公开(公告)号：US20050051906A1

公开(公告)日：2005-03-10

申请号：US10657686

申请日：2003-09-08

申请人： Jianqi He ,  Yuan-Liang Li ,  Michael Walk

发明人： Jianqi He ,  Yuan-Liang Li ,  Michael Walk

IPC分类号： H01L23/498 ,  H01L23/48

CPC分类号： H01L23/50 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/19041

摘要： A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive elements of an integrated circuit die, and the second conductive elements may receive a first plurality of the input/output signals from respective ones of the first conductive elements. A lower surface of the package may include third conductive elements, the third conductive elements to receive a second plurality of the input/output signals from respective other ones of the first conductive elements.

公开(公告)号：US06624444B1

公开(公告)日：2003-09-23

申请号：US10109314

申请日：2002-03-28

申请人： Yuan-Liang Li

发明人： Yuan-Liang Li

IPC分类号： H01L2904

CPC分类号： G02B6/43 ,  G02B6/4232 ,  H01L31/12 ,  H01L2224/16225

摘要： An optical-electrical (OE) package includes a substrate electrically coupled to a motherboard via one or more capacitor DC shunts (CDCSs). In one embodiment, the substrate includes an IC chip electrically coupled to a first set of contact-receiving members on an upper surface of the substrate. The substrate also includes a light-emitting package and a photodetector package electrically coupled to respective second and third sets of contact-receiving members on the substrate lower surface. The substrate has internal wiring that electrically interconnects the IC chip, the light-emitting package and the photodetector array. The light-emitting package and the photodetector array are optically coupled to respective first and second waveguide arrays formed in or on the motherboard. The CDCSs mitigate noise generated by the IC chip by serving as a local current source.

摘要翻译： 光电（OE）封装包括经由一个或多个电容器DC分路（CDCS）电耦合到母板的基板。 在一个实施例中，衬底包括电连接到衬底的上表面上的第一组接触件的IC芯片。 衬底还包括发光封装和光电检测器封装，电耦合到衬底下表面上相应的第二组和第三组接触件。 衬底具有将IC芯片，发光封装和光电检测器阵列电互连的内部布线。 发光封装和光电检测器阵列光学耦合到形成在母板中或母板上的相应的第一和第二波导阵列。 CDCS通过作为本地电流源来减轻由IC芯片产生的噪声。