公开(公告)号：US06894773B2

公开(公告)日：2005-05-17

申请号：US09805188

申请日：2001-03-14

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

IPC分类号： G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/12

摘要： A processing method for semiconductor devices in a semiconductor fabrication line includes processing a substrate in a first processing apparatus, transferring the substrate processed in the first processing apparatus to a detecting apparatus without removal of the substrate from the semiconductor fabrication line while continuing fabrication of the semiconductor devices, detecting foreign particle defects on the substrate transferred to the detecting apparatus, and determining a foreign particle generation condition of the processing apparatus based on a data from the detecting.

摘要翻译： 半导体制造线中的半导体器件的处理方法包括在第一处理设备中处理衬底，将在第一处理设备中处理的衬底转移到检测设备，而不从半导体制造线移除衬底，同时继续制造半导体 检测转移到检测装置的基板上的异物缺陷，以及根据来自检测的数据确定处理装置的异物生成条件。

公开(公告)号：US5463459A

公开(公告)日：1995-10-31

申请号：US46720

申请日：1993-04-16

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

IPC分类号： G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68 ,  G01N21/89 ,  G02B27/46 ,  G06F15/46

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623 ,  G01R31/308 ,  H01J37/00 ,  H01L21/67253 ,  H01L21/67288 ,  G01N2021/8822 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L22/12

摘要： A defect detecting apparatus including an illumination system for radiating a light of a plane wave linearly to a substrate having repetitive patterns of different pitches; a focusing optical system for focusing a light image reflected from the substrate thus illuminated by the illumination system; a spatial filter disposed intermediate the focusing optical system so as to shield a diffraction light from repetitive patterns of a small pitch on the substrate; a detector for detecting the light image formed by the focusing optical system; an erasing means for comparing and erasing signals which are generated on the basis of repetitive patterns of a large pitch and obtained through the spatial filter, out of signals detected by the detector; and a defect detecting means for detecting defects on the substrate in accordance with a signal detected by the detector, as well as a method applied to the said apparatus.

摘要翻译： 一种缺陷检测装置，包括用于将平面波的光线线性地发射到具有不同间距的重复图案的基板的照明系统; 聚焦光学系统，用于聚焦由照明系统照射的从基板反射的光图像; 设置在聚焦光学系统之间的空间滤光器，以便屏蔽来自基板上的小间距的重复图案的衍射光; 用于检测由聚焦光学系统形成的光图像的检测器; 擦除装置，用于根据由检测器检测到的信号，比较和擦除基于大间距的重复图案并通过空间滤波器获得的信号; 以及缺陷检测装置，用于根据由检测器检测的信号检测基板上的缺陷，以及应用于所述装置的方法。

公开(公告)号：US07177020B2

公开(公告)日：2007-02-13

申请号：US11128352

申请日：2005-05-13

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

IPC分类号： G01J3/00

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/12

摘要： An apparatus and method for detecting defects on a specimen includes an illumination optical unit which obliquely projects a laser onto a region which is longer in one direction on a surface of a specimen than in a transverse direction, a table unit which mounts the specimen and which is movable, a detection optical unit which detects light from the specimen illuminated by the laser with an image sensor while the table is moving, and a signal processor. The signal processor processes a signal outputted from the image sensor of the detection optical unit and converted to a digital signal and extracts defects of the specimen by comparing the converted digital signal with a reference digital signal. A display unit displays information of defects extracted by the signal processor.

摘要翻译： 用于检测试样缺陷的装置和方法包括照射光学单元，其将激光倾斜地突出到在一个方向上在一个方向上比在横向方向上更长的区域，安装样本的台单元， 可移动的检测光学单元，检测光学单元，其在桌子移动时利用图像传感器检测由激光照射的样本的光，以及信号处理器。 信号处理器处理从检测光学单元的图像传感器输出的信号并转换为数字信号，并通过将转换的数字信号与参考数字信号进行比较来提取样本的缺陷。 显示单元显示由信号处理器提取的缺陷的信息。

公开(公告)号：US07511806B2

公开(公告)日：2009-03-31

申请号：US11931120

申请日：2007-10-31

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/00

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concave-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， 其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比值表示，其中第二方向与第 第一个方向。

公开(公告)号：US20070153264A1

公开(公告)日：2007-07-05

申请号：US11714196

申请日：2007-03-06

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/88

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， ，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第 第一个方向。

公开(公告)号：US07187438B2

公开(公告)日：2007-03-06

申请号：US10050776

申请日：2002-01-18

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/00

CPC分类号： G01N21/9501

摘要： The present invention is characterized by the following: incident illumination and oblique illumination are performed on a scratch and a foreign material, which have been made on a surface of a polished or a ground insulating layer, with substantially the same luminous flux; and on the basis of a correlation such as a ratio of intensity of scattered light generated by the shallow scratch and the foreign material between the incident illumination and the oblique illumination, the shallow scratch is discriminated from the foreign material.

