公开(公告)号：US11637540B2

公开(公告)日：2023-04-25

申请号：US16669499

申请日：2019-10-30

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Lei Liu ,  Ronald S. Cok

IPC: H03H9/02 ,  H03H3/02

Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.

公开(公告)号：US20220112078A1

公开(公告)日：2022-04-14

申请号：US17066448

申请日：2020-10-08

Applicant: X-Celeprint Limited

Inventor： Pierluigi Rubino

IPC: B81C1/00

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US20210342659A1

公开(公告)日：2021-11-04

申请号：US16865257

申请日：2020-05-01

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Robert R. Rotzoll

IPC: G06K19/02 ,  G06K19/07 ,  G06K19/077

Abstract: A hybrid document includes a flexible document having visible markings. One or more light-controlling elements and a controller are embedded in or on the flexible document. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. In some embodiments, the controller includes a memory and a value can be stored in the memory and displayed by the light-controlling element(s). In some embodiments, the value can be assigned or varied by a hybrid currency teller machine.

公开(公告)号：US11152395B1

公开(公告)日：2021-10-19

申请号：US17096688

申请日：2020-11-12

Applicant: X-Celeprint Limited

Inventor： Joseph Carr ,  Ronald S. Cok

IPC: H01L27/12 ,  H01L21/84 ,  H01L21/78 ,  H01L29/76

Abstract: A monolithic multi-FET transistor comprises an epitaxial layer disposed on a dielectric layer. The epitaxial layer comprises a crystalline semiconductor material and a multi-FET area. An isolation structure surrounds the multi-FET area and divides the multi-FET area into separate FET portions. A gate disposed on a gate dielectric extends over each FET portion. A source and a drain are each disposed on opposite sides of the gate on the epitaxial layer within each FET portion. Each gate, source, and drain comprise a separate electrical conductor and the gate, source, drain, and epitaxial layer within each FET portion form a field-effect transistor. Gate, source, and drain contacts electrically connect the gates, sources, and drains of the separate FET portions, respectively. At least the sources or drains of two neighboring FET portions are disposed in common over at least a portion of the isolation structure dividing the two neighboring FET portions.

公开(公告)号：US20210246017A1

公开(公告)日：2021-08-12

申请号：US17244469

申请日：2021-04-29

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC: B81B7/00 ,  B81C1/00 ,  H01L41/23 ,  H01L41/053

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US20210198100A1

公开(公告)日：2021-07-01

申请号：US17201661

申请日：2021-03-15

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC: B81B7/00 ,  B81C1/00 ,  H01L41/23 ,  H01L41/053

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US20210135648A1

公开(公告)日：2021-05-06

申请号：US16669499

申请日：2019-10-30

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Lei Liu ,  Ronald S. Cok

IPC: H03H9/02 ,  H03H3/02

Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.

公开(公告)号：US20210061645A1

公开(公告)日：2021-03-04

申请号：US17098241

申请日：2020-11-13

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC: B81B7/00 ,  H01L41/23 ,  B81C1/00 ,  H01L41/053

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US20210002128A1

公开(公告)日：2021-01-07

申请号：US17027671

申请日：2020-09-21

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC: B81B7/00 ,  B81C1/00 ,  H01L41/053 ,  H01L41/23

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US10804880B2

公开(公告)日：2020-10-13

申请号：US16207804

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok

IPC: H03H9/64 ,  H03H9/54 ,  H03H9/05

Abstract: A device structure comprises an acoustic wave transducer comprising a component. The component comprises a piezo-electric material. Component electrodes are disposed on the component and connection posts extend away from the component. Each of the connection posts is electrically connected to one of the component electrodes. The component has a center and a length greater than a width and, for at least one pair of the connection posts, a distance between the connection posts and the center is less than one quarter of the length.