公开(公告)号：US20240282929A1

公开(公告)日：2024-08-22

申请号：US18564005

申请日：2022-05-26

申请人： SINO APPLIED TECHNOLOGY TAIWAN CO., LTD.

发明人： Chih-Wei YANG

IPC分类号： H01M4/36 ,  C25D17/16 ,  H01M4/02 ,  H01M4/136 ,  H01M4/58 ,  H01M4/62 ,  H01M10/0525

CPC分类号： H01M4/366 ,  C25D17/16 ,  H01M4/136 ,  H01M4/58 ,  H01M4/625 ,  H01M10/0525 ,  H01M2004/021 ,  H01M2004/027

摘要： Provided in the embodiments of the present invention is an anode active substance for secondary batteries, which substance comprises a composite material. The composite material includes silicon particles, a ceramic material formed on at least some areas of the surface of the silicon particles, and a conductive carbon composite material formed on the ceramic material to cover the silicon particles and the ceramic material. In addition, further provided herein are a method for preparing an anode active substance and a lithium secondary battery prepared on the basis of the anode active substance.

公开(公告)号：US20170106627A1

公开(公告)日：2017-04-20

申请号：US15394916

申请日：2016-12-30

申请人： The Royal Mint Limited

发明人： Jeffrey L. Conroy ,  Philip B. Forshee ,  James A. Shearer

IPC分类号： B32B15/01 ,  C23C18/36 ,  G07D5/00 ,  C25D3/40 ,  C25D3/56 ,  G07D7/12 ,  C23C18/16 ,  C25D15/00

CPC分类号： C25D7/00 ,  B32B15/01 ,  C23C18/1637 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1662 ,  C23C18/31 ,  C23C18/36 ,  C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D3/58 ,  C25D5/02 ,  C25D5/10 ,  C25D7/005 ,  C25D15/00 ,  C25D17/16 ,  G07D5/00 ,  G07D7/12 ,  G07F7/0813 ,  Y10T428/12493

摘要： Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.

公开(公告)号：US20150292558A1

公开(公告)日：2015-10-15

申请号：US14441794

申请日：2013-11-07

申请人： NTN CORPORATION

发明人： Yoji Sato ,  Masami Tada ,  Hidenobu Mikami

IPC分类号： F16C33/56 ,  F16C19/46

CPC分类号： F16C33/565 ,  C23C2/08 ,  C23C18/48 ,  C25D3/60 ,  C25D7/10 ,  C25D17/16 ,  F16C9/02 ,  F16C9/04 ,  F16C19/463 ,  F16C33/4629 ,  F16C2204/30 ,  F16C2223/60 ,  F16C2223/70 ,  F16C2360/22

摘要： It is an object of the present invention to provide a cage for a rolling bearing having a film, formed on a surface thereof, which wears little over a long period of time from an initial stage of sliding contact between the film and rolling elements as well as other members and does not peel off the surface of a base material of the cage or dissolve in lubricating oil containing a sulfur-based additive and a rolling bearing having the cage. A cage (2) retains needle rollers (3) which are rolling elements of a needle rolling bearing (1). Of an entire outer surface of the cage (2), a tin alloy film consisting of tin and a metal other than the tin is formed on at least a sliding-contact surface of the cage (2) to be subjected to sliding contact with the needle rollers (3) and a sliding-contact surface thereof to be subjected to sliding contact with other members. The metal other than the tin has a lower surface free energy than iron. In the tin alloy film, as a weight ratio (wt %) between the tin and the metal other than the tin, (tin: metal other than tin)=(65:35) to (95:5).

摘要翻译： 本发明的目的是提供一种用于滚动轴承的保持架，其具有形成在其表面上的膜，其从薄膜和滚动元件之间的滑动接触的初始阶段也很长时间地磨损 作为其它构件，并且不会剥离保持架的基材的表面或溶解在含有硫基添加剂和具有保持架的滚动轴承的润滑油中。 保持架（2）保持作为滚针轴承（1）的滚动体的滚针（3）。 在保持架（2）的整个外表面上，在保持架（2）的至少滑动接触表面上形成由锡和除锡之外的金属构成的锡合金膜，以与保持架（2）滑动接触， 滚针（3）和滑动接触表面与其它部件滑动接触。 锡以外的金属比铁具有较低的表面自由能。 在锡合金膜中，作为锡和锡之外的金属（锡：锡以外的金属）=（65:35）〜（95:5）的重量比（重量％）。

