SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20150108629A1

    公开(公告)日:2015-04-23

    申请号:US14357669

    申请日:2012-02-14

    摘要: A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.

    摘要翻译: 冷却翅片9接合到半导体元件1.树脂10封装半导体元件1.冷却翅片9的一部分从树脂10的下表面突出。冷却器11具有开口12.冷却翅片9 从树脂10突出的部分插入到冷却器11的开口12中。树脂10的下表面和冷却器11通过诸如粘合剂的接合材料13彼此接合。 因此,可以实现部件数量的减少和重量的减轻,并且可以确保导热性和接合强度之间的兼容性。

    OUTDOOR UNIT FOR AIR-CONDITIONING APPARATUS

    公开(公告)号:US20210010712A1

    公开(公告)日:2021-01-14

    申请号:US16971844

    申请日:2018-03-23

    IPC分类号: F24F13/20 F24F13/22

    摘要: An outdoor unit for an air-conditioning apparatus, having a compressor, a top cover configured to cover an upper surface of the compressor, and a side cover configured to cover a side of the compressor and a side of the top cover, the side cover including a rectangular cutout portion formed in a part of an upper end of the side cover. The outdoor unit has a non-water-absorbent draining element disposed across from a central portion of the top cover to a bottom portion of the cutout portion, and tilts down from the central portion of the top cover toward the bottom portion of the cutout portion.