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17 条记录 (耗时 0.016 秒)

    Thermoforming device and thermoforming method
    1.
    发明授权
    Thermoforming device and thermoforming method 有权

    公开(公告)号：US11691329B2

    公开(公告)日：2023-07-04

    申请号：US18012436

    申请日：2021-11-23

    申请人： ASANO LABORATORIES CO., LTD.

    发明人： Kazunori Teramoto ,  Shogo Takai ,  Yusuke Suzuki ,  Kimihiro Iimura

    IPC分类号： B29C51/42

    CPC分类号： B29C51/422 ,  B29C51/428 ,  B29C51/426

    摘要： A thermoforming device according to the present invention has a masking plate and a heater block. A plurality of the heater blocks are disposed with a space therebetween in a planar direction of the masking plate. The thickness of the masking plate is 0.2-3.0 mm. The distance of the space is 1-15 mm, and the distance of the space is set at least five times larger than the thickness of the masking plate. Heat to be transmitted to the masking plate from a high temperature heater block is more easily transmitted in the thickness direction of the masking plate than in the surface direction of the masking plate, and is more easily transmitted to the sheet than to a portion, of the masking plate, corresponding to a low temperature heater block, whereby a temperature difference is provided between different zones of the masking plate.

    Forming apparatus and forming method
    2.
    发明授权
    Forming apparatus and forming method 有权
    成型装置及成型方法

    公开(公告)号：US09505170B2

    公开(公告)日：2016-11-29

    申请号：US13823972

    申请日：2011-11-22

    申请人： Kenichi Mizoguchi ,  Kazunori Teramoto

    发明人： Kenichi Mizoguchi ,  Kazunori Teramoto

    IPC分类号： B29C65/48 ,  B29C51/32 ,  B29C51/16 ,  B29C51/42 ,  B29C51/08

    CPC分类号： B29C65/48 ,  B29C51/082 ,  B29C51/16 ,  B29C51/32 ,  B29C51/428 ,  B29C2791/006 ,  Y10T156/1002

    摘要： A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig.

    摘要翻译： 一种成形装置，包括设置在基座上的基材夹具，用于制造具有粘合层并覆盖在基材夹具上的基材的基材粘合到基材上的粘合装置，以及用于在该基材上进行修整的修整装置 在基材未从基材夹具中除去的状态下，相对于附着有片材的基材。

    THERMOFORMING DEVICE AND THERMOFORMING METHOD USING HOT PLATE HEATING
    3.
    发明申请
    THERMOFORMING DEVICE AND THERMOFORMING METHOD USING HOT PLATE HEATING 有权
    热加工设备和使用热板加热的热成型方法

    公开(公告)号：US20120211928A1

    公开(公告)日：2012-08-23

    申请号：US13505373

    申请日：2010-06-25

    申请人： Toshihiro Takai ,  Kenichi Mizoguchi ,  Hideki Usami ,  Kazunori Teramoto

    发明人： Toshihiro Takai ,  Kenichi Mizoguchi ,  Hideki Usami ,  Kazunori Teramoto

    IPC分类号： B29C51/10

    CPC分类号： B29C51/10 ,  B29C51/165 ,  B29C51/421 ,  B29C2791/006 ,  B29C2791/007

    摘要： A thermoforming device using a hot plate heating includes a frame a hot plate; a decompression unit connected to the frame; a decompression unit which is connected to a hot plate; a unit which is connected to the hot plate and opens a heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate; a decompression control unit which performs a decompression operation in the concave portion; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion.

    摘要翻译： 使用热板加热的热成型装置包括：热板; 连接到所述框架的减压单元; 连接到热板的减压单元; 连接到热板并将加热表面侧打开到大气或加压加热表面侧的单元; 吸附加热控制单元，其通过热板进行片材的吸附和加热操作; 减压控制单元，其在所述凹部中进行减压操作; 以及同时执行吸附和加热操作和减压操作的成型操作控制单元，在从操作开始经过预定时间之后停止片材的吸附和加热操作，并且打开热板和片材之间的部分 到大气或压力的部分。

    Method of cutting multilayer body, method of forming multilayer container, and multilayer formed product
    6.
    发明申请
    Method of cutting multilayer body, method of forming multilayer container, and multilayer formed product 有权
    切割多层体的方法，多层容器的形成方法以及多层成型体

    公开(公告)号：US20060185789A1

    公开(公告)日：2006-08-24

    申请号：US10522392

    申请日：2003-07-25

    申请人： Kikuo Matsuoka ,  Shinji Tanaka ,  Yasuyo Sano

    发明人： Kikuo Matsuoka ,  Shinji Tanaka ,  Yasuyo Sano

    IPC分类号： B32B38/04 ,  B26D7/14

    CPC分类号： B29C51/32 ,  B26D7/27 ,  B26F1/40 ,  B26F2001/4427 ,  B26F2210/06 ,  B29C51/04 ,  B29C51/10 ,  B29C51/14 ,  B29C2791/006 ,  B29L2031/712 ,  B32B27/18 ,  B65D81/267 ,  Y10T83/041 ,  Y10T83/0414 ,  Y10T83/0429 ,  Y10T83/283 ,  Y10T156/1052 ,  Y10T156/1054 ,  Y10T156/1313 ,  Y10T428/13 ,  Y10T428/1334 ,  Y10T428/1352

    摘要： An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure 10 includes the steps of: compressing and deforming the multilayer structure, while extending respective layers 11, 12, 13 of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter 15, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion 14, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer 11 and surface resin layers 12, 13 of the multilayer structure to the abutting portion A of the push cutter 15 and the cutter receiving portion 14.

