公开(公告)号：US08878228B2

公开(公告)日：2014-11-04

申请号：US13968317

申请日：2013-08-15

申请人： Young Seob Lee

发明人： Young Seob Lee

IPC分类号： H01L33/64 ,  F21V29/00 ,  H05K1/02 ,  H05K3/00 ,  F21K99/00 ,  F21Y101/02 ,  F21W131/103

CPC分类号： H01L33/647 ,  F21K9/00 ,  F21V29/20 ,  F21V29/70 ,  F21V29/89 ,  F21W2131/103 ,  F21Y2115/10 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/0206 ,  H05K3/0047 ,  H05K3/0061 ,  H05K2201/0305 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2203/1572 ,  H01L2924/00014

摘要： A method of packaging a power light emitting diode (LED). The method may include providing a printed circuit board (PCB) wherein first and second copper (Cu) thin films are formed on both faces of the PCB respectively, forming a single upper opening through an entire thickness of the first Cu thin film and an partial thickness of the PCB, forming a plurality of lower openings, each lower opening extending vertically from the upper opening to the second Cu thin film, forming solder pads on the first Cu thin film, filing a cream solder in the upper opening and the plurality of lower openings so as to be in-plane with the solder pads, mounting a power LED on the PCB so that lead frames of the LED are aligned with the solder pads and a heat-discharge region of the LED is aligned with the cream solder, and soldering the cream solder.

摘要翻译： 一种封装功率发光二极管（LED）的方法。 该方法可以包括提供印刷电路板（PCB），其中分别在PCB的两个表面上形成第一和第二铜（Cu）薄膜，通过第一Cu薄膜的整个厚度形成单个上部开口， PCB的厚度，形成多个下开口，每个下开口从上开口垂直延伸到第二Cu薄膜，在第一Cu薄膜上形成焊盘，在上开口中填充膏状焊膏， 下开口以与焊垫在一起，在PCB上安装电源LED，使得LED的引线框架与焊盘对准，并且LED的放热区域与膏状焊料对准， 并焊接奶油焊膏。