公开(公告)号：US20060012780A1

公开(公告)日：2006-01-19

申请号：US11180536

申请日：2005-07-14

申请人： Hidetoshi Nishiyama ,  Yukihiro Shibata ,  Shunji Maeda ,  Minoru Yoshida

发明人： Hidetoshi Nishiyama ,  Yukihiro Shibata ,  Shunji Maeda ,  Minoru Yoshida

IPC分类号： G01N21/88

CPC分类号： G01N21/95 ,  G01N2021/9513

摘要： A method of inspecting pattern defects can detect target defects in various processes stably by reducing erroneous detection of grains and morphology and decreasing the influence of an intensity nonuniformity in interference light. For this purpose, lights emitted from two sources of illumination capable of outputting a plurality of wavelengths are reflected by a beam splitter and irradiated onto a wafer. Diffracted light from the wafer is converged by an objective lens, is made to pass through light modulation units and imaged on an image sensor in a light detection unit. Then, defects are detected in a signal processing unit. Further, the optical modulation unit is made to have a structure that uses a plurality of optical components selectively and which can be optimized according to target defects.

摘要翻译： 检查图案缺陷的方法可以通过减少误差检测晶粒和形态并减少干涉光中的强度不均匀性的影响来稳定地检测各种工艺中的目标缺陷。 为此，从能够输出多个波长的两个照明源发射的光被分束器反射并照射到晶片上。 来自晶片的衍射光被物镜会聚，使其通过光调制单元并且成像在光检测单元中的图像传感器上。 然后，在信号处理单元中检测到缺陷。 此外，光调制单元具有选择性地使用多个光学部件并且可以根据目标缺陷进行优化的结构。

公开(公告)号：US20050062963A1

公开(公告)日：2005-03-24

申请号：US10914115

申请日：2004-08-10

申请人： Minoru Yoshida ,  Shunji Maeda ,  Hidetoshi Nishiyama

发明人： Minoru Yoshida ,  Shunji Maeda ,  Hidetoshi Nishiyama

IPC分类号： G01B11/30 ,  G01N21/47 ,  G01N21/95 ,  G01N21/956 ,  G06T1/00 ,  H01L21/027 ,  H01L21/66 ,  G01N21/00 ,  G01J1/42

CPC分类号： G01N21/9501 ,  G01N21/4788 ,  G01N21/956

摘要： An apparatus for inspecting a defect, has a light source; a rotating diffuser plate for reducing coherence of light emitted from the light source after its light intensity was adjusted and its illumination range is formed; oscillating mirrors that variably change the beam whose coherence was reduced on a pupil, irradiates it onto a wafer, and forms an image thereof. An image sensor images the wafer by focusing reflected light from the wafer and detects an image signal; a camera observes the detected image; and an image processing unit detects a defect of a pattern formed on the wafer based on the detected image signal. Thus, conditions for illuminating the sample can be changed variably in an arbitrary and easy manner, and a more minute defect can be detected with high sensitivity by changing transmissivity and phase conditions of a pupil filter on the detection side.

摘要翻译： 用于检查缺陷的装置，具有光源; 旋转扩散板，用于在调整其光强度并且形成其照明范围之后，减少从光源发射的光的相干性; 可变地改变在瞳孔上相干性降低的光束的振动反射镜将其照射到晶片上并形成其图像。 图像传感器通过聚焦来自晶片的反射光来检测晶片，并检测图像信号; 相机观察检测到的图像; 并且图像处理单元基于检测到的图像信号检测在晶片上形成的图案的缺陷。 因此，照射样品的条件可以以任意和容易的方式可变地改变，并且通过改变检测侧的瞳孔滤光片的透射率和相位条件，可以以高灵敏度检测更多的微小缺陷。

公开(公告)号：US08355123B2

公开(公告)日：2013-01-15

申请号：US13368585

申请日：2012-02-08

申请人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

发明人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

IPC分类号： G01N21/88

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.

摘要翻译： 用于检查检查对象的缺陷的缺陷检查装置包括：在检查对象物上照射光束的照明器，由于照射器照射光束而检测来自被检查物体的光的光检测器， 缺陷检测器，其通过处理通过光检测器的检测获得的信号来检测缺陷;计算与缺陷的尺寸相关的特征量的特征量计算器;以及使用尺寸和特性之间的关系的缺陷尺寸计算器 通过光学模拟计算的量，并计算检测到的缺陷的尺寸。

公开(公告)号：US20110205534A1

公开(公告)日：2011-08-25

申请号：US13099530

申请日：2011-05-03

申请人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

发明人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

IPC分类号： G01N21/88

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.

