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公开(公告)号：US10383234B2
公开(公告)日：2019-08-13
申请号：US15749683
申请日：2017-05-01
Applicant: NISSHA CO., LTD.
Inventor： Seiichi Yamazaki , Toshihiro Iga , Yasuisa Takinishi
IPC: H05K1/11 , H05K1/02 , B29C45/14 , B32B27/08 , H05K3/32 , H05K3/00 , H05K1/18 , B29C70/72 , B29L31/34
Abstract: A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pattern, the first film not being covered by the resin molded body; and a second film that stands on the first surface, and that includes a second lead-out wire electrically connected to the first lead-out wire, the second film having a rectangular shape, and the resin molded body includes a pair of support wall portions formed integrally with the first surface so as to stand on the first surface and clamp both ends of a base part of the second film.
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公开(公告)号：US20190234818A1
公开(公告)日：2019-08-01
申请号：US16344002
申请日：2017-10-31
Applicant: NISSHA CO., LTD.
Inventor： Hideaki NADA , Atsuo INOUE
CPC classification number: G01L5/0052 , G01L5/00 , G01L5/0028 , G06F3/0414
Abstract: A pressure sensor includes a first insulating base material, a common electrode formed to extend on a principal surface of the first insulating base material, a second insulating base material disposed to face the principal surface of the first insulating base material, a plurality of individual electrodes provided in a paved manner facing the common electrode, over a principal surface of the second insulating base material on a side of the first insulating base material, a pressure sensitive layer overlaid on at least one of the plurality of individual electrodes and the common electrode, a plurality of thin film transistors provided on a side opposite to the principal surface of the second insulating base material, and first individual spacers and second individual spacers disposed among the plurality of individual electrodes on the principal surface of the second insulating base material to face the common electrode.
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公开(公告)号：US20190064093A1
公开(公告)日：2019-02-28
申请号：US16160164
申请日：2018-10-15
Applicant: Nissha Co., Ltd.
Inventor： Yuki URA , Muneharu SHIMABUKURO , Shinichi MATSUMOTO
IPC: G01N27/12
Abstract: A gas sensor device includes a package including a cap in which a through hole for taking gas is formed and a base in which a recessed portion is formed. The cap is attached to the base so that a space is defined around the recessed portion. The device includes metal electrodes fixed to portions surrounding the recessed portion and embedded in the base. The device includes a gas detecting element, which includes a gas detector having a coil-shaped heater that is heated when detecting a predetermined gas, and a plurality of metal lead wires extending from the gas detector to the electrodes. The gas detecting element is held in a suspended state in the recessed portion and/or a space above the recessed portion with the plurality of lead wires, so that the gas detecting element, which includes the heater, does not make contact with walls of the recessed portion.
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公开(公告)号：US09933877B2
公开(公告)日：2018-04-03
申请号：US15113947
申请日：2015-02-16
Applicant: NISSHA CO., LTD.
Inventor： Yuji Watazu , Naoto Imae , Keisuke Ozaki , Eiji Kakutani , Junichi Shibata
CPC classification number: G06F3/0414 , G01L1/146 , G06F3/044
Abstract: Problem: To achieve a pressure sensitive sensor capable of suppressing a drop in the accuracy of detecting a pressing force even in cases where the ambient temperature changes.Resolution means: A pressure sensitive sensor (7) includes: an elastically deformable covering member (10A) covering a front surface side; a variable resistance electrode (42A), electrical resistance thereof changing in response to a change in posture; a pyroelectric material layer (50) disposed covering the variable resistance electrode (42A); and a pair of charge detection electrodes (51, 52) disposed on both sides of the pyroelectric material layer (50) in a layering direction (L).
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公开(公告)号：US20250052627A1
公开(公告)日：2025-02-13
申请号：US18718310
申请日：2023-03-23
Applicant: NISSHA CO.,LTD.
Inventor： Takashi YOKOYAMA
IPC: G01L1/22
Abstract: [Object]
To provide a pressure detection panel that allows suppressing the cost required for an FPC and obtaining in-plane uniformity of a detection signal of a pressing force even when a panel size is large.
