-
公开(公告)号：US20250096583A1
公开(公告)日：2025-03-20
申请号：US18965639
申请日：2024-12-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyungwook CHOI
Abstract: This electronic device may comprise: a first battery cell and a second battery cell connected in series to the first battery cell; a charging circuit configured to supply power of a first specified voltage from the outside to the first battery cell and the second battery cell; and at least one processor, comprising processing circuitry, individually and/or collectively, configured to control an overcharging protection operation voltage of the first battery cell and the second battery cell to a second specified voltage, wherein at least one processor, individually and/or collectively, is configured to; identify the voltage of the first battery cell and the voltage of the second battery cell while the first battery cell and the second battery cell are charged using the power of the first specified voltage; accumulate the number of times of overcharging protection operation for a battery cell having a voltage higher than the second specified voltage, based on at least one voltage among the voltage of the first battery cell and the voltage of the second battery cell being greater than the second specified voltage; and set an overcharging protection operation voltage for a battery cell having a voltage greater than the second specified voltage as a third specified voltage less than the second specified voltage, based on the number of times of the overcharging protection operation for the battery cell having a voltage greater than the second specified voltage reaches a specified number of times.
-
公开(公告)号：US20250096483A1
公开(公告)日：2025-03-20
申请号：US18970093
申请日：2024-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Elena Aleksandrovna SHEPELEVA , Artem Rudolfovich VILENSKIY , Gennadiy Alexandrovich EVTYUSHKIN , Anton Sergeevich LUKYANOV
Abstract: The disclosure relates to radio engineering, and more specifically, to a wide scan angle antenna array. Technical result consists in expanding the scanning range, increasing the efficiency of the antenna array and reducing losses. Antenna array is provided. The antenna array includes a plurality of antenna array elements, and a metasurface disposed above the antenna array, wherein the metasurface is a dielectric layer having, on a first side thereof, conductive elements configured to reflect part of radiation of the antenna array; the distance between the antenna array and the metasurface is based on an integer number of half wavelengths, an operating wavelength of the antenna array in a medium in the space between the antenna array and the metasurface, and a predetermined scanning angle of the antenna array.
-
公开(公告)号：US20250096211A1
公开(公告)日：2025-03-20
申请号：US18963643
申请日：2024-11-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangnam JEONG , Yunhee LEE
IPC: H01L25/16 , H01L23/00 , H01L23/498 , H01L25/065
Abstract: Provided are an integrated voltage regulator (IVR) package with a minimized size including one or more inductors and one or more capacitors together with an IVR chip and improving characteristics of a voltage regulator (VR), and an IVR system package including the IVR package. The IVR package includes a package substrate, a stacked structure mounted on the package substrate and having a stack structure in which a passive device chip including one or more capacitors and an IVR chip including a voltage regulator are stacked, and an intermediate substrate disposed on the package substrate in a structure surrounding the stacked structure, the intermediate substrate including vias therein. The one or more inductors are included in the stacked structure or the intermediate substrate.
-
公开(公告)号：US20250096184A1
公开(公告)日：2025-03-20
申请号：US18653734
申请日：2024-05-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jihwan KIM
IPC: H01L23/00 , H01L23/373 , H01L25/065
Abstract: A chip bonding film is provided and includes an adhesive film layer that is curable by heat, and fillers that are thermally conductive and are contained in the adhesive film layer, each of the fillers including magnetic particles, wherein a heat dissipation path is formed by the fillers in a vertical direction from a lower surface to an upper surface of the adhesive film layer.
-
公开(公告)号：US20250096158A1
公开(公告)日：2025-03-20
申请号：US18966367
申请日：2024-12-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongyoun KIM
IPC: H01L23/00 , H01L21/48 , H01L21/56 , H01L21/683 , H01L21/78 , H01L23/31 , H01L23/367 , H01L23/538
Abstract: A semiconductor package includes a semiconductor chip, a redistribution insulating layer having a first opening, and an external connection bump including a first portion filling the first opening. A lower bump pad includes a first surface and a second surface opposite the first surface. The first surface includes a contact portion that directly contacts the first portion of the external connection bump and a cover portion surrounding side surfaces of the contact portion. A first conductive barrier layer surrounds side surfaces of the lower bump pad and is disposed between the lower bump pad and the redistribution insulating layer. A redistribution pattern directly contacts the second surface of the lower bump pad and is configured to electrically connect the lower bump pad to the semiconductor chip.
