公开(公告)号：US07383156B2

公开(公告)日：2008-06-03

申请号：US10363746

申请日：2001-09-05

申请人： Kouzou Matsusita ,  Yukinori Matsumura ,  Tomikazu Tanuki ,  Mitsuo Terada ,  Kotaro Hori ,  Kiyoharu Miyakawa ,  Akira Nisi ,  Hirobumi Miwa

发明人： Kouzou Matsusita ,  Yukinori Matsumura ,  Tomikazu Tanuki ,  Mitsuo Terada ,  Kotaro Hori ,  Kiyoharu Miyakawa ,  Akira Nisi ,  Hirobumi Miwa

IPC分类号： G06F19/00 ,  G06F17/40

CPC分类号： H01L22/20 ,  G01N21/956 ,  G01N2021/8861

摘要： It is possible to inspect scratches and staining on a wafer surface on the basis of an LPD map obtained from a particle counter 11, by providing a means 21 for detecting aggregation of clustered point defects (LPD) from two-dimensional distribution information 30 for such fine LPD on the surface of a silicon wafer, and an improvement in the inspection efficiency and the precision of judgements of “defective” status can be achieved. Furthermore, the system is devised so that the trend of generation of scratches and staining in a specified process can easily be detected by accumulating wafer surface information such as scratch information, staining information and the like for the wafer surface detected by a wafer surface inspection device 11 (especially as image information or numerical information), and superposing sets of information thus accumulated. Plans for improving processes can be made by both the wafer supplier and wafer consumer by sharing such information with both parties.

摘要翻译： 根据从粒子计数器11获得的LPD图，通过提供用于从二维分布信息30检测聚集点缺陷（LPD）的聚集的装置21，可以检查在晶片表面上的划痕和染色。 可以实现硅晶片表面的精细LPD，并且可以提高检查效率和“缺陷”状态的判断精度。 此外，设计了系统，以便通过对由晶片表面检查装置检测到的晶片表面积累诸如划痕信息，染色信息等的晶片表面信息，可以容易地检测在指定工艺中产生划痕和染色的趋势 11（特别是作为图像信息或数值信息），并叠加如此积累的信息集合。 晶圆供应商和晶圆消费者可以通过与双方共享这些信息来改善流程的计划。

公开(公告)号：US5849139A

公开(公告)日：1998-12-15

申请号：US824780

申请日：1997-03-26

申请人： Kiyoharu Miyakawa ,  Osamu Morikawa

发明人： Kiyoharu Miyakawa ,  Osamu Morikawa

IPC分类号： B25J15/06 ,  B65G49/07 ,  H01L21/304 ,  H01L21/683

CPC分类号： B24B37/345 ,  H01L21/6838 ,  Y10S414/141 ,  Y10T156/1744 ,  Y10T29/53191

摘要： A method of sticking a semiconductor wafer and its sticking equipment. The semiconductor wafer can be flat and efficiently stuck on a plate. The semiconductor wafer, which has its inner surface coated with an adhesive, is tiltedly configured to permit raising a circumference to a height of Ah and located the wafer above a sticking position on the plate. The semiconductor wafer is pressed by a lower end of a stamp-press to be parallel to a surface of the plate. Then a vacuum chuck (2) stops sucking to release the semiconductor wafer from a transporting arm, and the transporting arm is moved away. The stamp-press is moved downward to press a whole surface of the semiconductor wafer.

摘要翻译： 一种粘贴半导体晶片及其贴装设备的方法。 半导体晶片可以平坦且有效地贴在板上。 其内表面涂覆有粘合剂的半导体晶片被倾斜地配置成允许将周边升高到高度Ah，并将晶片定位在板上的粘贴位置上方。 半导体晶片被压印机的下端压制成平行于板的表面。 然后，真空吸盘（2）停止吸引从传送臂释放半导体晶片，并且传送臂移开。 压印机向下移动以按压半导体晶片的整个表面。

公开(公告)号：US5911257A

公开(公告)日：1999-06-15

申请号：US865832

申请日：1997-05-30

申请人： Osamu Morikawa ,  Kiyoharu Miyakawa

发明人： Osamu Morikawa ,  Kiyoharu Miyakawa

IPC分类号： B24B55/06 ,  B08B1/04 ,  H01L21/00 ,  H01L21/20 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L21/02052 ,  B08B1/04 ,  H01L21/2007 ,  H01L21/67028 ,  Y10T279/18

摘要： A device for removing objects adhered to a plate for bonding a semiconductor wafer, which can efficiently and completely remove the objects adhered on the chamfered portion of the bonding plate. The rotating shaft 12 of the head for removing adhered objects from the peripheral surface is inclinatorily mounted with respect to the top surface 52 of the bonding plate 5. The peripheral chamfered portion 51 is not aligned with the extended line of the central line 12c of the rotating shaft 12. The upper peripheral surface 21a of the outer tip 21 of the chuck 2 is inclinatorily mounted.

摘要翻译： 一种用于去除附着在用于接合半导体晶片的板的物体的装置，其可以有效地和完全地去除粘附在接合板的倒角部分上的物体。 用于从周面除去附着物的头部的旋转轴12相对于接合板5的顶面52被倾斜地安装。外周倒角部51不与中心线12c的延伸线对准 卡盘2的外端部21的上周面21a倾斜安装。