摘要:
A memory system is provided that enhances the memory bandwidth available through a memory module. The memory system includes a memory hub device integrated into a memory module, a first memory device data interface integrated that communicates with a first set of memory devices and a second memory device data interface integrated that communicates with a second set of memory devices. In the memory system, the first set of memory devices are spaced in a first plane and coupled to a substrate of the memory module and the second set of memory devices are spaced in a second plane above the first plane and coupled to the substrate. In the memory system, data buses of the first set of memory devices are coupled to the substrate separately from data buses of the second set of memory devices.
摘要:
A memory system is provided that enhances the memory bandwidth available through a memory module. The memory system includes a memory hub device integrated in a memory module. The memory system includes a first memory device data interface integrated in the memory hub device that communicates with a first set of memory devices integrated in the memory module. The memory system also includes a second memory device data interface integrated in the memory hub device that communicates with a second set of memory devices integrated in the memory module. In the memory system, the first set of memory devices are separate from the second set of memory devices. In the memory system, the first and second set of memory devices are communicated with by the memory hub device via the separate first and second memory device data interfaces.
摘要:
A memory system is provided that enhances the memory bandwidth available through a memory module. The memory system includes a memory controller and a memory module coupled to the memory controller. In the memory system, the memory controller is coupled to the memory module via at least two independent memory channels. In the memory system, the at least two independent memory channels are coupled to one or more memory hub devices of the memory module.
摘要:
A memory subsystem system including a rectangular printed circuit card having a first side and a second side, a length of between 149.5 and 153.5 millimeters, and first and second ends having a width smaller than the length. The memory system also includes a first plurality of pins on the first side extending along a first edge of the card that extends the length of the card, and a second plurality of pins on the second side extending on the first edge of the card. The memory system further includes a positioning key having it center positioned on the first edge of the card and located between 84.5 and 88.5 millimeters from the first end of the card and located between 62.5 and 66.5 millimeters from the second end of the card.
摘要:
A hub device, memory system, and method for providing a cascade interconnect memory system with enhanced reliability. The hub device includes an interface to a high-speed bus for communicating with a memory controller. The memory controller and the hub device are included in a cascade interconnect memory system and the high-speed bus includes bit lanes and one or more clock lanes. The hub device also includes a bi-directional fault signal line in communication with the memory controller and readable by a service interface. The hub device also includes a fault isolation register (FIR) for storing information about failures detected at the hub device, the information including severity levels of the detected failures. In addition, the hub device includes error recovery logic for responding to a failure detected at the hub device. Responding to the error includes recording a severity level of the failure in the FIR and taking an action at the hub device that is responsive to the severity level of the failure. The action includes one or more of fast clock stop, setting the bi-directional fault indicator, setting cyclical redundancy code (CRC) bits and transmitting them to the memory controller, re-try, sparing out a bit lane and sparing out a clock lane.
摘要:
A memory module including a plurality of memory channel connectors for communicating with a memory controller via a plurality of high-speed channels. The memory module also includes a plurality of memory devices arranged in one or more ranks, and a plurality of independently operable hub devices. Each hub device includes an interface for receiving signals from and driving signals to the memory controller on one of the high-speed channels via one or more of the memory channel connectors. Each hub device also includes a plurality of independently operable ports to communicate with all or a subset of the ranks of memory devices.
摘要:
A memory system is provided that supports partial cache line write operations to a memory module to reduce write data traffic on a memory channel. The memory system comprises a memory hub device integrated in the memory module and a set of memory devices coupled to the memory hub device. The memory hub device comprises burst logic integrated in the memory hub device. The burst logic determines an amount of write data to be transmitted to the set of memory devices and generates a burst length field corresponding to the amount of write data. The memory hub also comprises a memory hub controller integrated in the memory hub device. The memory hub controller controls the amount of write data that is transmitted using the burst length field. The memory hub device transmits the amount of write data that is equal to or less than a conventional data burst amount.
摘要:
A memory system is provided that manages thermal conditions at a memory device level transparent to a memory controller. The memory systems comprises a memory hub device integrated in a memory module, a set of memory devices coupled to the memory hub device, and a first set of thermal sensors integrated in the set of memory devices. A thermal management control unit integrated in the memory hub device monitors a temperature of the set of memory devices sensed by the first set of thermal sensors. The memory hub device reduces a memory access rate to the set of memory devices in response to a predetermined thermal threshold being exceeded thereby reducing power used by the set of memory devices which in turn decreases the temperature of the set of memory devices.
摘要:
A memory system is provided that enhances the memory bandwidth available through a memory module. The memory system includes a memory hub device integrated into a memory module, a first memory device data interface integrated that communicates with a first set of memory devices and a second memory device data interface integrated that communicates with a second set of memory devices. In the memory system, the first set of memory devices are spaced in a first plane and coupled to a substrate of the memory module and the second set of memory devices are spaced in a second plane above the first plane and coupled to the substrate. In the memory system, data buses of the first set of memory devices are coupled to the substrate separately from data buses of the second set of memory devices.
摘要:
A memory system is provided that enhances the memory bandwidth available through a memory module. The memory system includes a memory controller and a memory module coupled to the memory controller. In the memory system, the memory controller is coupled to the memory module via at least two independent memory channels. In the memory system, the at least two independent memory channels are coupled to one or more memory hub devices of the memory module.