[Solution]
A pressure detection panel 1 of the present invention includes a surface panel 2 and one strain sensor 3 arranged on a back surface of the surface panel 2 in a strip shape along one side of the surface panel 2. The strain sensor 3 includes sensitive units R1, R2, and R3 at an intermediate portion and both end portions in a longitudinal direction. The adjacent sensitive units, that is, the sensitive units R1 and R2 and the sensitive units R2 and R3, are mutually connected in series by a wiring line 31.-
Patent Agency Ranking
公开(公告)号：US12074388B2
公开(公告)日：2024-08-27
申请号：US17776725
申请日：2020-11-11
Applicant: NISSHA CO., LTD. , INU RESEARCH & BUSINESS FOUNDATION
Inventor： In Yeol Moon , Ryomei Omote , Yoshihiro Sakata , Toshifumi Kurosaki , Shohei Morimoto , Sungtek Kahng , Changhyeong Lee , Yejune Seo , Gwang-gyun Namgung , Munsu Jeon
Abstract: A decrease in performance of an antenna is suppressed while maintaining metallic design by a metal vapor deposition layer in a cover with antenna function. A back cover includes cover member, a pictorial pattern layer, and a metasurface. The pictorial pattern layer is arranged in a layering direction with respect to the cover member and includes a metal vapor deposition layer. The metasurface is arranged side by side in the layering direction with the pictorial pattern layer. The metasurface amplifies an antenna signal.
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公开(公告)号：US20240258560A1
公开(公告)日：2024-08-01
申请号：US18564096
申请日：2022-05-18
Applicant: NISSHA Co., Ltd.
Inventor： Keiichiro UENAE , Junji AKIMOTO , Hideaki NAGAI , Seiichi YANO
CPC classification number: H01M10/0525 , H01M4/483 , H01M4/622 , H01M4/625 , H01M2004/021 , H01M2004/027 , H01M4/505 , H01M4/525
Abstract: Disclosed is a nonaqueous electrolyte secondary battery having improved electron conductivity of an electrode and improved input and output characteristics. The nonaqueous electrolyte secondary battery includes a positive electrode containing a lithium-containing transition metal composite oxide as an active material, a negative electrode, and a nonaqueous electrolyte. The negative electrode contains titanium oxide particles that are particles of titanium oxide represented by general formula H2Ti12O25, a binder, and 0.3-5.0 weight percent of single wall carbon nanotubes with respect to the titanium oxide. The titanium oxide particles have a secondary particle size D50 of 1 to 15 μm and a secondary particle size D90 of 50 μm or less.
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公开(公告)号：US20240227258A9
公开(公告)日：2024-07-11
申请号：US18546801
申请日：2022-01-28
Applicant: NISSHA CO., LTD.
Inventor： Yasuisa TAKINISHI , Chuzo TANIGUCHI , Eiji KAWASHIMA , Hajime NAKAGAWA , Takenori YOSHIDA
CPC classification number: B29C45/14065 , B29C45/14631 , B29C45/14655 , H05K3/0014 , H05K7/1427
Abstract: An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.
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公开(公告)号：US20240131758A1
公开(公告)日：2024-04-25
申请号：US18546801
申请日：2022-01-28
Applicant: NISSHA CO., LTD.
Inventor： Yasuisa TAKINISHI , Chuzo TANIGUCHI , Eiji KAWASHIMA , Hajime NAKAGAWA , Takenori YOSHIDA
CPC classification number: B29C45/14065 , B29C45/14631 , B29C45/14655 , H05K3/0014 , H05K7/1427
Abstract: An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.
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公开(公告)号：US11958219B2
公开(公告)日：2024-04-16
申请号：US16961652
申请日：2019-03-25
Applicant: Nissha Co., Ltd.
Inventor： Tatsuo Ito , Kenji Okumura , Jun Sasaki , Daichi Hama , Masaru Terashita
IPC: B29C44/12 , B29K105/04 , B29L31/34
CPC classification number: B29C44/1266 , B29K2105/04 , B29L2031/3475
Abstract: The present disclosure provides a foam molded product and a manufacturing method. The foam molded product is includes a foam body, an insert material having a display unit or a detection unit attached to the foam body, and a surface material affixed to a surface to which at least the insert material is attached. A manufacturing method includes: preparing a pair of molds including a first mold and a second mold; affixing an insert material and a surface material together such that the surface material is in contact with a molding surface of the first mold; closing the pair of molds; injecting a foam resin into a molding space formed by closing the molds; foaming the foam resin to form a foam body; opening the pair of molds; and removing a molded product in which the affixed part and the foam body are integrated.
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