公开(公告)号：US06595275B1

公开(公告)日：2003-07-22

申请号：US10187290

申请日：2002-07-02

Applicant: Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

Inventor： Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

IPC: F28F700

CPC classification number: H01L23/3672 ,  F28F3/02 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to correspond to the ridge of the base, two first bends respectively extending from opposite sides of the cutout in a same direction from the bottom edge and a second bend formed on a top edge of the cutout. The fins are able to be securely mounted on top of the base via the two first bends.

Abstract translation: 散热组件包括具有脊的基座和安装在基座的顶部上的多个翅片。 每个翅片具有板，其具有限定在底部边缘的中间部分中的切口，以对应于基部的脊部，两个第一弯曲部分别从切口的相对侧从与底部边缘相同的方向延伸， 弯曲形成在切口的顶部边缘上。 翅片能够通过两个第一弯头牢固地安装在基座的顶部上。

公开(公告)号：US06571862B1

公开(公告)日：2003-06-03

申请号：US10178363

申请日：2002-06-25

Applicant: Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

Inventor： Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

IPC: H05K720

CPC classification number: F28F3/025 ,  F28D2021/0029

Abstract: A heat dissipation fin includes multiple unit each having a top, a first side and a second side and multiple bridges each connecting every two adjacent units together and connected to each one of the units at a fold. The bridge has a front side and a rear side and the top of the unit has a first side in parallel with the front side and a second side in parallel with the rear side of the bridge. Each front side has a width smaller than a width of each rear side and each first side has a width smaller than a width of each second side.

Abstract translation: 散热片包括多个单元，每个单元具有顶部，第一侧面和第二侧面以及多个桥接件，每个桥接器将每两个相邻的单元连接在一起并以折叠方式连接到每个单元。 桥梁具有前侧和后侧，并且单元的顶部具有与前侧平行的第一侧和与桥的后侧平行的第二侧。 每个前侧的宽度小于每个后侧的宽度，并且每个第一侧的宽度小于每个第二侧的宽度。

公开(公告)号：US06542370B1

公开(公告)日：2003-04-01

申请号：US10136356

申请日：2002-05-02

Applicant: Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

Inventor： Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

IPC: H05K720

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating device has a conductor holder and a heat conductor. The conductor holder is securely attached to the CPU base and has a through hole. The heat conductor is securely connected to the through hole in the conductor holder and contacts with the CPU. The heat conductor comprises multiple heat conductive elements made of a material with good heat conductivity. One end of the heat conductive elements are twisted together to form a bound section on the first end of the heat conductor. The other end of each heat conductive element is far away from the other element so as to form an expansion section on a second end of the heat conductor. In such an arrangement, the heat generated by the CPU can be efficiently dissipated from the expansion section of the heat conductor.

Abstract translation: 散热装置具有导体支架和导热体。 导线架固定在CPU基座上，并具有通孔。 导体牢固地连接到导体保持器中的通孔并与CPU接触。 热导体包括由具有良好导热性的材料制成的多个导热元件。 导热元件的一端被扭绞在一起以在热导体的第一端上形成结合部分。 每个导热元件的另一端远离另一元件，以在热导体的第二端上形成膨胀部分。 在这种布置中，由CPU产生的热量可以从热导体的膨胀部分有效地消散。

公开(公告)号：USD426228S

公开(公告)日：2000-06-06

申请号：US96308

申请日：1998-11-10

Applicant: Michael Lin

Designer： Michael Lin

公开(公告)号：USD417873S

公开(公告)日：1999-12-21

申请号：US96346

申请日：1998-11-10

Applicant: Michael Lin

Designer： Michael Lin