摘要翻译： 用于检查检查对象的缺陷的缺陷检查装置包括：在检查对象物上照射光束的照明器，由于照射器照射光束而检测来自被检查物体的光的光检测器， 缺陷检测器，其通过处理通过光检测器的检测获得的信号来检测缺陷;计算与缺陷的尺寸相关的特征量的特征量计算器;以及使用尺寸和特性之间的关系的缺陷尺寸计算器 通过光学模拟计算的量，并计算检测到的缺陷的尺寸。

公开(公告)号：US20090153848A1

公开(公告)日：2009-06-18

申请号：US12349373

申请日：2009-01-06

申请人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

发明人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

IPC分类号： G01N21/00

CPC分类号： G01N21/956

摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.

摘要翻译： 当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。 因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。 为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。

公开(公告)号：US20090027664A1

公开(公告)日：2009-01-29

申请号：US12153853

申请日：2008-05-27

申请人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

发明人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

IPC分类号： G01N21/88

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： In a defect inspection apparatus for performing an inspection with an optical system, the dimension of a defect is measured substantially concurrently with detection of the defect. In order to promote the accuracy of measurement of the defect dimension, a collation unit is provided which collates the defect dimension by using a standard sample such as a standard grain.

摘要翻译： 在用光学系统进行检查的缺陷检查装置中，在检测缺陷的同时测量缺陷的尺寸。 为了提高缺陷尺寸的测量精度，提供了一种对照单元，其通过使用诸如标准晶粒的标准样品来校正缺陷尺寸。

公开(公告)号：US20060233434A1

公开(公告)日：2006-10-19

申请号：US11402100

申请日：2006-04-12

申请人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

发明人： Akira Hamamatsu ,  Hisae Shibuya ,  Shunji Maeda

IPC分类号： G06K9/00

CPC分类号： G06K9/2027 ,  G06K9/38 ,  G06T7/001 ,  G06T2207/30148

摘要： This invention relating to an inspection apparatus capable of classifying defects at high accuracy makes it possible to accurately extract various characteristic quantities of each defect by using the images obtained by imaging a semiconductor wafer under dark-field illumination, and providing, with respect to a differential image signal between the image signals obtained from dies near to each other in image brightness, a defect detection threshold and a characteristic quantity extraction threshold lower than the defect detection threshold.

摘要翻译： 本发明涉及能够高精度地分类缺陷的检查装置，能够通过使用通过在暗场照射下对半导体晶片进行成像而获得的图像来精确地提取各种缺陷的各种特征量，并且相对于差分 在从图像亮度彼此靠近的模具获得的图像信号之间的图像信号，缺陷检测阈值和低于缺陷检测阈值的特征量提取阈值。

公开(公告)号：US08310666B2

公开(公告)日：2012-11-13

申请号：US13116466

申请日：2011-05-26

申请人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

发明人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

IPC分类号： G01N21/88 ,  G01B11/00

CPC分类号： G01N21/956

摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.

摘要翻译： 当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。 因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。 为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。

公开(公告)号：US20120133927A1

公开(公告)日：2012-05-31

申请号：US13368585

申请日：2012-02-08

申请人： Akira HAMAMATSU ,  Hisae Shibuya ,  Shunji Maeda

发明人： Akira HAMAMATSU ,  Hisae Shibuya ,  Shunji Maeda

IPC分类号： G01N21/55

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.

摘要翻译： 用于检查检查对象的缺陷的缺陷检查装置包括：在检查对象物上照射光束的照明器，由于照射器照射光束而检测来自被检查物体的光的光检测器， 缺陷检测器，其通过处理通过光检测器的检测获得的信号来检测缺陷;计算与缺陷的尺寸相关的特征量的特征量计算器;以及使用尺寸和特性之间的关系的缺陷尺寸计算器 通过光学模拟计算的量，并计算检测到的缺陷的尺寸。

公开(公告)号：US07952699B2

公开(公告)日：2011-05-31

申请号：US12827555

申请日：2010-06-30

申请人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

发明人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

IPC分类号： G01N21/88 ,  G01B11/00

CPC分类号： G01N21/956

摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.

摘要翻译： 当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。 因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。 为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。