摘要:
An angular displacement sensor. The input shaft is supported by a housing and fixed to a main gear. A plurality of secondary gears are arranged around and meshed with the primary gear. A plurality of displacement sensors are integrally coupled with the secondary gears. Advantageously, the main shaft is formed with a shear notch. Further, each of the secondary gears are coupled to the displacement sensors so as to break free in case of a jam.
摘要:
A circuit arrangement for the linearization and temperature compensation of capacitive sensor signals is provided which requires few components and wherein the compensated input signal is obtained fast. The arrangement includes: a clock generator; a reference capacitor; a measuring capacitor; a temperature-dependent voltage divider connected between an operating and a reference potential which measures the temperature of the measuring capacitor; an adjusting circuit which acts on the measuring capacitor and the reference capacitor and having a first input connected to the operating potential, a second input connected to the voltage divider, and a third input; an integrating stage connected to the measuring capacitor and the reference capacitor and having its output coupled to the third input of the adjusting circuit, the output being the output of the arrangement. The output signal is ##EQU1## where C.sub.v =(C.sub.m -C.sub.r)/C.sub.m, (C.sub.m -C.sub.r)/(C.sub.m +C.sub.r) , or (C.sub.m -C.sub.r)/C.sub.r ; C.sub.m is the capacitance of the capacitor; C.sub.r is the capacitance of the reference capacitor; U is the operating potential; a.sub.0 is a zero adjustment value; a.sub.1 is a temperature coefficient zero adjustment value; a.sub.2 is a first span adjustment value; a.sub.3 is a temperature coefficient span adjustment value; b.sub.0 is a second span adjustment value; b.sub.1 is a linearization adjustment value, and v.sub.1 is the temperature-dependent resistance ratio of the voltage divider.
摘要:
Fabrication of semiconductor devices with movable structures includes local oxidation of a wafer and oxide removal to form a depression in an elevated bonding surface. A second wafer is fusion bonded to the elevated bonding surface and shaped to form a flexible membrane. An alternative fabrication technique forms a spacer having a depression on a first wafer and active regions on a second wafer, and fusion bonds the wafers together with the depression over the active regions. Devices formed are integrable with standard MOS devices and include FETs, capacitors, and sensors with movable membranes. An FET sensor has gate and drain coupled together and a drain-source voltage which depends on the gate's deflection. Selected operating current, channel length, and channel width provide a drain-source voltage linearly related to gate deflection. Alternatively, two transistors subjected to the same gate deflection provide a differential voltage related to the square root of the deflection if channel currents or channel widths differ. Transistors subjected to the different gate deflections provide a differential signal that cancels effects that are independent of deflection. A capacitive sensor includes a doped region underlying the center of a flexible membrane. The doped region is isolated from a surrounding region which is biased at the voltage of the membrane.