公开(公告)号：US08359740B2

公开(公告)日：2013-01-29

申请号：US13140637

申请日：2009-12-18

Applicant: Christian Val ,  Pascal Couderc ,  Alexandre Val

Inventor： Christian Val ,  Pascal Couderc ,  Alexandre Val

IPC: H05K3/30

CPC classification number: H01L21/6835 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/13139 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/141 ,  H05K1/185 ,  H05K3/321 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/0401

Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.

Abstract translation: 用于晶片尺寸制造CMS电子模块的工艺从具有金属化输出的晶片开始，包括以树脂模制的电子部件，以及在一侧上沉积有不可氧化的金属或合金的电子部件的外部输出，以及 设置有可氧化金属或合金接触垫的印刷电路。 在该过程中，以预定图案切割晶片以获得包括至少一个电子部件的重新配置的模制部件; 重新配置的组件被组装在印刷电路上，重新配置的组件的金属化的外部输出与印刷电路的金属化接触焊盘相对放置; 并且这些外部输出通过基于导电粘合剂或墨水的材料无焊地连接到印刷电路的金属化接触焊盘。

公开(公告)号：US20110247210A1

公开(公告)日：2011-10-13

申请号：US13140637

申请日：2009-12-18

Applicant: Christian Val ,  Pascal Couderc ,  Alexandre Val

Inventor： Christian Val ,  Pascal Couderc ,  Alexandre Val

IPC: H05K3/30

CPC classification number: H01L21/6835 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/13139 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/141 ,  H05K1/185 ,  H05K3/321 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/0401

Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.

Abstract translation: 用于晶片尺寸制造CMS电子模块的工艺从具有金属化输出的晶片开始，包括以树脂模制的电子部件，以及在一侧上沉积有不可氧化的金属或合金的电子部件的外部输出，以及 设置有可氧化金属或合金接触垫的印刷电路。 在该过程中，以预定图案切割晶片以获得包括至少一个电子部件的重新配置的模制部件; 重新配置的组件被组装在印刷电路上，重新配置的组件的金属化的外部输出与印刷电路的金属化接触焊盘相对放置; 并且这些外部输出通过基于导电粘合剂或墨水的材料无焊地连接到印刷电路的金属化接触焊盘。

公开(公告)号：US4860100A

公开(公告)日：1989-08-22

申请号：US154178

申请日：1988-02-08

Applicant: Issa Rakhodai ,  Serge G. Lefebvre ,  Pascal Couderc

Inventor： Issa Rakhodai ,  Serge G. Lefebvre ,  Pascal Couderc

IPC: H04N5/04 ,  H04N7/083 ,  H04N11/08

CPC classification number: H04N11/08 ,  H04N7/083

Abstract: A system which provides synchronization with frame synchronization words of a partially digital signal, such as that of the D2MAC television standard. It is provided that three modes of operation are established sequentially. In a first mode, the values necessary to control the gain and the d.c. level of the television signal are obtained by means of a peak detector (18). Similarly, in a second mode, the peak detector is enabled only during the digital signal periods of the D2MAC signal. Finally, in the third mode, the setting values are obtained by arrangements (13, 8) which depend on the clamp plateau measurement of each line and of line 624. The television signal is converted into a digital signal by an analog/digital converter (6), which, more specifically, feeds the digital arrangement (8) for measuring the picture plateaus; the results of the peak detector measurement (18) are also converted into digital values (17), managing the procedure and the processing of at least a portion of the control signals is effected by a microprocessor (33) and certain control signals are again converted into analog values by a digital/analog converter (10).

Abstract translation: 提供与部分数字信号的帧同步字（例如D2MAC电视标准的帧同步字）同步的系统。 提供了顺序建立三种操作模式。 在第一种模式下，控制增益和直流电压所需的值。 通过峰值检测器（18）获得电视信号的电平。 类似地，在第二模式中，峰值检测器仅在D2MAC信号的数字信号周期期间使能。 最后，在第三模式中，通过依赖于每条线路和线路624的钳位平台测量的布置（13,8）获得设定值。电视信号由模拟/数字转换器转换成数字信号 6），更具体地，馈送用于测量图像平台的数字排列（8）; 峰值检测器测量（18）的结果也被转换成数字值（17），管理过程，并且至少一部分控制信号的处理由微处理器（33）实现，并且某些控制信号被再次转换 由数字/模拟转换器（10）转换为模拟值。