公开(公告)号：US20140158528A1

公开(公告)日：2014-06-12

申请号：US14131065

申请日：2012-05-03

申请人： David Mertens ,  Dominiek Seynaeve

发明人： David Mertens ,  Dominiek Seynaeve

IPC分类号： C25D5/08 ,  C25D7/06 ,  C25D17/16

CPC分类号： C25D5/08 ,  C25D7/0607 ,  C25D17/00 ,  C25D17/16 ,  C25D21/12

摘要： An installation (20) for continuously electroplating a plurality of elongated metal elements (21, 21′, 21″) with another metal comprises a bath (22) of an electrolyte wherein the elongated metal elements (21, 21′, 21″) are travelling. The bath (22) comprises a collector space (24) positioned under the elongated metal elements (21, 21′, 21″) and the bath further comprises a distribution plate (26) between the collector space (24) and the elongated metal elements (21, 21′, 21″). The installation (20) further comprises a pump (25) for circulating the electrolyte in the bath (22) from the collector space (24) through the distribution plate (26). The collector space (24) causes first flow losses to the flow of the electrolyte. The distribution plate (26) has a multiplicity of openings for allowing the flow of the electrolyte and these openings cause second flow losses to the flow of the electrolyte. Each of the second flow losses is at least five times greater than the first flow losses.

摘要翻译： 用于使用另一种金属连续电镀多个细长金属元件（21,21'，21“）的安装件（20）包括电解液的浴槽（22），其中细长的金属元件（21,21'，21”）是 旅行 浴（22）包括位于细长金属元件（21,21'，21“）下方的收集器空间（24），并且浴还包括在收集器空间（24）和细长金属元件 （21,21'，21“）。 该装置（20）还包括用于使来自收集空间（24）的电解液（22）中的电解液循环通过分配板（26）的泵（25）。 收集器空间（24）对电解液的流动造成第一流量损失。 分配板（26）具有多个用于允许电解液流动的开口，并且这些开口对电解液的流动造成第二流量损失。 每个第二流量损失比第一流量损失大至少五倍。

公开(公告)号：US20140017512A1

公开(公告)日：2014-01-16

申请号：US13547781

申请日：2012-07-12

申请人： Masayuki Iimori ,  Michael David Hopper

发明人： Masayuki Iimori ,  Michael David Hopper

IPC分类号： C25D21/10 ,  A44B1/00 ,  B21D53/48 ,  B32B15/01 ,  C25D5/10

CPC分类号： C25D7/02 ,  C25D3/40 ,  C25D3/58 ,  C25D5/10 ,  C25D5/44 ,  C25D7/00 ,  C25D17/16 ,  Y10T24/36 ,  Y10T428/1275

摘要： A button or fastener member is provided wherein aluminum or an aluminum alloy is used as raw material, a first copper plating layer is formed directly over the entire surface of said raw material, and a second copper plating layer is formed directly on top of the first copper plating layer, with the aforementioned second copper plating layer being thicker than the aforementioned first copper plating layer.

摘要翻译： 提供了一种按钮或紧固件，其中使用铝或铝合金作为原料，在所述原料的整个表面上直接形成第一铜镀层，并且第二镀铜层直接形成在第一 铜镀层，上述第二镀铜层比上述第一镀铜层厚。

公开(公告)号：US20120060869A1

公开(公告)日：2012-03-15

申请号：US13299141

申请日：2011-11-17

申请人： Daniel J. Woodruff

发明人： Daniel J. Woodruff

IPC分类号： B08B3/04 ,  H01L21/00

CPC分类号： C25D17/001 ,  C25D17/16 ,  H01L21/00 ,  Y10S134/902

摘要： A process chamber for processing semi-conductor wafers. The chamber includes at least one rotor within the process chamber. The rotor is adapted to receive and/or process semi-conductor wafers. The top of the process chamber also includes a tiltable rim. This rim tilts from a non-inclined position to an inclined position. The wafers may be loaded into and unloaded from the process chamber when the rim is in its inclined position.

摘要翻译： 用于处理半导体晶片的处理室。 该腔室包括处理室内的至少一个转子。 转子适于接收和/或处理半导体晶片。 处理室的顶部还包括可倾斜的边缘。 该边缘从非倾斜位置倾斜到倾斜位置。 当轮辋处于其倾斜位置时，晶片可以被装载到处理室中并从处理室卸载。

公开(公告)号：US20110146732A1

公开(公告)日：2011-06-23

申请号：US13040745

申请日：2011-03-04

申请人： Yutaka SUGIURA ,  Ryosuke Hamada ,  Tetsuro Uemura ,  Hideki Nakada

发明人： Yutaka SUGIURA ,  Ryosuke Hamada ,  Tetsuro Uemura ,  Hideki Nakada

IPC分类号： B08B3/02

CPC分类号： B08B9/0821 ,  B08B9/28 ,  B65G37/02 ,  C25D17/00 ,  C25D17/16 ,  Y10S134/902

摘要： A workpiece surface treatment system, which obtains a surface-treated workpiece by sequentially carrying a treatment cell containing a workpiece to a series of apparatuses for operations in the respective apparatuses, is characterized by including: a carrying apparatus for sequentially carrying the treatment cell to a series of the apparatuses in the system; a carrying-in/out apparatus for carrying the treatment cell in and out of the carrying apparatus; a surface treatment apparatus for performing a surface treatment on the workpiece by receiving the treatment cell from the carrying apparatus and supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell; and a workpiece collection apparatus for collecting the workpiece by receiving the treatment cell from the carrying apparatus, inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, wherein the carrying apparatus carries the treatment cell to the surface treatment apparatus, and then to the workpiece collection apparatus.

