公开(公告)号：US20180203353A1

公开(公告)日：2018-07-19

申请号：US15744676

申请日：2016-09-20

申请人： TORAY INDUSTRIES, INC.

发明人： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC分类号： G03F7/038 ,  C08G69/02 ,  C08G69/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/00

CPC分类号： G03F7/0387 ,  C08G69/02 ,  C08G69/40 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/16 ,  G03F7/161 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03515 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2924/0695 ,  H01L2924/3511 ,  H01L2924/014

摘要： Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

公开(公告)号：US09891527B2

公开(公告)日：2018-02-13

申请号：US14168305

申请日：2014-01-30

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Hiroki Chisaka ,  Kunihiro Noda ,  Dai Shiota

IPC分类号： G03F7/32 ,  G03F7/023 ,  G03F7/038 ,  G03F7/40

CPC分类号： G03F7/325 ,  G03F7/0233 ,  G03F7/0387 ,  G03F7/40

摘要： A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.

公开(公告)号：US20180024434A1

公开(公告)日：2018-01-25

申请号：US15616237

申请日：2017-06-07

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Katsuya TAKEMURA ,  Hiroyuki URANO ,  Masashi IIO ,  Masayoshi SAGEHASHI ,  Koji HASEGAWA

IPC分类号： G03F7/038 ,  C08G73/12 ,  C08G73/10 ,  G03F7/004 ,  G03F7/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  C07C69/80 ,  G03F7/031

CPC分类号： G03F7/0387 ,  C07C69/76 ,  C07C69/80 ,  C08G73/1007 ,  C08G73/1042 ,  C08G73/121 ,  C08G73/123 ,  C08G73/127 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/031 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40

摘要： The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2), Y1nRf)k   (2) wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); “k” represents 1, 2, or 3; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.

公开(公告)号：US20170345675A1

公开(公告)日：2017-11-30

申请号：US15681030

申请日：2017-08-18

申请人： Taiwan Semiconductor Manufacturing Company, Inc.

发明人： Yu-Hsiang Hu ,  Chung-Shi Liu ,  Hung-Jui Kou ,  Sih-Hao Liao

IPC分类号： H01L21/32 ,  H01L21/027 ,  H01L21/56 ,  G03F7/20 ,  H01L21/768 ,  H01L23/00 ,  H01L21/311 ,  H01L21/02

CPC分类号： H01L21/32 ,  G03F7/0387 ,  G03F7/039 ,  G03F7/0752 ,  G03F7/095 ,  G03F7/168 ,  G03F7/20 ,  G03F7/38 ,  H01L21/02282 ,  H01L21/0273 ,  H01L21/31127 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76802 ,  H01L21/76825 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/94 ,  H01L2924/18162

摘要： Some embodiments contemplate methods for forming a package structure and a package structure formed thereby. An embodiment method includes depositing a photosensitive dielectric layer on a support structure; forming a first layer on a surface of the photosensitive dielectric layer; exposing the photosensitive dielectric layer to radiation; and after the forming the first layer and the exposing to radiation, developing the photosensitive dielectric layer. The support structure includes an integrated circuit die. The layer has a different removal selectivity than the photosensitive dielectric layer during the developing. According to some embodiments, a thickness uniformity of the photosensitive dielectric layer after developing may be increased, and thickness loss from developing the photosensitive dielectric layer can be reduced.

公开(公告)号：US20170299965A1

公开(公告)日：2017-10-19

申请号：US15517093

申请日：2015-10-01

申请人： TORAY INDUSTRIES, INC.

发明人： Keika HASHIMOTO ,  Kazuto MIYOSHI ,  Masao TOMIKAWA

IPC分类号： G03F7/40 ,  H01L27/32 ,  G03F7/037 ,  C09D179/08 ,  G03F7/023 ,  G03F7/004 ,  H01L51/52 ,  G03F7/038

CPC分类号： G03F7/40 ,  C08L101/02 ,  C09D179/08 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/037 ,  G03F7/0387 ,  H01L21/027 ,  H01L27/3246 ,  H01L27/3258 ,  H01L29/786 ,  H01L51/529

摘要： A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

公开(公告)号：US20170298186A1

公开(公告)日：2017-10-19

申请号：US15457493

申请日：2017-03-13

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Katsuya TAKEMURA ,  Hiroyuki URANO ,  Masashi IIO ,  Masayoshi SAGEHASHI ,  Koji HASEGAWA

IPC分类号： C08G73/10 ,  G03F7/38 ,  G03F7/32 ,  G03F7/20 ,  G03F7/16 ,  G03F7/039 ,  C07C69/92 ,  G03F7/038 ,  G03F7/031 ,  G03F7/023 ,  G03F7/004 ,  G03F7/40

CPC分类号： C08G73/1039 ,  C07C69/76 ,  C07C69/92 ,  C08G73/1007 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/106 ,  C08G73/1071 ,  C08G73/123 ,  C08G73/126 ,  C09D179/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/031 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0387 ,  G03F7/0388 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2037 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40

摘要： The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2), wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; “k” represents 1 or 2; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition and usable as a base resin of a photosensitive resin composition.

