Image sensor array, an intensified image sensor array, an electron bombarded image sensor array device as well as a pixel sensor element for use in such an image sensor array
    1.
    发明授权
    Image sensor array, an intensified image sensor array, an electron bombarded image sensor array device as well as a pixel sensor element for use in such an image sensor array 有权
    图像传感器阵列,强化图像传感器阵列,电子轰击图像传感器阵列器件以及用于这种图像传感器阵列的像素传感器元件

    公开(公告)号:US08384810B2

    公开(公告)日:2013-02-26

    申请号:US12809763

    申请日:2007-12-21

    IPC分类号: H04N5/335

    摘要: The invention relates to an image sensor array having multiple pixel sensor elements along the surface area of said image sensor and outputting at a specified video frame rate subsequent video frames corresponding to the image, characterized in that each multiple pixel sensor element is arranged for generating one or more video frame segments, said segments each having a time duration being a fraction of the time equivalent to the video frame rate, and composing a single video frame from the multiple of said video frame segments. The invention also relates to said pixel sensor element for use with an image intensifier or in an electron bombarded image sensor array device according to the invention.

    摘要翻译: 本发明涉及一种具有沿着所述图像传感器的表面区域的多个像素传感器元件的图像传感器阵列,并且以指定的视频帧速率输出与图像相对应的后续视频帧,其特征在于,每个多个像素传感器元件被布置用于产生一个 或更多的视频帧段,所述段各自具有等于视频帧速率的时间的一小部分的时间长度,以及从所述视频帧段的多个组成单个视频帧。 本发明还涉及用于与图像增强器或根据本发明的电子轰击图像传感器阵列器件一起使用的所述像素传感器元件。

    IMAGE SENSOR ARRAY, AN INTENSIFIED IMAGE SENSOR ARRAY, AN ELECTRON BOMBARDED IMAGE SENSOR ARRAY DEVICE AS WELL AS A PIXEL SENSOR ELEMENT FOR USE IN SUCH AN IMAGE SENSOR ARRAY
    2.
    发明申请
    IMAGE SENSOR ARRAY, AN INTENSIFIED IMAGE SENSOR ARRAY, AN ELECTRON BOMBARDED IMAGE SENSOR ARRAY DEVICE AS WELL AS A PIXEL SENSOR ELEMENT FOR USE IN SUCH AN IMAGE SENSOR ARRAY 有权
    图像传感器阵列,增强型图像传感器阵列,电子管理的图像传感器阵列设备,作为用于此类图像传感器阵列的像素传感器元件

    公开(公告)号:US20100328501A1

    公开(公告)日:2010-12-30

    申请号:US12809763

    申请日:2007-12-21

    IPC分类号: H04N5/225

    摘要: The invention relates to an image sensor array having multiple pixel sensor elements along the surface area of said image sensor and outputting at a specified video frame rate subsequent video frames corresponding to the image, characterized in that each multiple pixel sensor element is arranged for generating one or more video frame segments, said segments each having a time duration being a fraction of the time equivalent to the video frame rate, and composing a single video frame from the multiple of said video frame segments. The invention also relates to said pixel sensor element for use with an image intensifier or in an electron bombarded image sensor array device according to the invention.

    摘要翻译: 本发明涉及一种具有沿着所述图像传感器的表面区域的多个像素传感器元件的图像传感器阵列,并且以指定的视频帧速率输出与图像相对应的后续视频帧,其特征在于,每个多个像素传感器元件被布置用于产生一个 或更多的视频帧段,所述段各自具有等于视频帧速率的时间的一小部分的时间长度,以及从所述视频帧段的多个组成单个视频帧。 本发明还涉及用于与图像增强器或根据本发明的电子轰击图像传感器阵列器件一起使用的所述像素传感器元件。

    Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool

    公开(公告)号:US07025662B2

    公开(公告)日:2006-04-11

    申请号:US11197755

    申请日:2005-08-03

    IPC分类号: B24B53/00 B24B7/22

    CPC分类号: B24B37/04 B24B57/02

    摘要: The invention relates to an arrangement of a chemical-mechanical polishing tool for chemical-mechanical polishing a surface on a wafer, comprising a polishing pad (4), a drive unit (9), pressing means (6), a wafer holder (5), first dispensing means (7) and second dispensing means (8); the wafer holder for holding a wafer (W) being arranged at a holder location (L0); the pressing means (6) being arranged to press the wafer holder (5) to the polishing pad (4); the first dispensing means (7) for dispensing a first fluid on the polishing pad (4) being arranged at a first dispensing means location (L1); the second dispensing means (8) for dispensing a second fluid on the polishing pad (4) being arranged at a second dispensing means location (L2); the polishing pad (4) comprising a polishing surface for polishing the wafer (W), and the polishing pad (4) further being connected to the drive unit (9) for moving the polishing surface in a first direction (ω1) relative to the holder location (L0);wherein the first dispensing means location (L1) of the first dispensing means (7) is arranged in a downstream direction with respect to the holder location (L0) at a first downstream distance (d1), with the downstream direction being taken in relation to the first direction (ω1); and the second dispensing means location (L2) of the second dispensing means (8) is arranged in an upstream direction with respect to the holder location (L0) at a first upstream distance (d3), with the upstream direction being taken in relation to the first direction (ω1).The invention further relates to a method of chemical-mechanical polishing using such an arrangement.