公开(公告)号：US09258903B2

公开(公告)日：2016-02-09

申请号：US13381198

申请日：2010-09-29

申请人： Masaichi Inaba ,  Masayuki Iwase

发明人： Masaichi Inaba ,  Masayuki Iwase

IPC分类号： H05K1/11 ,  H05K3/24 ,  H05K3/34

CPC分类号： H05K3/244 ,  H01L2224/8384 ,  H01L2924/01079 ,  H05K3/3452 ,  H05K2201/099 ,  Y10T29/49155

摘要： It is an object to form a conductive intermediate layer having a function of maximally preventing a solder leaching phenomenon with a low environment load and with good productivity.There are provided an insulative base material 2, a wiring circuit pattern 3 formed on at least one surface of the insulative base material 2, an electronic part mounting land 31 which is formed as part of the wiring circuit pattern 3 and on which an electronic part 7 is to be mounted, and a conductive intermediate layer 5 made of a sintered conductive ink film on the electronic part mounting land 31.

摘要翻译： 本发明的目的是形成具有在环境负荷低且生产率高的情况下最大限度地防止焊料浸出现象的导电中间层。 设置绝缘基材2，形成在绝缘基材2的至少一个表面上的布线电路图案3，形成为布线电路图案3的一部分的电子部件安装台面31，电子部件 在电子部件安装台面31上安装由烧结导电油墨膜构成的导电中间层5。