公开(公告)号：US20160332450A1

公开(公告)日：2016-11-17

申请号：US15111148

申请日：2014-01-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Kevin P. Dekam ,  Chien-Hua Chen

IPC: B41J2/175 ,  B29B11/06

CPC classification number: B41J2/175 ,  B29B11/06 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2002/14362 ,  H01L2924/181 ,  H01L2924/186

Abstract: A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.

Abstract translation: 流体引导组件可以包括模制支撑体，其包含改性环氧模塑化合物，其包括环氧树脂，交联剂，填料，并且不含脱蜡剂。 组件还可以包括附接到模制支撑件的硅模具，并且其中硅模具和模制支撑件限定流体引导通道。