公开(公告)号：US11564341B2

公开(公告)日：2023-01-24

申请号：US16717318

申请日：2019-12-17

Applicant: Fanuc Corporation

Inventor： Yoshio Motowaki

IPC: B23P19/00 ,  H05K13/04 ,  B25J11/00

Abstract: A reel holding device includes a first reel support member that includes a first placement member that rotatably supports a first reel and a second reel support member that supports a second reel. The first reel support member is rotatable between a reference position at which a carrier tape of the first reel is supplied to the mounter, and a discharge position for discharging the first reel. By rotating the first reel support member from the reference position toward the discharge position, the first reel drops through an opening of the first placement member and is discharged. When the first reel support member returns from the discharge position to the reference position, the second reel moves through the opening and into the interior of the first placement member.

公开(公告)号：US11559681B2

公开(公告)日：2023-01-24

申请号：US17161405

申请日：2021-01-28

Applicant: Medtronic, Inc.

Inventor： Dale F. Seeley ,  Michael T. Hegland

IPC: B23P19/00 ,  H05K13/04 ,  A61N1/05 ,  A61B5/00 ,  A61B5/25 ,  A61B5/291 ,  A61N1/375 ,  A61N1/372 ,  A61B5/24

Abstract: Systems, devices, and techniques are disclosed for forming an elongate lead body module of a modular lead. The method may comprise rotating a mandrel, wherein the mandrel extends through a through-hole of a conductor hub, wherein each conductor of a plurality of conductors extend through a respective channel of a plurality of channels of the conductor hub, wherein each conductor of the plurality of conductors extends from a respective bobbin of plurality of bobbins to the channels, wherein the plurality of bobbins are coupled to a carriage, the carriage defining a central opening through which the mandrel passes. The method may comprise moving the carriage away from the conductor hub along a length of the mandrel while the mandrel rotates causing the conductors to coil around the mandrel.

公开(公告)号：US11558986B2

公开(公告)日：2023-01-17

申请号：US17568534

申请日：2022-01-04

Applicant: Samsung Display Co., Ltd.

Inventor： Tae-Eun Kim ,  Jeungsoo Kim ,  Junghoon Kim

IPC: H05K7/20 ,  H05K13/04

Abstract: A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.

公开(公告)号：US11557567B2

公开(公告)日：2023-01-17

申请号：US17412757

申请日：2021-08-26

Applicant: Assembléon B.V.

Inventor： Rudolphus H. Hoefs ,  Roy Brewel ,  Richard A. Van Der Burg

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H05K13/04 ,  H01K13/04

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

公开(公告)号：US11553631B2

公开(公告)日：2023-01-10

申请号：US17100285

申请日：2020-11-20

Applicant: Raytheon Company

Inventor： Michael Spencer Dunn ,  Lawrence William Thurber

IPC: B23K1/00 ,  B23K3/00 ,  B23K37/00 ,  H05K13/04 ,  H05K3/34 ,  B23K1/018

Abstract: Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is induced within the complementary pair of high permeability members via a coil driver generating an AC current in an inductive coil circumscribing a central pedestal of the complementary pair of high-permeability members. The magnetic field induced is directed through the adhesively-attached component via a central pedestal located proximate the adhesively-attached component. A return path for the magnetic field is provided about a periphery of the adhesively-attached component via a peripheral pedestal.

公开(公告)号：US20230007818A1

公开(公告)日：2023-01-05

申请号：US17741571

申请日：2022-05-11

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： KAI-KE CHENG ,  HANG WU ,  YAN-XIN FENG ,  PENG-CHENG NIU

IPC: H05K13/04

Abstract: A suction nozzle assembly used in manufacture for the gentlest handling of delicate components such as a camera lens includes a suction nozzle rod and a suction nozzle member. The suction nozzle rod includes a first through hole. The suction nozzle member includes a main body and a suction nozzle located on both sides of the main body. The main body includes a second through hole connected to the first through hole, and a third through hole connected to the second through hole. The suction nozzle includes at least one suction nozzle hole connected to the third through hole. The disclosure also provides a suction device having the suction nozzle assembly.

