公开(公告)号：US07592204B2

公开(公告)日：2009-09-22

申请号：US11998730

申请日：2007-11-29

申请人： Aaron J. Meyers ,  William F. Eaton ,  Abannl B. Maxwell ,  Scott E. Michelhaugh

发明人： Aaron J. Meyers ,  William F. Eaton ,  Abannl B. Maxwell ,  Scott E. Michelhaugh

IPC分类号： H01L21/44

CPC分类号： G01R33/09

摘要： A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.

公开(公告)号：US20090142857A1

公开(公告)日：2009-06-04

申请号：US11998730

申请日：2007-11-29

申请人： Aaron J. Meyers ,  William F. Eaton ,  Abannl B. Maxwell ,  Scott E. Michelhaugh

发明人： Aaron J. Meyers ,  William F. Eaton ,  Abannl B. Maxwell ,  Scott E. Michelhaugh

IPC分类号： H01L21/56

CPC分类号： G01R33/09

摘要： A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.

摘要翻译： 通过将内包装封装在外包装中来生产小传感器组件。 内部组件可以具有附接到引线框架的电气部件和传感器。 电气部件可以在具有对准压痕的内部封装内被保护。 对准凹口定位在引线框架的外边缘上方，并且优选地，没有电气部件直接位于对准凹槽的下面。 内部组件通过可移动的销在塑料流入的模具内保持对准。 模具被配置成使一些塑料比塑料的其余部分更早地设置并且将内部组件保持在模具内对准。 一旦足够的塑料固定住内部组件，可移动销就可以缩回。 然后将塑料脱模可以流入对齐凹口。 一旦所有的塑料都固定，就形成一个密封的传感器组件。

公开(公告)号：US07387040B2

公开(公告)日：2008-06-17

申请号：US11207453

申请日：2005-08-19

申请人： William F. Eaton ,  Aaron J. Meyers

发明人： William F. Eaton ,  Aaron J. Meyers

IPC分类号： G01D3/036

CPC分类号： G12B9/08 ,  Y10T29/4987

摘要： A sensor is associated with a mounting surface. An O-ring is then positioned between the sensor and the mounting surface, such that the O-ring is compressible when the sensor is fixed to the mounting surface. A fixing mechanism is generally provided for permanently fixing the sensor to the mounting surface, such that the O-ring located between the sensor and the mounting surface provides a proper tension thereof which prevents the sensor from being adversely affected by vibration resulting from a harsh vibration environment in which the sensor operates. The fixing mechanism can be implemented as a fixing joint between the sensor and the mounting surface. Additionally, the O-ring and the sensor are configured with respect to one another and the mounting surface to maintain tension in the fixing joint.

摘要翻译： 传感器与安装表面相关联。 然后将O形环定位在传感器和安装表面之间，使得当传感器固定到安装表面时，O形环是可压缩的。 通常设置固定机构用于将传感器永久地固定到安装表面，使得位于传感器和安装表面之间的O形环提供适当的张力，防止传感器受到由于刺激性振动引起的振动的不利影响 传感器工作的环境。 固定机构可以实现为传感器和安装表面之间的固定接头。 此外，O形环和传感器相对于彼此和安装表面构造以保持固定接头中的张力。

公开(公告)号：US07271584B2

公开(公告)日：2007-09-18

申请号：US11178654

申请日：2005-07-09

申请人： Jason M. Chilcote ,  Gregory R. Furlong ,  Joseph K. Murdock ,  Aaron J. Meyers

发明人： Jason M. Chilcote ,  Gregory R. Furlong ,  Joseph K. Murdock ,  Aaron J. Meyers

IPC分类号： G01B7/30 ,  G01R33/07

CPC分类号： G01D5/24476

摘要： A magnetic sensing apparatus includes a first magnetic transducer separated spatially from a second magnetic transducer and proximate to a target and a direction decoding circuit associated with the first and second magnetic transducers, wherein the direction decoding circuit produces output pulses that provide data indicative of a rotation of the target while rejecting rotational vibration signals associated with the target during a rotational detection of the target utilizing the first and second magnetic transducers without producing erroneous output pulses or missing an excessive number of the output pulses during speed and rotational detection operations thereof.