公开(公告)号：US20240326084A1

公开(公告)日：2024-10-03

申请号：US18735743

申请日：2024-06-06

Applicant: MUSASHI ENGINEERING, INC.

Inventor： Kazumasa Ikushima

IPC: B05C11/10 ,  A61B17/00 ,  B05C5/00 ,  B05C5/02 ,  B05C17/005 ,  B05C17/01 ,  B65D83/66 ,  G05D16/02

CPC classification number: B05C11/1013 ,  B05C5/00 ,  B05C5/0225 ,  B05C11/10 ,  B05C17/00573 ,  B05C17/00593 ,  B05C17/014 ,  B65D83/66 ,  A61B17/00491 ,  G05D16/02

Abstract: A discharge device capable of suppressing pressure fluctuation of a compressed gas supplied to a container in which a liquid material is stored. The device includes a storage container in which a liquid material is stored; a discharge port through which the liquid material is discharged; a pressure control valve that adjusts a pressure of a compressed gas supplied from an external compressed gas source to a desired level; a discharge valve that establishes or cuts off communication between the pressure control valve and the storage container; a control device that controls operation of the discharge valve; a first flow line connecting the pressure control valve and the discharge valve; and a second flow line connecting the discharge valve and the storage container. The device further includes a third flow line branched from the first flow line, and a leak mechanism connected to the third flow line.

公开(公告)号：US12090514B2

公开(公告)日：2024-09-17

申请号：US18096769

申请日：2023-01-13

Applicant: Akadeum Life Sciences, Inc.

Inventor： Brandon H. McNaughton ,  Nadia Petlakh ,  John G. Younger ,  Greg Hermanson ,  Bill Hyun ,  Vanessa Kelchner

IPC: B05D7/00 ,  B05C3/02 ,  B05C11/10 ,  B05C19/02 ,  B05D1/18 ,  B05D1/22 ,  B05D1/36 ,  B05D5/04 ,  C12M1/00 ,  C12M1/26

CPC classification number: B05D7/5883 ,  B05C3/02 ,  B05C11/10 ,  B05C19/02 ,  B05D1/18 ,  B05D1/22 ,  B05D1/36 ,  B05D5/04 ,  C12M33/00 ,  C12M47/04

Abstract: A system for buoyant particle processing includes: a reaction vessel, a stirring mechanism, a set of one or more pumps, and a filter. The system can additionally or alternatively include a set of pathways and/or any other suitable component(s). A method for buoyant particle processing includes: stirring the contents of a reaction vessel; washing a set of buoyant particles; and filtering the contents of the reaction vessel. Additionally or alternatively, the method can include any or all of: preprocessing the set of buoyant particles; adding a set of inputs to the reaction vessel; washing the set of buoyant particles; repeating one or more; and/or any other suitable process(es).

公开(公告)号：US12076744B2

公开(公告)日：2024-09-03

申请号：US17293031

申请日：2019-10-16

Applicant: THREEBOND CO., LTD.

Inventor： Hiroaki Sakai

IPC: B05C11/10 ,  F04B15/02

CPC classification number: B05C11/10 ,  F04B15/02

Abstract: An assembly is used for an applying device having a first pressurizing member that can pressurize a viscous material stored in a first container, and a second container having the viscous material stored, the second container being relatively approachable and separatable with respect to the first pressurizing member. The first pressurizing member includes a first contact unit contactable with the second container and a first passage through which the viscous material stored in the first container is circulatable to the second container. The second container includes a second contact unit contactable with the first contact unit, and a second passage provided on the second contact unit, the second passage being interrupted from the first passage when the first contact unit is brought into contact with the second contact unit, the second passage communicating with the first passage when the first contact unit is separated from the second contact unit.

公开(公告)号：US20240290635A1

公开(公告)日：2024-08-29

申请号：US18437852

申请日：2024-02-09

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Shogo KUNIEDA ,  Yuta SASAKI ,  Koki UONAMI ,  Yosuke HANAWA

IPC: H01L21/67 ,  B05C11/10 ,  B05C13/02

CPC classification number: H01L21/67034 ,  B05C11/10 ,  B05C13/02

Abstract: The present invention relates to a substrate treating method, a substrate treating apparatus, a treatment liquid, and a treatment liquid evaluation method. The substrate treating method includes a treatment liquid supply step, a solidified film forming step, and a sublimation step. In the treatment liquid supply step, the treatment liquid is supplied to a substrate. The treatment liquid contains a sublimable substance and a solvent. In the solidified film forming step, the solvent evaporates from the treatment liquid on the substrate. In the solidified film forming step, a solidified film is formed on the substrate. The solidified film contains the sublimable substance. In the sublimation step, the solidified film sublimates. The substrate is dried by sublimation of the solidified film. Here, the sublimable substance has a maximum positive partial charge of 0.22 or more and less than 0.34.