公开(公告)号：US11546528B2

公开(公告)日：2023-01-03

申请号：US17258321

申请日：2018-07-12

Applicant: FUJI CORPORATION

Inventor： Masafumi Amano ,  Yuta Yokoi

IPC: H05K3/30 ,  H04N5/262 ,  H05K13/04 ,  H05K13/08

Abstract: Provided is an image processing method for easily viewing images obtained by imaging multiple components at a time, the method including image capturing processing of capturing each component holding state relating to multiple suction nozzles mounted on a mounting head as one image, image dividing processing of dividing a region relating to a predetermined component holding state for image data of the multiple component holding states obtained by the image capturing processing, direction conversion processing of converting a direction of the component holding state for divided image data divided by the image dividing processing, and display processing of displaying an image based on the divided image data subjected to the direction conversion processing.

公开(公告)号：US20220418175A1

公开(公告)日：2022-12-29

申请号：US17904775

申请日：2020-02-26

Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA

Inventor： Kazuhiro TERADA

IPC: H05K13/04

Abstract: A shaft drive device includes a plurality of shafts each retained in a raisable and lowerable manner; a return spring for urging each of the shafts upward; an actuating member contactable with a pressed part of any one of the shafts for raising and lowering a selected shaft; and a raising and lowering mechanism which changes a posture of the actuating member between a first posture of coming into contact with the pressed part of the shaft and pressing the pressed part to lower the shaft against an urging force of the return spring and a second posture of releasing the pressing. The pressed part of the shaft is made of ferromagnet, and the actuating member is given a magnetic force.

公开(公告)号：US20220394894A1

公开(公告)日：2022-12-08

申请号：US17774449

申请日：2019-11-06

Applicant: FUJI CORPORATION

Inventor： Daigo KONDO

IPC: H05K13/08 ,  G05B19/418 ,  H05K13/04

Abstract: A component mounting device that performs mounting processing for mounting a component on a board based on a production program, includes: a storage section configured to store information; a setting section configured to set a correction value related to a mounting position of the component included in the production program; a storage control section configured to make the storage section store date and time information on which calibration related to the mounting processing is executed when the calibration is executed, and to make the storage section store the correction value in association with latest date and time information of the calibration when the correction value is set; and a correction section configured to perform a correction related to the mounting position using the correction value corresponding to the latest date and time information of the calibration without using the correction value not corresponding to the latest date and time information.

公开(公告)号：US11521862B2

公开(公告)日：2022-12-06

申请号：US16220868

申请日：2018-12-14

Applicant: Chih-liang Hu

Inventor： Chih-liang Hu ,  Che-kai Hu

IPC: H01L21/48 ,  G01S7/481 ,  H01L21/56 ,  H05K3/34 ,  H01L23/00 ,  H01L29/74 ,  H05K13/04 ,  H01L23/495 ,  H01L21/60

Abstract: A process for batch fabrication of circuit components is disclosed via simultaneously packaging multiple circuit component dice in a matrix. Each die has electrodes on its tops and bottom surfaces to be electrically connected to a corresponding electrical terminal of the circuit component it's packaged in. For each circuit component in the matrix, the process forms preparative electrical terminals on a copper substrate. Component dice are pick-and-placed onto the copper substrate with their bottom electrodes landing on corresponding preparative electrical terminal. Horizontal conductor plates are then placed horizontally on top of the circuit component dice, with bottom surface at one end of each plate landing on the dice's top electrode. An opening is formed at the opposite end and has vertical conductive surfaces. A vertical conductor block is placed into the opening and lands on the preparative electrical terminal, and the opening's vertical conductive surfaces facing the top end side surface of the vertical block. A thermal reflow then simultaneously melts pre-applied soldering material so that each circuit component die and its vertical conductor block are soldered to the copper substrate below and its horizontal conductor plate above.