-
Patent Agency Ranking
公开(公告)号：US20250096099A1
公开(公告)日：2025-03-20
申请号：US18751036
申请日：2024-06-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： JAESUN KIM , HEEYOUB KANG , EUNKYEONG PARK , YISEUL HAN
IPC: H01L23/498 , H01L23/00 , H01L23/31 , H01L23/367 , H01L25/18 , H10B80/00
Abstract: A semiconductor package may include a lower redistribution structure having a lower redistribution layer, a lower chip structure on the lower redistribution structure, the lower chip structure including a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a plurality of first posts on a side of the second semiconductor chip and electrically connected to the first semiconductor chip, and a first encapsulant covering the first semiconductor chip, the second semiconductor chip, and the plurality of first posts, a plurality of second posts on a side of the lower chip structure and electrically connected to the lower redistribution layer, a second encapsulant covering the lower chip structure and each of the plurality of second posts, connection vias passing through a portion of the second encapsulant, and electrically connected to the plurality of first posts, and an upper redistribution structure on the second encapsulant.
-
公开(公告)号：US20250096024A1
公开(公告)日：2025-03-20
申请号：US18962104
申请日：2024-11-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taegeon KIM
IPC: H01L21/673
Abstract: A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.
-
公开(公告)号：US20250095653A1
公开(公告)日：2025-03-20
申请号：US18965517
申请日：2024-12-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yeonho LEE , Sangwook Park , Kookjin Yeo
Abstract: A hub device, a multi-device system including the hub device, and a method of operating the same may include: converting, by the hub device, received voice input into text; identifying, by the hub device, a device capable of performing an operation corresponding to the text; identifying which device stores a function determination model corresponding to the device capable of performing the operation corresponding to the text, from among the hub device, and a plurality of other devices connected to the hub device; and based on the identified device that stores the function determination model being a device that is different from the hub device, transmitting at least part of the text to the identified device.
-
89.发明申请公开(公告)号：US20250095638A1
公开(公告)日：2025-03-20
申请号：US18891686
申请日：2024-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaejin CHO , Rakshith Sharma Srinivasa , Chou-chang Yang , Yashas Malur Saidutta , Ching-Hua Lee , Yilin Shen , Hongxia Jin
IPC: G10L15/06 , G10L15/18 , G10L15/183
Abstract: A method includes: receiving one or more training text sentences; generating one or more training vectors based on inputting the one or more training sentences input into a text encoder, the one or more training vectors corresponding to one or more operations that an electronic device is configured to perform; generating one or more speech vectors based on one or more speech utterances input into a speech encoder; generating a similarity matrix that compares each of the one or more training vectors with each of the one or more speech vectors; and updating at least one of the text encoder and the speech encoder based on the similarity matrix.
-
90.发明申请公开(公告)号：US20250095305A1
公开(公告)日：2025-03-20
申请号：US18962983
申请日：2024-11-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyeonjin KIM , Haemi Yoon , Hyunwoo KIM , Minji CHO
Abstract: A wearable device includes: a display; and at least one processor, wherein the at least one processor is configured to: receive an input indicating selection of a first external electronic device and a second external electronic device among a plurality of external electronic devices viewable through the display; based on the input, identify third external electronic devices in a category including both the first external electronic device and the second external electronic device, and identify the first external electronic device and the second external electronic device along with the third external electronic devices; display a first visual object and a second visual object respectively indicating that the first external electronic device and the second external electronic device are selected; and display at least one third visual object guiding selection of at least one fourth external electronic device among the third external electronic devices.
-
-
-
-
-
-
-
-
-
Search Results
149398
records
(took 0.109 seconds)