公开(公告)号：US11975958B2

公开(公告)日：2024-05-07

申请号：US17975520

申请日：2022-10-27

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Cheng-Han Tsai ,  Wei-Lung Pan ,  Chih-Ta Wu ,  I-hsin Lin

IPC: B67C3/34 ,  B05C11/10

CPC classification number: B67C3/34 ,  B05C11/10

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

公开(公告)号：US20240050977A1

公开(公告)日：2024-02-15

申请号：US18260575

申请日：2022-01-04

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA

IPC: B05C11/10 ,  B05C11/08

CPC classification number: B05C11/10 ,  B05C11/08 ,  H01L21/6838

Abstract: A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.

公开(公告)号：US20240024912A1

公开(公告)日：2024-01-25

申请号：US18043359

申请日：2021-08-18

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Kazunori MAEDA ,  Kenji KITAJIMA ,  Atsushi WATANABE ,  Masashi MOTOI

IPC: B05C5/02 ,  B05C11/10

CPC classification number: B05C5/0258 ,  B05C5/0262 ,  B05C11/10

Abstract: A coating device comprises a die with a slit that is longer in a width direction and discharges a coating liquid to form a coating film on a substrate, a first flow path that supplies the coating liquid toward the die, a first manifold that is linked to the first flow path and holds the coating liquid that flows in from the first flow path, a plurality of second flow paths that are linked to the first manifold, a second manifold that is linked to the second flow paths and the slit, is longer in the width direction, and holds the coating liquid that flows in from the second flow paths, and an adjustment unit that is provided along at least one of the second flow paths and adjusts a flow of the coating liquid flowing through the at least one of the second flow paths.

公开(公告)号：US20230166291A1

公开(公告)日：2023-06-01

申请号：US18096769

申请日：2023-01-13

Applicant: Akadeum Life Sciences, Inc.

Inventor： Brandon H. McNaughton ,  Nadia Petlakh ,  John G. Younger ,  Greg Hermanson ,  Bill Hyun ,  Vanessa Kelchner

IPC: B05D7/00 ,  C12M1/26 ,  B05C11/10 ,  B05D1/18 ,  B05C3/02 ,  C12M1/00

CPC classification number: B05D7/5883 ,  C12M33/00 ,  B05C11/10 ,  B05D1/18 ,  B05C3/02 ,  C12M47/04

Abstract: A system for buoyant particle processing includes: a reaction vessel, a stirring mechanism, a set of one or more pumps, and a filter. The system can additionally or alternatively include a set of pathways and/or any other suitable component(s). A method for buoyant particle processing includes: stirring the contents of a reaction vessel; washing a set of buoyant particles; and filtering the contents of the reaction vessel. Additionally or alternatively, the method can include any or all of: preprocessing the set of buoyant particles; adding a set of inputs to the reaction vessel; washing the set of buoyant particles; repeating one or more; and/or any other suitable process(es).

公开(公告)号：US20230147887A1

公开(公告)日：2023-05-11

申请号：US18065797

申请日：2022-12-14

Applicant: Kateeva, Inc.

Inventor： Eliyahu Vronsky ,  Nahid Harjee

IPC: H01L21/66 ,  H01L21/02 ,  H04N1/405 ,  B41J2/205 ,  B41J2/01 ,  B05C11/10 ,  H01L21/67 ,  H01L33/52 ,  H01L31/0203 ,  H01L31/048 ,  H01L33/54 ,  B41J2/21

CPC classification number: H01L22/12 ,  B05C11/10 ,  B41J2/01 ,  B41J2/21 ,  B41J2/2054 ,  H01L21/02288 ,  H01L21/67126 ,  H01L22/26 ,  H01L31/048 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/54 ,  H04N1/405 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K71/70 ,  H10K71/135 ,  H01L33/56 ,  H10K50/8445 ,  H10K59/1201 ,  Y02E10/549 ,  Y02P70/50

Abstract: An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

公开(公告)号：US20180334318A1

公开(公告)日：2018-11-22

申请号：US15814842

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Jhin Cho ,  In Kwang Bae ,  Jung Min Oh ,  Mi Hyun Park ,  Kun Tack Lee ,  Yong Jun Jun

IPC: B65D85/00 ,  B65D90/46 ,  G01R29/24 ,  C09D5/24 ,  C08L27/20 ,  C08F14/22 ,  C08F14/26 ,  C08K3/04 ,  H01L21/67

CPC classification number: B65D85/70 ,  B05B5/025 ,  B05C11/10 ,  B65D90/46 ,  C08F14/22 ,  C08F14/26 ,  C08G2261/1424 ,  C08G2261/312 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/3422 ,  C08G2261/51 ,  C08K3/041 ,  C08K3/042 ,  C08L27/20 ,  C08L65/00 ,  C09D5/24 ,  G01R29/24 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67253

Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.