公开(公告)号：US06332558B1

公开(公告)日：2001-12-25

申请号：US09497149

申请日：2000-02-03

申请人： Akihiro Udagawa ,  Mamoru Tsuda

发明人： Akihiro Udagawa ,  Mamoru Tsuda

IPC分类号： B65H360

CPC分类号： H05K13/028

摘要： A chip feeder for feeding chips stored in bulk in a case thereof, one by one, from a chip-supply portion thereof, the chip feeder including a partition plate which parts an inner space of the case into a plurality of rooms, the partition plate having an opening which extends in a direction intersecting a horizontal plane and which communicates the respective rooms on both sides of the partition plate, with each other, a movable partition member which extends across the opening of the partition plate and which is movable relative to the opening in the direction intersecting the horizontal plane, and a movable-partition-member control device which controls the movable partition member so that a lower portion of the movable partition member sinks in an upper portion of a mass of the chips stored in bulk in the case and an upper portion of the movable partition member projects upward from the mass of the chips.

摘要翻译： 一种用于从其芯片供应部分一个接一个地放入批量存储的芯片的芯片馈送器，所述芯片馈送器包括将所述壳体的内部空间分成多个房间的隔板，所述隔板 具有在与水平面相交的方向上延伸的开口，并且将分隔板两侧的相应房间彼此连通，可移动分隔构件延伸穿过隔板的开口并且可相对于 在与水平面相交的方向上开口的可动分隔构件控制装置以及可动分隔构件控制装置，该可动分隔构件控制装置控制可动分隔构件，使得可移动分隔构件的下部在大量存储的芯片块的上部下沉 壳体和可动分隔部件的上部从芯片的质量向上突出。

公开(公告)号：US5881914A

公开(公告)日：1999-03-16

申请号：US938971

申请日：1997-09-26

申请人： Mamoru Tsuda ,  Akihiro Udagawa

发明人： Mamoru Tsuda ,  Akihiro Udagawa

IPC分类号： B05C5/00 ,  B05C11/02 ,  B05C11/10 ,  B65C9/22 ,  B67D5/05 ,  B65D88/54 ,  B67D5/42 ,  B67D5/62

CPC分类号： B05C11/1042 ,  B05C11/10 ,  B65C9/2221

摘要： An adhesive dispenser for iteratively dispensing a controlled amount of an adhesive from a reservoir, by iteratively applying a pressure to the adhesive stored in the reservoir such that the controlled amount of adhesive is released from a nozzle connected to the reservoir via a supply passage and is applied to an object, the adhesive dispenser including at least one of an adhesive-temperature control device which controls a temperature of the adhesive present in the supply passage, by supplying a fluid to a first space at least partly surrounding at least a portion of the supply passage, and a pressure control device which is switchable to at least a pressing state thereof in which the pressure control device supplies a pressurized gas to a second space above the adhesive stored in the reservoir and a sucking state thereof in which the pressure control device sucks the gas from the second space.

摘要翻译： 一种粘合剂分配器，用于通过向储存器中存储的粘合剂迭代地施加压力，使得受控量的粘合剂经由供应通道从连接到储存器的喷嘴释放而从储存器中迭代地分配受控量的粘合剂，并且是 应用于物体的粘合剂分配器包括粘合温度控制装置中的至少一个，其控制存在于供给通道中的粘合剂的温度，通过将流体供应至少部分地围绕至少一部分 供给通路和压力控制装置，该压力控制装置能够切换至至少其按压状态，在该压力状态下，压力控制装置向存储在储存器中的粘合剂上方的第二空间提供加压气体，其吸入状态为压力控制装置 从第二个空间吸取气体。