公开(公告)号：US07273540B2

公开(公告)日：2007-09-25

申请号：US11039841

申请日：2005-01-24

申请人： Hiromi Sonoda ,  Katsuji Nakamura

发明人： Hiromi Sonoda ,  Katsuji Nakamura

IPC分类号： C25D3/58 ,  C25D3/60

CPC分类号： C25D21/18 ,  B23K35/262 ,  C25D3/60 ,  C25D5/003 ,  C25D5/18 ,  C25D17/002 ,  C25D17/10 ,  C25D17/16 ,  C25D21/06 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3463 ,  H05K3/3473 ,  H01L2924/00

摘要： An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being 0.5 to 5 mol/L, 0.21 to 2 mol/L, 0.002 to 0.02 mol/L, and 0.01 to 0.1 mol/L, respectively, a mole ratio of the silver-ion concentration to the copper-ion concentration being in a range of 4.5 to 5.58; and separating a solution around a soluble anode containing 90 percent or more of tin from the plating solution on a cathode side by a non-ionic micro-porous membrane having a pore diameter of 0.01 to 0.05 μm and a thickness of 5 to 100 μm.

摘要翻译： 一种电解电镀方法，包括：制备包含主要介质，磺酸和锡，铜和银离子的水的电镀溶液和络合剂，磺酸和锡，铜和银的浓度 离子分别为0.5〜5mol / L，0.21〜2mol / L，0.002〜0.02mol / L，0.01〜0.1mol / L，银离子浓度与铜离子浓度的摩尔比为 范围为4.5至5.58; 并且通过孔径为0.01〜0.05μm，厚度为5〜100μm的非离子型微孔膜，在阴极侧从电镀液中含有90％以上的锡的可溶性阳极分离。