公开(公告)号：US5610443A

公开(公告)日：1997-03-11

申请号：US524869

申请日：1995-09-07

申请人： Akihiro Inagaki ,  Isao Yamamura

发明人： Akihiro Inagaki ,  Isao Yamamura

IPC分类号： C08L63/00 ,  C08G59/68 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08G59/68 ,  H01L23/293 ,  H01L2924/0002

摘要： A method of encapsulating a semiconductor comprising encapsulating a semiconductor in a curable epoxy resin composition comprising a liquid epoxy resin, an inorganic filler, an onium salt compound and an internal releasing agent, and substantially not containing a hardener, and then molding the above composition.

摘要翻译： 一种封装半导体的方法，包括将半导体封装在包含液体环氧树脂，无机填料，鎓盐化合物和内部脱模剂的可固化环氧树脂组合物中，并且基本上不含有硬化剂，然后成型上述组合物。

公开(公告)号：US5200025A

公开(公告)日：1993-04-06

申请号：US762587

申请日：1991-09-19

申请人： Keiji Toei ,  Yasuyoshi Miyaji ,  Masanobu Sato ,  Akihiro Inagaki ,  Seiji Tonogai ,  Koichi Omoto

发明人： Keiji Toei ,  Yasuyoshi Miyaji ,  Masanobu Sato ,  Akihiro Inagaki ,  Seiji Tonogai ,  Koichi Omoto

IPC分类号： C23F1/02 ,  C23F1/04 ,  H01J9/14 ,  H01L21/68

CPC分类号： H01L21/6835 ,  C23F1/02 ,  C23F1/04 ,  H01J9/142 ,  H01L2221/68377

摘要： A method of forming small through-holes in a thin metal layer including the steps of forming resist films having openings formed in accordance with a predetermined pattern; etching one or both sides of the thin metal plate and stopping etching before through-holes are formed; removing the overhang of the resist film by spraying high pressure fluid onto the etched side of the thin metal plate; covering the surface by an etch-resisting layer; forming through-holes by etching the side not covered; and stripping the etch-resisting layer and the resist film.