geza Kurczveil ,  Raymond G. Beausoleil ,  Marco Fiorentino

IPC: H01S5/34 ,  H01S5/343 ,  H01S5/32 ,  H01S5/347 ,  H01S3/23 ,  H01S3/063 ,  H01S5/02

Abstract: An example method of manufacturing a semiconductor device. A first wafer may be provided that includes a first layer that contains quantum dots. A second wafer may be provided that includes a buried dielectric layer and a second layer on the buried dielectric layer. An interface layer may be formed on at least one of the first layer and the second layer, where the interface layer may be an insulator, a transparent electrical conductor, or a polymer. The first wafer may be bonded to the second wafer by way of the interface layer.

公开(公告)号：US10031353B2

公开(公告)日：2018-07-24

申请号：US15272856

申请日：2016-09-22

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tsung-Ching Huang ,  Chin-Hui Chen ,  Marco Fiorentino ,  Raymond G. Beausoleil

IPC: H03K3/00 ,  G02F1/01 ,  H03K5/06 ,  G02F1/025 ,  H03K5/00 ,  H04B10/69

Abstract: Examples described herein relate to a driver circuit. In an example, the circuit includes a first input for receiving a first signal and a second input for receiving a second signal that is an inverse of the first signal. The circuit also includes a first driver array electrically coupling the first input to a first DC isolator and a first delay tap line electrically coupling the second input to the first DC isolator. The circuit further includes a second driver array electrically coupling the second input to a second DC isolator and a second delay tap line electrically coupling the first input to the second DC isolator. A carrier controller of the circuit is electrically coupled between the first DC isolator and the second DC isolator.