公开(公告)号：US09006847B2

公开(公告)日：2015-04-14

申请号：US13817698

申请日：2011-07-20

申请人： Aline Welter ,  Alexander Lux ,  Christoph Gmelin ,  Jens Vollert ,  Reinhold Herrmann ,  Eckart Schellkes

发明人： Aline Welter ,  Alexander Lux ,  Christoph Gmelin ,  Jens Vollert ,  Reinhold Herrmann ,  Eckart Schellkes

IPC分类号： H01L29/84 ,  G01L19/06 ,  G01L19/00

CPC分类号： H01L29/84 ,  G01L19/0084 ,  G01L19/0627 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.

摘要翻译： 在用于容纳压力传感器芯片并用于安装到传感器壳体的传感器模块中，模块壁单元连接到模块底部并且围绕压力传感器芯片。 至少在整个外部区域，通过模块壁向外部传导的多个连接元件直线运行。 此外，连接元件在它们的顶部和底部侧露出，用于固定和电连接至少一个电气部件，并将传感器模块电气集成到传感器外壳中。 以这种方式，双面使用具有相同外部几何形状和相同连接器的传感器模块是可能的。

公开(公告)号：US20130221458A1

公开(公告)日：2013-08-29

申请号：US13817698

申请日：2011-07-20

申请人： Aline Welter ,  Alexander Lux ,  Christoph Gmelin ,  Jens Vollert ,  Reinhold Herrmann ,  Eckart Schellkes

发明人： Aline Welter ,  Alexander Lux ,  Christoph Gmelin ,  Jens Vollert ,  Reinhold Herrmann ,  Eckart Schellkes

IPC分类号： H01L29/84

CPC分类号： H01L29/84 ,  G01L19/0084 ,  G01L19/0627 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.

摘要翻译： 在用于容纳压力传感器芯片并用于安装到传感器壳体的传感器模块中，模块壁单元连接到模块底部并且围绕压力传感器芯片。 至少在整个外部区域，通过模块壁向外部传导的多个连接元件直线运行。 此外，连接元件在它们的顶部和底部侧露出，用于固定和电连接至少一个电气部件，并将传感器模块电气集成到传感器外壳中。 以这种方式，双面使用具有相同外部几何形状和相同连接器的传感器模块是可能的。