    摘要翻译： 在切割多层结构时，多层结构的中间层的端面被表面树脂层稳定地覆盖。 多层结构10的切割方法包括以下步骤：压缩和变形多层结构，同时延伸多层结构的各个层11,12,13，以提供薄的厚度部分，使得上层咬入下层 通过将推动切割器15按预定量推入由切割器接收部分14支撑的多层结构中，在至少一个形成多层结构的树脂层的熔融状态下; 并推压压缩的薄壁部分S，直到推动切割器抵靠刀具接收部分，以将多层结构的中间层11和表面树脂层12,13会聚到推动切割器15的邻接部分A，并且 刀具接收部分14。

    Heating unit and resin sheet heating apparatus
    8.
    发明授权
    Heating unit and resin sheet heating apparatus 失效
    加热单元和树脂片加热装置

    公开(公告)号：US07539401B2

    公开(公告)日：2009-05-26

    申请号：US11558513

    申请日：2006-11-10

    申请人： Toshihiro Takai ,  Yasuyoshi Ohashi ,  Kazushi Hayashi

    发明人： Toshihiro Takai ,  Yasuyoshi Ohashi ,  Kazushi Hayashi

    IPC分类号： A45D20/40

    CPC分类号： B29B13/023 ,  B29C35/0805 ,  F26B3/28 ,  F26B13/10

    摘要： A heating unit includes a plurality of radiant heaters, a plurality of brackets on which the radiant heaters are mounted in a row, and a frame on which the brackets are mounted in a parallel arrangement and thereby the radiant heaters are mounted in a grid configuration, wherein each of the radiant heaters includes: a support plate substantially having a rectangular shape; a pair of connection terminals substantially perpendicularly extending, while having a space therebetween, from one surface of the support plate; and a strip-shaped heater element arranged between the pair of connection terminals and covering the one surface of the support plate, and wherein the connection terminals have connection portions projecting from the other surface of the support plated, and each of the brackets has a terminal hole into which the connection portion is inserted.

    摘要翻译： 加热单元包括多个辐射加热器，多个托架，其中辐射加热器安装在一排中;以及框架，托架以平行布置安装在其上，从而辐射加热器安装在格栅构造中， 其中每个辐射加热器包括：基本上具有矩形形状的支撑板; 一对连接端子，其从所述支撑板的一个表面基本垂直地延伸，同时具有间隔; 以及布置在所述一对连接端子之间并覆盖所述支撑板的所述一个表面的条形加热器元件，并且其中所述连接端子具有从所述镀覆的所述支撑件的另一个表面突出的连接部分，并且每个所述支架具有端子 连接部插入其中的孔。

    THERMOFORMING DEVICE AND THERMOFORMING METHOD
    9.
    发明申请
    THERMOFORMING DEVICE AND THERMOFORMING METHOD 有权

    公开(公告)号：US20220118675A1

    公开(公告)日：2022-04-21

    申请号：US17565860

    申请日：2021-12-30

    申请人： Asano Laboratories Co., Ltd.

    发明人： Kazunori Teramoto

    IPC分类号： B29C51/26 ,  B29C51/16 ,  B29C51/12 ,  B29C51/02 ,  B29C51/42

    摘要： A thermoforming device includes: a base configured to hold a substrate; a hot plate including a heating surface facing vertically downward; a sheet transport portion that supplies a sheet onto the heating surface of the hot plate; and a substrate supply portion configured to attach the substrate to the base and detach the substrate from the base, and to dispose the substrate at a substrate supply position positioned in a lower area of the sheet which is opposite to a side of the sheet in which the heating surface is provided. In the thermoforming device, heating of the sheet using the hot plate and attachment and detachment of the substrate with respect to the base are performable at the same time, and the sheet heated and softened by the hot plate is attached to the substrate at the substrate supply position.

    Thermoforming device and thermoforming method using hot plate heating
    10.
    发明授权
    Thermoforming device and thermoforming method using hot plate heating 有权
    热成型装置和热成型方法采用热板加热

    公开(公告)号：US09364992B2

    公开(公告)日：2016-06-14

    申请号：US13505373

    申请日：2010-06-25

    申请人： Toshihiro Takai ,  Kenichi Mizoguchi ,  Hideki Usami ,  Kazunori Teramoto

    发明人： Toshihiro Takai ,  Kenichi Mizoguchi ,  Hideki Usami ,  Kazunori Teramoto

    IPC分类号： B29C51/10 ,  B29C51/42 ,  B29C51/16

    CPC分类号： B29C51/10 ,  B29C51/165 ,  B29C51/421 ,  B29C2791/006 ,  B29C2791/007

    摘要： A thermoforming device using a hot plate heating includes a frame; a hot plate; a decompression unit connected to the frame; a decompression unit which is connected to a hot plate; a unit which is connected to the hot plate and opens a heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate; a decompression control unit which performs a decompression operation in the concave portion; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion.

    摘要翻译： 使用热板加热的热成型装置包括框架; 一个热板; 连接到所述框架的减压单元; 连接到热板的减压单元; 连接到热板并将加热表面侧打开到大气或加压加热表面侧的单元; 吸附加热控制单元，其通过热板进行片材的吸附和加热操作; 减压控制单元，其在所述凹部中进行减压操作; 以及同时执行吸附和加热操作和减压操作的成型操作控制单元，在从操作开始经过预定时间之后停止片材的吸附和加热操作，并且打开热板和片材之间的部分 到大气或压力的部分。