摘要翻译： 本发明的特征在于：在具有基本上相同的光通量的在抛光或接地绝缘层的表面上制成的划痕和异物进行入射照明和倾斜照明; 并且基于由浅划痕产生的散射光的强度与入射照明与倾斜照明之间的异物的比例的相关性，浅色划痕被鉴别为异物。

公开(公告)号：US20080117415A1

公开(公告)日：2008-05-22

申请号：US11931120

申请日：2007-10-31

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/898

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， ，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第 第一个方向。

公开(公告)号：US07315366B2

公开(公告)日：2008-01-01

申请号：US11714196

申请日：2007-03-06

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/00

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， ，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第 第一个方向。

公开(公告)号：US20100103409A1

公开(公告)日：2010-04-29

申请号：US12652452

申请日：2010-01-05

申请人： Yoshimasa OHSHIMA ,  Minori Noguchi ,  Hiroyuki Nakano

发明人： Yoshimasa OHSHIMA ,  Minori Noguchi ,  Hiroyuki Nakano

IPC分类号： G01N21/88

CPC分类号： G01N21/9505 ,  G01N21/47 ,  G01N21/94 ,  G01N21/9501

摘要： An inspection apparatus projects a laser beam on the surface of a SOI wafer and detects foreign matter on and defects in the surface of the SOI wafer by receiving scattered light reflected from the surface of the SOI wafer. The wavelength of the laser beam used by the inspection apparatus is determined so that a penetration depth of the laser beam in a Si thin film may be 10 nm or below to detect only foreign matter on and defects in the outermost surface and not to detect foreign matter and defects in a BOX layer. Only the foreign matter on and defects in the outermost surface layer can be detected without being influenced by thin-film interference by projecting the laser beam on the surface of the SOI wafer and receiving scattered light rays.

摘要翻译： 检查装置将激光束投射在SOI晶片的表面上，通过接收从SOI晶片的表面反射的散射光来检测SOI晶片的异物和表面的缺陷。 确定检查装置使用的激光束的波长，使得Si薄膜中的激光束的穿透深度可以为10nm以下，仅检测异物和最外表面的缺陷，并且不检测外部 BOX层的物质和缺陷。 只有通过将激光束投射在SOI晶片的表面上并且接收散射光线，才能够检测出最外层的异物和缺陷，而不受薄膜干涉的影响。

公开(公告)号：US5274434A

公开(公告)日：1993-12-28

申请号：US778363

申请日：1991-10-17

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Yuzo Taniguchi

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Yuzo Taniguchi

IPC分类号： G01N21/94 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68 ,  G01N21/89 ,  G02B27/46 ,  G06F15/46

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01R31/308 ,  H01J37/00 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/67288 ,  H01L22/20 ,  G01N2021/8822 ,  G01N21/95623 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L22/12

摘要： In a mass production line of a semiconductor manufacturing process, foreign particle inspection method and apparatus for preventing occurrence of large quantities of defects and for keeping a necessary yield. The inspection apparatus is made up in a small-sized apparatus and disposed at inlet/outlet of processing apparatuses of the production line or to a transfer system between the processing apparatuses. The inspection apparatus includes at least one monitor for real-time sampling foreign particles possible deposited on wafer which is being carried by the transfer system, thereby enabling simplification in construction of the production line and reduction of manufacturing cost. The inspection apparatus may comprise a refractive index changeable type lens array, a spatial filter and a pattern data elimination circuit, and makes possible to conduct foreign particle inspection on repetitively-patterned portions of the wafers during transfer. With the spatial filter for eliminating repetitive data of the repetition patterns the small-sized compact inspection apparatus is capable of real-time inspecting the foreign particles on the wafers at a high speed.

摘要翻译： 在半导体制造方法的大规模生产线中，用于防止发生大量缺陷并保持必要成品率的外来颗粒检查方法和装置。 检查装置由小型装置构成，配置在生产线的处理装置的出入口处或处理装置之间的转印系统。 该检查装置包括至少一个监视器，用于实时采样可能沉积在由转印系统携带的晶片上的异物，从而能够简化生产线的构造和降低制造成本。 检查装置可以包括折射率可变型透镜阵列，空间滤光器和图案数据消除电路，并且可以在转印期间对晶片的重复构图部分进行异物检查。 利用用于消除重复图案的重复数据的空间滤波器，小型紧凑型检查装置能够以高速实时检查晶片上的异物。