公开(公告)号：US09753274B2

公开(公告)日：2017-09-05

申请号：US14892759

申请日：2015-01-08

申请人： JSR CORPORATION

发明人： Yoshinori Kinoshita ,  Toshiharu Araki ,  Kazunari Kudou

IPC分类号： G02B26/00 ,  G02F1/03 ,  G02F1/29 ,  G02F1/133 ,  G03F7/038 ,  G03F7/075 ,  G03F7/032 ,  G03F7/033 ,  G03F7/037

CPC分类号： G02B26/005 ,  G03F7/032 ,  G03F7/033 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0387 ,  G03F7/0757

摘要： The present invention relates to a display element, a photosensitive composition and an electrowetting display. The display element includes: a first electrode layer stack; a second electrode layer stack; a housing space formed between the first and second electrode layer stacks; and a partition wall compartmentalizing the housing space, wherein the housing space contains at least a polar liquid and a non-polar liquid that are immiscible with each other, a surface layer in contact with the partition wall exists on the surface of at least one of the first and second electrode layer stacks that is in contact with the housing space, and an absolute value of the difference in linear expansion coefficient between the partition wall and the surface layer is 150 ppm/K or less.

公开(公告)号：US09670321B2

公开(公告)日：2017-06-06

申请号：US14387807

申请日：2013-12-30

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Hongyan Li ,  Jiuxia Yang

IPC分类号： G02B5/20 ,  G03F7/038 ,  C08G73/10 ,  G02B1/04 ,  B29D11/00 ,  C09D179/08 ,  G03F7/00 ,  G03F7/004 ,  G02B5/00 ,  G02B5/22 ,  G02F1/1335

CPC分类号： C08G73/1067 ,  B29D11/00634 ,  C08G73/1014 ,  C08G73/105 ,  C08G73/1071 ,  C09D179/08 ,  G02B1/04 ,  G02B5/003 ,  G02B5/201 ,  G02B5/223 ,  G02F1/133514 ,  G03F7/0007 ,  G03F7/0046 ,  G03F7/0387 ,  G03F7/0388 ,  C08L33/24 ,  C08L33/10 ,  C08L25/06 ,  C08L79/08

摘要： A curable resin including 1 part by weight of dianhydride, 0.8 to 1.5 parts by weight of diamine, and 1.5 to 5 parts by weight of vinyl monomer is disclosed. A blue photoresist, a color filter, and methods of preparing the same, and a color display device are also disclosed.

公开(公告)号：US09529258B2

公开(公告)日：2016-12-27

申请号：US14758199

申请日：2013-12-25

申请人： TOKYO OHKA KOGYO CO., LTD.

发明人： Kunihiro Noda ,  Hiroki Chisaka ,  Dai Shiota ,  Kazuya Someya

IPC分类号： G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  C07D233/60 ,  C07C323/47 ,  C07D209/86 ,  C08K5/33 ,  G03F7/038 ,  C09D179/08 ,  C08G73/10 ,  C07D233/56 ,  C08K5/34

CPC分类号： G03F7/0041 ,  C07C323/47 ,  C07D209/86 ,  C07D233/56 ,  C07D233/60 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1078 ,  C08K5/33 ,  C08K5/34 ,  C09D179/08 ,  G03F7/0045 ,  G03F7/0387 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  C08K5/3445

摘要： The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.

摘要翻译： 本发明提供一种能量敏感性树脂组合物，其中使用所述组合物的聚酰亚胺薄膜或聚酰亚胺模塑制品的制造方法以及形成所述组合物的图案的方法。 该组合物即使通过在低温下进行热处理也提供具有优异的耐热性和低介电常数的聚酰亚胺树脂。 该组合物含有通过使四羧酸二酐和二胺，溶剂和通过光和/或热的作用分解并产生碱和/或酸的化合物（A）反应而获得的聚酰胺酸。 制造聚酰亚胺膜或聚酰亚胺模塑制品的方法包括形成包含该组合物的涂膜或模制品，并通过曝光或加热分解膜或产品中的化合物（A）。 顺序形成图案的方法包括成膜，选择性地曝光，显影和加热薄膜或产品。

公开(公告)号：US09488911B2

公开(公告)日：2016-11-08

申请号：US14831801

申请日：2015-08-20

申请人： FUJIFILM Corporation

发明人： Tomotaka Tsuchimura ,  Kyouhei Sakita

IPC分类号： G03F7/004 ,  G03F7/20 ,  G03F7/32 ,  G03F7/039 ,  G03F7/038 ,  C07D277/64 ,  C07D277/84 ,  C07D413/12

CPC分类号： G03F7/0045 ,  C07D277/64 ,  C07D277/84 ,  C07D413/12 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/0387 ,  G03F7/0392 ,  G03F7/0395 ,  G03F7/0397 ,  G03F7/20 ,  G03F7/2059 ,  G03F7/32 ,  G03F7/322 ,  G03F7/325

摘要： There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein, and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.