Demetallization of polymer/metal multilayer films by etching
    3.
    发明授权
    Demetallization of polymer/metal multilayer films by etching 失效
    通过蚀刻对聚合物/金属多层膜进行去金属化

    公开(公告)号:US5716532A

    公开(公告)日:1998-02-10

    申请号:US661387

    申请日:1996-06-11

    摘要: A method of improving the breakdown strength of polymer multi-layer (PML) capacitors is provided. The method comprises removing metal, specifically, aluminum, from the cut edge. This is done by either etching back the metal electrode layers in either basic or acidic solution or by anodizing the metal to cover that portion of the metal at the edge with an oxide. Removing the metal from the cut edge increases the breakdown strength of the PML capacitors by a factor of two or more.

    摘要翻译: 提供了一种提高聚合物多层(PML)电容器的击穿强度的方法。 该方法包括从切割边缘去除金属,特别是铝。 这是通过在碱性或酸性溶液中蚀刻金属电极层或通过阳极氧化金属来覆盖边缘处的金属部分以用氧化物来完成的。 从切割边缘去除金属会使PML电容器的击穿强度提高2倍以上。