Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface
    1.
    发明授权
    Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface 有权
    用于检查晶片表面的装置,用于检查晶片表面的方法,用于判断缺陷晶片的装置,用于判断缺陷晶片的方法,以及用于在晶片表面上处理信息的装置

    公开(公告)号:US07383156B2

    公开(公告)日:2008-06-03

    申请号:US10363746

    申请日:2001-09-05

    IPC分类号: G06F19/00 G06F17/40

    摘要: It is possible to inspect scratches and staining on a wafer surface on the basis of an LPD map obtained from a particle counter 11, by providing a means 21 for detecting aggregation of clustered point defects (LPD) from two-dimensional distribution information 30 for such fine LPD on the surface of a silicon wafer, and an improvement in the inspection efficiency and the precision of judgements of “defective” status can be achieved. Furthermore, the system is devised so that the trend of generation of scratches and staining in a specified process can easily be detected by accumulating wafer surface information such as scratch information, staining information and the like for the wafer surface detected by a wafer surface inspection device 11 (especially as image information or numerical information), and superposing sets of information thus accumulated. Plans for improving processes can be made by both the wafer supplier and wafer consumer by sharing such information with both parties.

    摘要翻译: 根据从粒子计数器11获得的LPD图,通过提供用于从二维分布信息30检测聚集点缺陷(LPD)的聚集的装置21,可以检查在晶片表面上的划痕和染色。 可以实现硅晶片表面的精细LPD,并且可以提高检查效率和“缺陷”状态的判断精度。 此外,设计了系统,以便通过对由晶片表面检查装置检测到的晶片表面积累诸如划痕信息,染色信息等的晶片表面信息,可以容易地检测在指定工艺中产生划痕和染色的趋势 11(特别是作为图像信息或数值信息),并叠加如此积累的信息集合。 晶圆供应商和晶圆消费者可以通过与双方共享这些信息来改善流程的计划。