利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.014 秒)

    ELECTRICALLY CONDUCTIVE SPACER FOR MULTILAYER INSULATION GROUNDING
    1.
    发明公开
    ELECTRICALLY CONDUCTIVE SPACER FOR MULTILAYER INSULATION GROUNDING 审中-公开

    公开(公告)号：US20240124164A1

    公开(公告)日：2024-04-18

    申请号：US18381137

    申请日：2023-10-17

    申请人： Quest Thermal Group LLC

    发明人： Scott A. DYE ,  Phillip N. TYLER

    IPC分类号： B64G1/58 ,  B64G1/54 ,  H05F3/02

    CPC分类号： B64G1/58 ,  B64G1/546 ,  H05F3/02

    摘要： As spacecraft electronic control and human support systems get increasingly sophisticated, protection for those systems becomes more critical. Multilayer insulation (MLI) is a common thermal protection system on spacecraft, and it includes layers of metalized film that may build up electrostatic charge that can be hazardous in many respects. MLI should be electrically grounded to prevent the unwanted electrostatic buildup while meeting thermal performance requirements. Aspects of the present disclosure involve a significant improvement in grounding methods within a multilayer insulation structure with minimal thermal performance degradation. Metalized spacers create electrical continuity through layers and may have only a single layer connecting to chassis ground. Multiple spacers can be utilized for larger blankets for grounding redundancy. Thermal performance penalty can be orders of magnitude smaller than conventional techniques.

    Low thermally conductive spacer for hot and cold feedline insulation
    3.
    发明授权
    Low thermally conductive spacer for hot and cold feedline insulation 有权

    公开(公告)号：US10753527B1

    公开(公告)日：2020-08-25

    申请号：US15953085

    申请日：2018-04-13

    申请人： Quest Thermal Group LLC

    发明人： Scott A. Dye ,  Phillip N. Tyler

    IPC分类号： E04C2/34 ,  F16L59/14 ,  B65D81/38

    摘要： The invention provides improvements on thermal performance of multilayer insulation for hot and cold feedlines. Insulation on feedlines has always been problematic, and can perform ten times worse than tank insulation contributing as much as 80% of total system heat leak. The poor performance of traditional MLI wrapped on feed lines is due to compression of the layers, causing increased interlayer contact and heat conduction. The MLI performance is not only much worse than expected, but also difficult to predict. Spacer structures are presented which provide a well-defined, accurately characterized support between the thermal radiant barriers in a multilayer insulation. The invention provides a robust, structural insulation that is much less sensitive to wrap compression and installation workmanship allowing for more predictable, higher performance insulation structure.

    Vapor cooled insulation structure
    4.
    发明授权
    Vapor cooled insulation structure 有权

    公开(公告)号：US11098852B1

    公开(公告)日：2021-08-24

    申请号：US16015860

    申请日：2018-06-22

    申请人： Quest Thermal Group LLC

    发明人： Scott A. Dye ,  Alan B. Kopelove ,  Phillip N. Tyler

    IPC分类号： F17C3/10 ,  B32B3/10 ,  F17C13/00

    摘要： A vapor cooled insulation structure includes at least one vapor sealed layer, created with discrete spacers between two layers. A vapor transport layer is created within these layers through which a cold fluid may flow to intercept and remove heat from an underlying structure. In one example, the vapor cooled system carries cold vapor which is in direct contact with an underlying cryogenic tank structural support.