公开(公告)号：US20240038670A1

公开(公告)日：2024-02-01

申请号：US18376652

申请日：2023-10-04

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/5381 ,  H01L21/481 ,  H01L23/49833 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/5385 ,  H01L21/4853

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US20230395571A1

公开(公告)日：2023-12-07

申请号：US18235079

申请日：2023-08-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Meng-Huan Chia ,  Yih-Jenn Jiang ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L25/065 ,  H01L25/16 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/162 ,  H01L25/50 ,  H01L2225/06548 ,  H01L2225/06589 ,  H01L2225/06572 ,  H01L2225/06517

Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.

公开(公告)号：US11810862B2

公开(公告)日：2023-11-07

申请号：US17978493

申请日：2022-11-01

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/5381 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L21/4853

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US20230014476A1

公开(公告)日：2023-01-19

申请号：US17850527

申请日：2022-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/42 ,  H01L23/40 ,  H01L21/54 ,  H01L21/56

Abstract: An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electronic components exposing from the heat dissipation material so as to improve the heat dissipation effect.

公开(公告)号：US20220406642A1

公开(公告)日：2022-12-22

申请号：US17392462

申请日：2021-08-03

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L21/683 ,  H01L23/00

Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.

公开(公告)号：US20220392861A1

公开(公告)日：2022-12-08

申请号：US17369029

申请日：2021-07-07

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ren Chen ,  Po-Yung Chang ,  Pei-Geng Weng ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

公开(公告)号：US11482470B2

公开(公告)日：2022-10-25

申请号：US16872740

申请日：2020-05-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Yuan-Hung Hsu

IPC: H01L23/433 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.

公开(公告)号：US11410954B2

公开(公告)日：2022-08-09

申请号：US16922169

申请日：2020-07-07

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Yuan-Hung Hsu

IPC: H01L23/00

Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.

公开(公告)号：US11289794B2

公开(公告)日：2022-03-29

申请号：US16859009

申请日：2020-04-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Rung-Jeng Lin ,  Han-Hung Chen ,  Shi-Min Zhou ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H05K7/00 ,  H01Q1/22 ,  H01L23/498 ,  H01L23/00 ,  H01L23/66

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

公开(公告)号：US20220068663A1

公开(公告)日：2022-03-03

申请号：US17068988

申请日：2020-10-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L21/48 ,  H01L23/498

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.