公开(公告)号：US08359740B2

公开(公告)日：2013-01-29

申请号：US13140637

申请日：2009-12-18

Applicant: Christian Val ,  Pascal Couderc ,  Alexandre Val

Inventor： Christian Val ,  Pascal Couderc ,  Alexandre Val

IPC: H05K3/30

CPC classification number: H01L21/6835 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/13139 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/141 ,  H05K1/185 ,  H05K3/321 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/0401

Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.

Abstract translation: 用于晶片尺寸制造CMS电子模块的工艺从具有金属化输出的晶片开始，包括以树脂模制的电子部件，以及在一侧上沉积有不可氧化的金属或合金的电子部件的外部输出，以及 设置有可氧化金属或合金接触垫的印刷电路。 在该过程中，以预定图案切割晶片以获得包括至少一个电子部件的重新配置的模制部件; 重新配置的组件被组装在印刷电路上，重新配置的组件的金属化的外部输出与印刷电路的金属化接触焊盘相对放置; 并且这些外部输出通过基于导电粘合剂或墨水的材料无焊地连接到印刷电路的金属化接触焊盘。

公开(公告)号：US20110247210A1

公开(公告)日：2011-10-13

申请号：US13140637

申请日：2009-12-18

Applicant: Christian Val ,  Pascal Couderc ,  Alexandre Val

Inventor： Christian Val ,  Pascal Couderc ,  Alexandre Val

IPC: H05K3/30

CPC classification number: H01L21/6835 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/13139 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/141 ,  H05K1/185 ,  H05K3/321 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/0401

Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.

Abstract translation: 用于晶片尺寸制造CMS电子模块的工艺从具有金属化输出的晶片开始，包括以树脂模制的电子部件，以及在一侧上沉积有不可氧化的金属或合金的电子部件的外部输出，以及 设置有可氧化金属或合金接触垫的印刷电路。 在该过程中，以预定图案切割晶片以获得包括至少一个电子部件的重新配置的模制部件; 重新配置的组件被组装在印刷电路上，重新配置的组件的金属化的外部输出与印刷电路的金属化接触焊盘相对放置; 并且这些外部输出通过基于导电粘合剂或墨水的材料无焊地连接到印刷电路的金属化接触焊盘。