公开(公告)号：US20240055286A1

公开(公告)日：2024-02-15

申请号：US18183520

申请日：2023-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegeon KIM

IPC: H01L21/673

CPC classification number: H01L21/67333

Abstract: A module tray for a semiconductor device includes a case and an insert block. The case includes a base plate, first and second sidewalls extending from opposite sides of the base plate in a vertical direction to define an accommodation space, and first and second fastening grooves respectively formed in inner surfaces of the first and second sidewalls. The first and second fastening grooves have upper ends opened to upper surfaces of the first and second sidewalls, respectively. The insert block has a substrate accommodating space for accommodating a semiconductor substrate. The insert block is detachably inserted into the first and second fastening grooves of the case. The insert block has first and second fastening joints extending in the vertical direction such that the first and second fastening joint are respectively inserted through the upper ends of the first and second fastening grooves.

公开(公告)号：US20240128107A1

公开(公告)日：2024-04-18

申请号：US18143670

申请日：2023-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taegeon KIM

IPC: H01L21/673

CPC classification number: H01L21/67363 ,  H01L21/67356 ,  H01L21/67386

Abstract: A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.

公开(公告)号：US20240128105A1

公开(公告)日：2024-04-18

申请号：US18367655

申请日：2023-09-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taegeon KIM

IPC: H01L21/673 ,  B65D43/02 ,  B65D51/24

CPC classification number: H01L21/6735 ,  B65D43/0202 ,  B65D51/245 ,  B65D2203/02 ,  B65D2203/10 ,  B65D2543/00027 ,  B65D2543/00194

Abstract: A cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. The card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.

公开(公告)号：US20250096024A1

公开(公告)日：2025-03-20

申请号：US18962104

申请日：2024-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegeon KIM

IPC: H01L21/673

Abstract: A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.

公开(公告)号：US20240404855A1

公开(公告)日：2024-12-05

申请号：US18586791

申请日：2024-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegeon KIM

IPC: H01L21/673

Abstract: A module tray for a semiconductor device includes a case body defining at least one cavity therein to accommodate a semiconductor substrate on a bottom surface of the cavity. The case body defining first and second inner walls of the at least one cavity extending parallel to each other in a first horizontal direction and having first and second end portions, third and fourth inner walls of the at least one cavity extending parallel to each other in a second horizontal direction orthogonal to the first horizontal direction and having third and fourth end portions, and first to fourth guide grooves of the at least one cavity respectively extending to connect the first to fourth end portions to each other, the first to fourth guide grooves having a concave shape to be spaced apart from corner portions of the semiconductor substrate that is accommodated into the cavity.