公开(公告)号：US20230284424A1

公开(公告)日：2023-09-07

申请号：US17688319

申请日：2022-03-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20327 ,  H05K7/20509 ,  H05K7/20827

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more outlet reservoirs are associated with a stabilizing subsystem and a rack so that one or more outlet reservoirs can receive two-phase fluid that is outlet from a plurality of cold plates of a rack and so that a stabilizing subsystem can stabilize a quality factor of a two-phase fluid to a predetermined quality factor before heat is removed from a two-phase fluid and it is cycled to such cold plates.

公开(公告)号：US20230127470A1

公开(公告)日：2023-04-27

申请号：US17510057

申请日：2021-10-25

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, multiple parallel refrigerant paths are associated with one or more flow controllers to cool multiple computing devices associated therewith, so that one or more flow controllers can distribute equal measures of a liquid phase of refrigerant, relative to a vapor phase of a refrigerant, to such parallel refrigerant paths based in part on a cooling requirement from at least one of such multiple computing devices.

公开(公告)号：US20230065253A1

公开(公告)日：2023-03-02

申请号：US17407783

申请日：2021-08-20

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G01N27/10 ,  G01N27/416

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a chemical property monitoring subsystem (CPMS) is associated with one or more flow controllers to determine a change in chemistry associated with a primary coolant or a secondary coolant, so that one or more flow controllers can cause a change in coolant state of a secondary coolant or a primary coolant based in part on a change in their chemistry.

公开(公告)号：US20230030457A1

公开(公告)日：2023-02-02

申请号：US17384153

申请日：2021-07-23

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an in-row cooling unit is located within a row of racks and between a racks so that it can use an interchangeable heat exchanger (IHE) to receive primary coolant and can use one or more flow controllers to provide a first part of a primary coolant to cool secondary coolant that is to be distributed to at least one cold plate and to provide a second part of a primary coolant to cool air to be circulated through at least one server tray or rack.

公开(公告)号：US20230007815A1

公开(公告)日：2023-01-05

申请号：US17364468

申请日：2021-06-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an in-rack refrigerant distribution unit (RDU) distributes refrigerant to one or more colds plates in association with a pressure control system to enable a pressure-drop before an expansion valve for a liquid-phase of a refrigerant based in part on a pressure of a liquid-phase of a refrigerant exceeding a first threshold and based in part on a temperature associated with one or more cold plates being below a second threshold.

公开(公告)号：US20220386513A1

公开(公告)日：2022-12-01

申请号：US17334144

申请日：2021-05-28

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B13/02 ,  G06N3/04

Abstract: Systems and methods for testing in a datacenter cooling system are disclosed. In at least one embodiment, cooling hardware is associated with multiple computing devices within multiple racks of a test environment and is able to support a test for the multiple computing devices to cause different electronic stresses and different cooling stresses for the multiple computing devices in reference to established benchmarks.

公开(公告)号：US11435794B2

公开(公告)日：2022-09-06

申请号：US16923971

申请日：2020-07-08

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G05B19/042 ,  G06N20/00

Abstract: A cooling system for a datacenter is disclosed. An evaporative cooling subsystem provides blown air for cooling the datacenter and a repurposable refrigerant cooling subsystem controls moisture of the blown air in a first configuration and independently cools the datacenter in a second configuration.

公开(公告)号：US20220264771A1

公开(公告)日：2022-08-18

申请号：US17178646

申请日：2021-02-18

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06N3/04 ,  G06N3/08

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant-to-air (R2A) heat exchanger is interfaced with at least one cold plate to absorb heat from at least one computing device using a two-phase fluid and is interfaced with a compressor or condensing unit that causes dissipation of at least part of the heat within a datacenter.

公开(公告)号：US20220264764A1

公开(公告)日：2022-08-18

申请号：US17178773

申请日：2021-02-18

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air (L2A) heat exchanger located overhead relative to plurality of racks of a datacenter and extending across the plurality of racks has fluid or secondary coolant from at least one computing device and is cooled by a fan wall that is associated with a rear door of at least one of a plurality of racks.

公开(公告)号：US20220228951A1

公开(公告)日：2022-07-21

申请号：US17152336

申请日：2021-01-19

Applicant: Nvidia Corporation

Inventor： Harold Karl Miyamura ,  Ali Heydari ,  Jeremy Rodriguez ,  Uschas Chowdhury

IPC: G01M99/00 ,  H05K7/20

Abstract: Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal test vehicle can be used to simulate a thermal performance of a computing unit.