Photostructurable polyimide mixtures
    1.
    发明授权
    Photostructurable polyimide mixtures 失效
    可光聚酰亚胺混合物

    公开(公告)号:US4851506A

    公开(公告)日:1989-07-25

    申请号:US135813

    申请日:1987-12-21

    IPC分类号: C08L79/08 G03F7/038

    CPC分类号: G03F7/0387 C08L79/08

    摘要: The present invention relates to compositions comprising(a) at least one polyimide having an inherent viscosity of at least 0.1 dl/g (measured at 25.degree. C. on a 0.5% by weight solution in N-methylpyrrolidone) and containing at least 50 mol % of structural units of the formula I ##STR1## in which m and p independently of one another are integers from 0 to 4, n is an integer from 0 to 3, R.sup.1 and R.sup.2 independently of one another are C.sub.1 -C.sub.6 -alkyl or C.sub.1 -C.sub.6 -alkoxy and R.sup.3 is a divalent radical of an aromatic diamine which is substituted in at least one ortho-position relative to at least one N atom by alkyl, alkoxy, alkoxyalkyl, cycloalkyl or aralkyl or in which two adjacent C atoms of the aromatic radical are substituted by alkylene, and(b) at least one aromatic polyimide which is soluble in organic solvents and photocrosslinkable and which contains at least 50 mol %, relative to the total quantity of diamine units, of radicals R.sup.3 and at least 50 mol %, relative to the total quantity of aromatic tetracarboxylic acid units, of tetravalent aromatic tetracarboxylic acid radicals including at least one benzophenone unit.The polyimide mixtures are distinguished by good adhesion to various substrates and have a high photosensitivity. They can be used for the production of protective coatings and relief structures and are particularly suitable for the production of etch masks.

    摘要翻译: 本发明涉及包含(a)至少一种具有至少0.1dl / g的特性粘度的聚酰亚胺(在25℃下在0.5重量%N-甲基吡咯烷酮溶液中测量)并且含有至少50mol 其中m和p彼此独立地为0至4的整数的式I的结构单元的%(I),n为0至3的整数,R 1和R 2彼此独立地为C 1 -C 6 - 烷基或C 1 -C 6 - 烷氧基,R 3是芳族二胺的二价基团,其在相对于至少一个N原子的至少一个邻位被烷基,烷氧基,烷氧基烷基,环烷基或芳烷基取代,或其中两个相邻 芳族基团的C原子被亚烷基取代,和(b)至少一种芳族聚酰亚胺,其可溶于有机溶剂并可光致交联并且相对于二胺单元的总量为至少50mol%的基团R3和 相对于总量的至少50mol% 四羧酸单元,包括至少一个二苯甲酮单元的四价芳族四羧酸基团。 聚酰亚胺混合物通过对各种基材的良好粘附性而具有高的光敏性。 它们可以用于生产保护涂层和浮雕结构,并且特别适用于生产蚀刻掩模。