摘要:
The invention relates to an image sensor array having multiple pixel sensor elements along the surface area of said image sensor and outputting at a specified video frame rate subsequent video frames corresponding to the image, characterized in that each multiple pixel sensor element is arranged for generating one or more video frame segments, said segments each having a time duration being a fraction of the time equivalent to the video frame rate, and composing a single video frame from the multiple of said video frame segments. The invention also relates to said pixel sensor element for use with an image intensifier or in an electron bombarded image sensor array device according to the invention.
摘要:
The invention relates to an image sensor array having multiple pixel sensor elements along the surface area of said image sensor and outputting at a specified video frame rate subsequent video frames corresponding to the image, characterized in that each multiple pixel sensor element is arranged for generating one or more video frame segments, said segments each having a time duration being a fraction of the time equivalent to the video frame rate, and composing a single video frame from the multiple of said video frame segments. The invention also relates to said pixel sensor element for use with an image intensifier or in an electron bombarded image sensor array device according to the invention.
摘要:
The invention relates to an arrangement of a chemical-mechanical polishing tool for chemical-mechanical polishing a surface on a wafer, comprising a polishing pad (4), a drive unit (9), pressing means (6), a wafer holder (5), first dispensing means (7) and second dispensing means (8); the wafer holder for holding a wafer (W) being arranged at a holder location (L0); the pressing means (6) being arranged to press the wafer holder (5) to the polishing pad (4); the first dispensing means (7) for dispensing a first fluid on the polishing pad (4) being arranged at a first dispensing means location (L1); the second dispensing means (8) for dispensing a second fluid on the polishing pad (4) being arranged at a second dispensing means location (L2); the polishing pad (4) comprising a polishing surface for polishing the wafer (W), and the polishing pad (4) further being connected to the drive unit (9) for moving the polishing surface in a first direction (ω1) relative to the holder location (L0);wherein the first dispensing means location (L1) of the first dispensing means (7) is arranged in a downstream direction with respect to the holder location (L0) at a first downstream distance (d1), with the downstream direction being taken in relation to the first direction (ω1); and the second dispensing means location (L2) of the second dispensing means (8) is arranged in an upstream direction with respect to the holder location (L0) at a first upstream distance (d3), with the upstream direction being taken in relation to the first direction (ω1).The invention further relates to a method of chemical-mechanical polishing using such an arrangement.