摘要翻译： 一种工件表面处理系统，其通过将包含工件的处理单元顺序地携带到各个装置中的一系列装置来获得表面处理工件，其特征在于包括：承载装置，用于将处理单元顺序地装载到 系列中的装置; 用于将处理单元搬入和移出运送装置的搬入/退出装置; 一种表面处理装置，用于通过从运送装置接收处理电池并且在旋转处理电池的同时将表面处理液体供应到处理室的内部来对工件进行表面处理; 以及工件收集装置，用于通过从运送装置接收处理电池来收集工件，翻转处理电池，并用水从下方喷射处理电池的内部以流出工件，其中携带装置携带处理电池 到表面处理装置，然后到工件收集装置。

公开(公告)号：US07922877B2

公开(公告)日：2011-04-12

申请号：US12639269

申请日：2009-12-16

申请人： Chalermsak Sumithpibul ,  Somchai Nondhasitthichai ,  Apichart Phaowongsa

发明人： Chalermsak Sumithpibul ,  Somchai Nondhasitthichai ,  Apichart Phaowongsa

IPC分类号： C25D17/16 ,  C25D17/22

CPC分类号： C25D17/005 ,  C25D7/12 ,  C25D17/16 ,  H01L21/4814 ,  H01L21/67005 ,  H01L23/49582 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2224/0401

摘要： A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

摘要翻译： 电镀多个半导体器件的方法包括：将电源施加到阳极端子和阴极端子; 将所述多个半导体器件放置在电镀溶液中的非导电平台上; 将导电部分移动到要被电镀的半导体器件的表面上，其中导电部件将半导体器件的表面电连接到阴极; 并且其中连接到阳极端子的电镀颗粒移动并平板半导体器件的表面。

公开(公告)号：US07718522B2

公开(公告)日：2010-05-18

申请号：US12128828

申请日：2008-05-29

申请人： Chalermsak Sumithpibul ,  Somchai Nondhasitthichai ,  Apichart Phaowongsa

发明人： Chalermsak Sumithpibul ,  Somchai Nondhasitthichai ,  Apichart Phaowongsa

IPC分类号： H01L21/44

CPC分类号： C25D17/005 ,  C25D7/12 ,  C25D17/16 ,  H01L21/4814 ,  H01L21/67005 ,  H01L23/49582 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2224/0401

摘要： A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

公开(公告)号：US20080302396A1

公开(公告)日：2008-12-11

申请号：US12133871

申请日：2008-06-05

申请人： Yutaka Sugiura ,  Ryosuke Hamada ,  Tetsuro Uemura ,  Hideki Nakada

发明人： Yutaka Sugiura ,  Ryosuke Hamada ,  Tetsuro Uemura ,  Hideki Nakada

IPC分类号： B08B3/04

CPC分类号： B08B9/0821 ,  B08B9/28 ,  B65G37/02 ,  C25D17/00 ,  C25D17/16 ,  Y10S134/902

摘要： A workpiece surface treatment system (1), which obtains a surface-treated workpiece by sequentially carrying a treatment cell (9) containing a workpiece to a series of apparatuses for operations in the respective apparatuses, is characterized by including: a carrying apparatus (2) for sequentially carrying the treatment cell (9) to a series of the apparatuses in the system; a carrying-in/out apparatus (3) for carrying the treatment cell in and out of the carrying apparatus; a surface treatment apparatus (4) for performing a surface treatment on the workpiece by receiving the treatment cell from the carrying apparatus and supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell; and a workpiece collection apparatus (5) for collecting the workpiece by receiving the treatment cell from the carrying apparatus, inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, wherein the carrying apparatus carries the treatment cell to the surface treatment apparatus, and then to the workpiece collection apparatus.

摘要翻译： 一种工件表面处理系统（1），其通过将包含工件的处理单元（9）顺序地携带到各个装置中的一系列装置来获得表面处理的工件，其特征在于包括：运送装置（2 ），用于将所述处理单元（9）顺序地携带到所述系统中的一系列装置; 用于将处理单元搬入和移出运送装置的搬入/退出装置（3）; 表面处理装置（4），用于通过从所述运送装置接收所述处理电池而对所述工件进行表面处理，并且在旋转所述处理电池的同时将表面处理液供给到所述处理室的内部; 以及工件收集装置（5），用于通过从运送装置接收处理电池来收集工件，翻转处理电池，并用水从下方喷射处理电池的内部以流出工件，其中运送装置携带 处理电池到表面处理装置，然后到工件收集装置。